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HSC2240 EPITAXIAL PLANAR TRANSISTOR Description noise a
Top Searches for this datasheetSpec. HE6529 Issued Date 1992.12.16 Revised Date 2002.10.09 Page HSC2240 EPITAXIAL PLANAR TRANSISTOR Description noise audio amplifier applications Absolute Maximum Ratings TO-92 Maximum Temperatures Storage Temperature +150 Junction Temperature Maximum Maximum Power Dissipation Total Power Dissipation (Ta=25°C) Maximum Voltages Currents (Ta=25°C) VCBO Collector Base Voltage VCEO Collector Emitter Voltage BVEBO Emitter Base Voltage. Collector Current Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) VBE(on) *hFE Min. Typ. Max. Unit Test Conditions IC=100uA, IE=0 IC=1mA, IB=0 IE=10uA, IC=0 VCB=120V, IE=0 VEB=5V, IC=0 IB=1mA, IC=10mA IC=2mA, VCE=6V VCE=6V, IC=2mA VCE=6V, IC=1mA, f=100MHz VCB=10V, f=1MHz *Pulse Test: Pulse Width 380us, Duty Cycle2% Classification Rank Range 120-240 200-400 HSC2240 HSMC Product Specification Characteristics Curve Current Gain Collector Current 1000 Spec. HE6529 Issued Date 1992.12.16 Revised Date 2002.10.09 Page Saturation Voltage Collector Current 1000 Saturation Voltage (mV) VCE=6V VCE(sat) IC=10IB 1000 1000 Collector Current-IC (mA) Collector Current-IC (mA) Voltage Collector Current 1000 Cutoff Frequency 1000 Cutoff Frequency (MHz). Voltage (mV) VCE=6V VBE(ON) VCE=6V 1000 1000 Collector Current-IC (mA) Collector Current (mA) Capacitance Reverse-Biased Voltage 10000 PT=1ms PT=100ms Safe Operating Area Collector Current-IC (mA) 1000 PT=1s Capacitance (pF) 1000 1000 Reverse Biased Voltage Forward Voltage-V HSC2240 HSMC Product Specification Spec. HE6529 Issued Date 1992.12.16 Revised Date 2002.10.09 Page PD-Ta Power Dissipation-PD (mW) Ambient Temperature-Ta HSC2240 HSMC Product Specification TO-92 Dimension Date Code Spec. HE6529 Issued Date 1992.12.16 Revised Date 2002.10.09 Page Marking: Rank Control Code Style: 1.Emitter 2.Collector 3.Base 3-Lead TO-92 Plastic Package HSMC Package Code: Typical Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 Notes: 1.Dimension tolerance based Spec. dated Apr. 25,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office. Material: Lead: Alloy; solder plating Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance. Head Office Factory: Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HSC2240 HSMC Product Specification Other recent searchesSSM3K102TU - SSM3K102TU SSM3K102TU Datasheet QB-64GB-YQ-01T - QB-64GB-YQ-01T QB-64GB-YQ-01T Datasheet LM4904 - LM4904 LM4904 Datasheet LG1237 - LG1237 LG1237 Datasheet ISL6224 - ISL6224 ISL6224 Datasheet FTLX1471D3BCL - FTLX1471D3BCL FTLX1471D3BCL Datasheet FN3109 - FN3109 FN3109 Datasheet FM24C256 - FM24C256 FM24C256 Datasheet CRO3437A-LF - CRO3437A-LF CRO3437A-LF Datasheet CLD160 - CLD160 CLD160 Datasheet
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