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HSC2228Y EPITAXIAL PLANAR TRANSISTOR Description HSC222
Top Searches for this datasheetSpec. HE6527-B Issued Date 1993.01.15 Revised Date 2000.10.01 Page HSC2228Y EPITAXIAL PLANAR TRANSISTOR Description HSC2228Y designed high voltage amplifier applications. Absolute Maximum Ratings Maximum Temperatures Storage Temperature +150 Junction Temperature Maximum Maximum Power Dissipation Total Power Dissipation (Ta=25°C) Maximum Voltages Currents (Ta=25°C) VCBO Collector Base Voltage VCEO Collector Emitter Voltage VEBO Emitter Base Voltage Collector Current Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE Min. Typ. Max. Unit Test Conditions IC=100uA, IE=0 IC=1mA, IB=0 IE=10uA, IC=0 VCB=160V, IE=0 VEB=5V IC=2mA, IB=20mA IC=2mA, IB=20mA VCE=10V, IC=10mA VCE=30V, IC=10mA VCB=10V, f=1MHZ *Pulse Test Pulse Width 380us, Duty Cycle2% Classification Rank Range 60-120 100-200 160-320 HSMC Product Specification Characteristics Curve Current Gain Collector Current 1000 10000 Spec. HE6527-B Issued Date 1993.01.15 Revised Date 2000.10.01 Page Saturation Voltage Collector Current Saturation Voltage (mV) 1000 VBE(sat) IC=10IB VCE=10V VCE(sat) IC=10IB 1000 1000 Collector Current (mA) Collector Current (mA) Capacitance Reverse-Biased Voltage 1000 Cutoff Frequency Cutoff Frequency (MHz) Capacitance (pF) VCE=30V 1000 1000 Reverse Biased Voltage Collector Current (mA) Safe Operating Area 10000 PT=1ms PT=100ms 1000 Power Derating Collector Current-IC (mA) 1000 PT=1s Power Dissipation-PD(mW) 1000 Forward Voltage-VCE Ambient Temperature-Ta( HSMC Product Specification TO-92 Dimension Spec. HE6527-B Issued Date 1993.01.15 Revised Date 2000.10.01 Page Marking HSMC Logo Part Number Date Code Rank Product Series Laser Mark HSMC Logo Product Series Part Number Mark Style 1.Emitter 2.Collector 3.Base 3-Lead TO-92 Plastic Package HSMC Package Code *:Typical Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 Notes 1.Dimension tolerance based Spec. dated Apr. 25,1996. 2.Controlling dimension millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office. Material Lead Alloy solder plating Mold Compound Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance. Head Office Factory Head Office (Hi-Sincerity Microelectronics Corp.) 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. 886-2-25212056 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5983621~5 886-3-5982931 Factory 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5977061 886-3-5979220 HSMC Product Specification Other recent searchesZSD100 - ZSD100 ZSD100 Datasheet SUR545J - SUR545J SUR545J Datasheet Si9803DY - Si9803DY Si9803DY Datasheet MK05-1A66E-500W - MK05-1A66E-500W MK05-1A66E-500W Datasheet ELL5PS - ELL5PS ELL5PS Datasheet CD4512BMS - CD4512BMS CD4512BMS Datasheet 2SA1723 - 2SA1723 2SA1723 Datasheet
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