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HSC3953S EPITAXIAL PLANAR TRANSISTOR Description High-d


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Spec. HE6502 Issued Date 1992.08.25 Revised Date 2001.01.01 Page
HSC3953S
EPITAXIAL PLANAR TRANSISTOR
Description
High-definition display video output, wide-band amplifier applications.
Features
High fT=500MHz High breakdown voltage: VCEO=120V Small reverse transfer capacitance
Absolute Maximum Ratings
Maximum Temperatures Storage Temperature +150 Junction Temperature Maximum Maximum Power Dissipation Total Power Dissipation (Ta=25°C) Maximum Voltages Currents (Ta=25°C) VCBO Collector Base Voltage VCEO Collector Emitter Voltage VEBO Emitter Base Voltage Collector Current Peak Collector Current
Characteristics (Ta=25°C)
Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 Min. Typ. Max. Unit Test Conditions IC=10uA, IE=0 IC=1mA, IB=0 IE=100uA, IC=0 VCB=80V, IE=0 VEB=2V, IC=0 IC=30mA, IB=3mA IC=30mA, IB=3mA VCE=10V, IC=10mA VCE=10V, IC=100mA VCE=10V, IC=50mA, IE=0, VCB=30V, f=1MHZ
*Pulse Test Pulse Width 380us, Duty Cycle2%
Classification hFE1
Rank Range 60-120 100-200 160-320
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
1000 1000
Spec. HE6502 Issued Date 1992.08.25 Revised Date 2001.01.01 Page
Saturation Voltage Collector Current
Saturation Voltage (mV)
VCE=10V
VCE(sat) IC=10IB
1000
1000
Collector Current (mA)
Collector Current (mA)
Saturation Voltage Collector Current
1000
Output Capacitance Reverse-Biased Voltage
VBE(sat) IC=10IB
Saturation Voltage (mV)
Capacitance (Pf)
1000
Collector Current (mA)
Reverse-Biased Voltage
Safe Operating Area
1000 1000 PT=1ms PT=100ms
Power Derating
Power Dissipation-PD(mW)
Collector Current
PT=1s
1000
Forward Voltage
Ambient Temperature-Ta(
HSMC Product Specification
TO-92 Dimension
Spec. HE6502 Issued Date 1992.08.25 Revised Date 2001.01.01 Page
Marking
HSMC Logo Part Number Date Code Rank Product Series
Laser Mark
HSMC Logo Product Series
Part Number
Mark Style 1.Emitter 2.Collector 3.Base
3-Lead TO-92 Plastic Package HSMC Package Code
*:Typical
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27
Notes 1.Dimension tolerance based Spec. dated Apr. 25,1996.
2.Controlling dimension millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material
Lead Alloy solder plating Mold Compound Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory
Head Office (Hi-Sincerity Microelectronics Corp.) 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. 886-2-25212056 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5983621~5 886-3-5982931 Factory 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5977061 886-3-5979220
HSMC Product Specification

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