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HSC2228Y EPITAXIAL PLANAR TRANSISTOR Description HSC222


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Spec. HE6527-B Issued Date 1993.01.15 Revised Date 2000.10.01 Page
HSC2228Y
EPITAXIAL PLANAR TRANSISTOR
Description
HSC2228Y designed high voltage amplifier applications.
Absolute Maximum Ratings
Maximum Temperatures Storage Temperature +150 Junction Temperature Maximum Maximum Power Dissipation Total Power Dissipation (Ta=25°C) Maximum Voltages Currents (Ta=25°C) VCBO Collector Base Voltage VCEO Collector Emitter Voltage VEBO Emitter Base Voltage Collector Current
Characteristics (Ta=25°C)
Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE Min. Typ. Max. Unit Test Conditions IC=100uA, IE=0 IC=1mA, IB=0 IE=10uA, IC=0 VCB=160V, IE=0 VEB=5V IC=2mA, IB=20mA IC=2mA, IB=20mA VCE=10V, IC=10mA VCE=30V, IC=10mA VCB=10V, f=1MHZ
*Pulse Test Pulse Width 380us, Duty Cycle2%
Classification
Rank Range 60-120 100-200 160-320
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
1000 10000
Spec. HE6527-B Issued Date 1993.01.15 Revised Date 2000.10.01 Page
Saturation Voltage Collector Current
Saturation Voltage (mV)
1000 VBE(sat) IC=10IB
VCE=10V
VCE(sat) IC=10IB 1000 1000
Collector Current (mA)
Collector Current (mA)
Capacitance Reverse-Biased Voltage
1000
Cutoff Frequency
Cutoff Frequency (MHz)
Capacitance (pF)
VCE=30V
1000
1000
Reverse Biased Voltage
Collector Current (mA)
Safe Operating Area
10000 PT=1ms PT=100ms 1000
Power Derating
Collector Current-IC (mA)
1000 PT=1s
Power Dissipation-PD(mW)
1000
Forward Voltage-VCE
Ambient Temperature-Ta(
HSMC Product Specification
TO-92 Dimension
Spec. HE6527-B Issued Date 1993.01.15 Revised Date 2000.10.01 Page
Marking
HSMC Logo Part Number Date Code Rank Product Series
Laser Mark
HSMC Logo Product Series
Part Number
Mark Style 1.Emitter 2.Collector 3.Base
3-Lead TO-92 Plastic Package HSMC Package Code
*:Typical
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27
Notes 1.Dimension tolerance based Spec. dated Apr. 25,1996.
2.Controlling dimension millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material
Lead Alloy solder plating Mold Compound Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory
Head Office (Hi-Sincerity Microelectronics Corp.) 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. 886-2-25212056 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5983621~5 886-3-5982931 Factory 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5977061 886-3-5979220
HSMC Product Specification

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