HSC3953 EPITAXIAL PLANAR TRANSISTOR Description High-de
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Spec. HE6602 Issued Date 1993.03.15 Revised Date 2001.01.01 Page
HSC3953
EPITAXIAL PLANAR TRANSISTOR
Description
High-definition display video output, wide-band amplifier.
Features
High 500MHz High Breakdown Voltage: BVCEO=120Vmin Small Reverse Transfer Capacitance Excellent Response: Cre=1.7pF
Absolute Maximum Ratings (Ta=25°C)
Maximum Temperatures Storage Temperature +150 Junction Temperature +150 Maximum Maximum Power Dissipation Total Power Dissipation (Ta=25°C). Total Power Dissipation (Tc=25°C) Maximum Voltages Currents BVCBO Collector Base Voltage BVCEO Collector Emitter Voltage. BVEBO Emitter Base Voltage Collector Current Peak Collector Current.
Electrical Characteristics (Ta=25°C)
Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 Min. Typ. Max. Unit Test Conditions IC=100uA, IE=0 IC=1mA, IB=0 IE=100uA, IC=0 VCB=120V, IE=0 VEB=2V IC=30mA, IB=3mA IC=30mA, IB=3mA IC=10mA, VCE=10V IC=100mA, VCE=10V IC=50mA VCE=10V
*Pulse Test Pulse Width 380us, Duty Cycle2%
Classification hFE1
Rank Range 60-120 100-200 160-320
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
1000 1000
Spec. HE6602 Issued Date 1993.03.15 Revised Date 2001.01.01 Page
Saturation Voltage Collector Current
Saturation Voltage (mV)
VCE=10
VCE(sat) IC=10IB
1000
1000
Collector Current (mA)
Collector Current (mA)
Saturation Voltage Collector Current
1000
Output Capacitance Reverse-Biased Voltage
Saturation Voltage (mV)
VBE(sat) IC=10IB
Capacitance (Pf)
1000
Collector Current (mA)
Reverse-Biased Voltage
Safe Operating Area
1000
Collector Current
PT=1ms PT=100ms PT=1s
1000
Forward Voltage
HSMC Product Specification
TO-126ML Dimension
Marking
Spec. HE6602 Issued Date 1993.03.15 Revised Date 2001.01.01 Page
HSMC Logo Part Number Date Code
Product Series Rank
Marking
Style 1.Emitter 2.Collector 3.Base
3-Lead TO-126ML Plastic Package HSMC Package Code *:Typical
Inches Min. Max. 0.1356 0.1457 0.0170 0.0272 0.0344 0.0444 0.0501 0.0601 0.1131 0.1231 0.0737 0.0837 0.0294 0.0494 0.0462 0.0562
Millimeters Min. Max. 3.44 3.70 0.43 0.69 0.87 1.12 1.27 1.52 2.87 3.12 1.87 2.12 0.74 1.25 1.17 1.42
Inches Min. Max. *0.1795 0.0268 0.0331 0.5512 0.5906 0.2903 0.3003 0.1378 0.1478 0.1525 0.1625 0.0740 0.0842
Millimeters Min. Max. *4.56 0.68 0.84 14.00 15.00 7.37 7.62 3.50 3.75 3.87 4.12 1.88 2.14
Notes 1.Dimension tolerance based Spec. dated Mar. 6,1995.
2.Controlling dimension millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material
Lead Alloy solder plating Mold Compound Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory
Head Office (Hi-Sincerity Microelectronics Corp.) 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. 886-2-25212056 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5983621~5 886-3-5982931 Factory 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5977061 886-3-5979220 HSMC Product Specification
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