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HSC3953S EPITAXIAL PLANAR TRANSISTOR Description High-d
Top Searches for this datasheetSpec. HE6502 Issued Date 1992.08.25 Revised Date 2001.01.01 Page HSC3953S EPITAXIAL PLANAR TRANSISTOR Description High-definition display video output, wide-band amplifier applications. Features High fT=500MHz High breakdown voltage: VCEO=120V Small reverse transfer capacitance Absolute Maximum Ratings Maximum Temperatures Storage Temperature +150 Junction Temperature Maximum Maximum Power Dissipation Total Power Dissipation (Ta=25°C) Maximum Voltages Currents (Ta=25°C) VCBO Collector Base Voltage VCEO Collector Emitter Voltage VEBO Emitter Base Voltage Collector Current Peak Collector Current Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 Min. Typ. Max. Unit Test Conditions IC=10uA, IE=0 IC=1mA, IB=0 IE=100uA, IC=0 VCB=80V, IE=0 VEB=2V, IC=0 IC=30mA, IB=3mA IC=30mA, IB=3mA VCE=10V, IC=10mA VCE=10V, IC=100mA VCE=10V, IC=50mA, IE=0, VCB=30V, f=1MHZ *Pulse Test Pulse Width 380us, Duty Cycle2% Classification hFE1 Rank Range 60-120 100-200 160-320 HSMC Product Specification Characteristics Curve Current Gain Collector Current 1000 1000 Spec. HE6502 Issued Date 1992.08.25 Revised Date 2001.01.01 Page Saturation Voltage Collector Current Saturation Voltage (mV) VCE=10V VCE(sat) IC=10IB 1000 1000 Collector Current (mA) Collector Current (mA) Saturation Voltage Collector Current 1000 Output Capacitance Reverse-Biased Voltage VBE(sat) IC=10IB Saturation Voltage (mV) Capacitance (Pf) 1000 Collector Current (mA) Reverse-Biased Voltage Safe Operating Area 1000 1000 PT=1ms PT=100ms Power Derating Power Dissipation-PD(mW) Collector Current PT=1s 1000 Forward Voltage Ambient Temperature-Ta( HSMC Product Specification TO-92 Dimension Spec. HE6502 Issued Date 1992.08.25 Revised Date 2001.01.01 Page Marking HSMC Logo Part Number Date Code Rank Product Series Laser Mark HSMC Logo Product Series Part Number Mark Style 1.Emitter 2.Collector 3.Base 3-Lead TO-92 Plastic Package HSMC Package Code *:Typical Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 Notes 1.Dimension tolerance based Spec. dated Apr. 25,1996. 2.Controlling dimension millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office. Material Lead Alloy solder plating Mold Compound Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance. Head Office Factory Head Office (Hi-Sincerity Microelectronics Corp.) 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. 886-2-25212056 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5983621~5 886-3-5982931 Factory 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5977061 886-3-5979220 HSMC Product Specification Other recent searchesMXP7001 - MXP7001 MXP7001 Datasheet CP214 - CP214 CP214 Datasheet CDLE-033-839 - CDLE-033-839 CDLE-033-839 Datasheet NO339-1SRUGW - NO339-1SRUGW NO339-1SRUGW Datasheet 2SC4964 - 2SC4964 2SC4964 Datasheet
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