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HSB764 EPITAXIAL PLANAR TRANSISTOR Description Voltage
Top Searches for this datasheetSpec. HE6549-B Issued Date 1996.11.25 Revised Date 2000.10.01 Page HSB764 EPITAXIAL PLANAR TRANSISTOR Description Voltage regulator, Relay driver, electrical equipment application. Absolute Maximum Ratings Maximum Temperatures Storage Temperature +150 Junction Temperature +150 Maximum Maximum Power Dissipation Total Power Dissipation (Ta=25°C) Maximum Voltages Currents (Ta=25°C) VCBO Collector Base Voltage VCEO Collector Emitter Voltage VEBO Emitter Base Voltage Collector Current Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 Min. Typ. Max. Unit Test Conditions IC=-100uA, IE=0 IC=-1mA, IB=0 IE=-10uA, IC=0 VCB=-50V, IE=0 VEB=-4V, IC=0 IC=-500mA, IB=-50mA IC=-500mA, IB=-50mA VCE=-2V, IC=-50mA VCE=-2V, IC=-1A VCE=-10V, IC=-50mA VCB=-10V, IE=0, f=1MHz -700 -1.2 *Pulse Test Pulse Width 380us, Duty Cycle2% Classification hFE1 Rank Range 60-120 100-200 160-320 HSMC Product Specification Characteristics Curve Current Gain Collector Current 1000 1000 Spec. HE6549-B Issued Date 1996.11.25 Revised Date 2000.10.01 Page Saturation Voltage Collector Current VCE=2V Saturation Voltage (mV) VCE(sat) IC=10IB 1000 1000 Collector Current (mA) Collector Current (mA) Saturation Voltage Collector Current 10000 1000 Cutoff Frequency Saturation Voltage (mV) Cutoff Frequency (MHz) 1000 VBE(sat) IC=10IB 1000 1000 Collector Current (mA) Collector Current (mA) Capacitance Reverse-Biased Voltage Safe Operating Area PT=1ms Collector Current PT=100ms PT=1s Capacitance (Pf) Reverse Biased Voltage 0.01 Forward Voltage HSMC Product Specification Spec. HE6549-B Issued Date 1996.11.25 Revised Date 2000.10.01 Page Power Derating 1000 Power Dissipation-PD(mW) Ambient Temperature-Ta( HSMC Product Specification TO-92 Dimension Spec. HE6549-B Issued Date 1996.11.25 Revised Date 2000.10.01 Page Marking HSMC Logo Part Number Date Code Rank Product Series Laser Mark HSMC Logo Product Series Part Number Mark Style 1.Emitter 2.Collector 3.Base 3-Lead TO-92 Plastic Package HSMC Package Code *:Typical Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 Notes 1.Dimension tolerance based Spec. dated Apr. 25,1996. 2.Controlling dimension millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office. Material Lead Alloy solder plating Mold Compound Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance. Head Office Factory Head Office (Hi-Sincerity Microelectronics Corp.) 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. 886-2-25212056 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5983621~5 886-3-5982931 Factory 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5977061 886-3-5979220 HSMC Product Specification Other recent searchesSi4874BDY - Si4874BDY Si4874BDY Datasheet RVA-2500 - RVA-2500 RVA-2500 Datasheet MC-4R64FKE8D - MC-4R64FKE8D MC-4R64FKE8D Datasheet ICS85310I-11 - ICS85310I-11 ICS85310I-11 Datasheet ICS840004I - ICS840004I ICS840004I Datasheet HA0210T - HA0210T HA0210T Datasheet COP888CG - COP888CG COP888CG Datasheet ATF22V10B - ATF22V10B ATF22V10B Datasheet ATF22V10BQ - ATF22V10BQ ATF22V10BQ Datasheet ATF22V10BQL - ATF22V10BQL ATF22V10BQL Datasheet
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