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HSMA400X Series 1.0AMP. SURFACE MOUNT RECTIFIERS Features
Top Searches for this datasheetSpec. Preliminary Data Issued Date 2000.04.15 Revised Date 2000.04.20 Page HSMA400X Series 1.0AMP. SURFACE MOUNT RECTIFIERS Features surface mounted application forward voltage drop High current capability Easy pick place High surge current capability Plastic material used carries Underwriters Laboratory Classification 94V-0 High temperature soldering: 250°C/10 seconds terminals Mechanical Data Case: SMA/DO-214AC Molded Plastic. Terminals: Solder plated. Polarity: Indicated cathode band. Packaging: 12mm tape RS-481. Weight: 0.064 gram. Maximum Ratings Electrical Characteristics Rating 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive inductive load. capacitive load, derate current 20%. HSMA HSMA HSMA HSMA HSMA HSMA HSMA Type Number Units 4001 4002 4003 4004 4005 4006 4007 Maximum Recurrent Peak Reverse Voltage 1000 Maximum Voltage Maximum Blocking Voltage 1000 Maximum Average Forward Rectified Current @TL=110°C Peak Forward Surge Current, 8.3ms Single Half Sine-wave Superimposed Rated Load(JEDEC method) Maximum Instantaneous Forward Voltage 1.0A 5(@Ta=25°C) Maximum Reverse Current Rated Blocking Voltage 50(@Ta=125°C) Maximum Reverse Recovery Time (Note Typical Junction Capacitance (Note Operating Temperature Range +150 Storage Temperature Range Tstg +150 Note1: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A Note2: Measured Applied VR=4.0Volts HSMC Product Specification Characteristics Curve Spec. Preliminary Data Issued Date 2000.04.15 Revised Date 2000.04.20 Page HSMC Product Specification SMA/DO-214AC Dimension Spec. Preliminary Data Issued Date 2000.04.15 Revised Date 2000.04.20 Page *:Typical Inches Min. Max. 0.5000 0.0642 0.0901 0.1150 0.1575 0.1811 0.0783 0.1028 Millimeters Min. Max. 1.27 1.63 2.29 2.92 4.00 4.60 1.99 2.61 Inches Min. Max. 0.0299 0.0598 0.0039 0.0079 0.1890 0.2201 0.0059 0.0122 Millimeters Min. Max. 0.76 1.52 0.10 0.20 4.80 5.59 0.15 0.31 Notes 1.Dimension tolerance based Spec. dated Mar. 6,1995. 2.Controlling dimension millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office. Material Lead Alloy solder plating Mold Compound Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance. Head Office Factory Head Office (Hi-Sincerity Microelectronics Corp.) 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. 886-2-25212056 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5983621~5 886-3-5982931 Factory 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5977061 886-3-5979220 HSMC Product Specification Other recent searchesTRSL-93120F - TRSL-93120F TRSL-93120F Datasheet NTE9602 - NTE9602 NTE9602 Datasheet MMBD3004S - MMBD3004S MMBD3004S Datasheet GT3528 - GT3528 GT3528 Datasheet X2C-BXXXXXXXXX - X2C-BXXXXXXXXX X2C-BXXXXXXXXX Datasheet FH166911 - FH166911 FH166911 Datasheet 1665070000 - 1665070000 1665070000 Datasheet
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