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HI6718 EPITAXIAL PLANAR TRANSISTOR Description HI6718 d
Top Searches for this datasheetSpec. HE9008-A Issued Date 1998.04.10 Revised Date 2000.11.01 Page HI6718 EPITAXIAL PLANAR TRANSISTOR Description HI6718 designed general purpose medium power amplifier switching. Features High power: 1.2W High current: Absolute Maximum Ratings (Ta=25°C) Maximum Temperatures Storage Temperature +150 Junction Temperature +150 Maximum Power Dissipation Total Power Dissipation (Tc=25°C) Maximum Voltages Currents BVCBO Collector Base Voltage BVCEO Collector Emitter Voltage. BVEBO Emitter Base Voltage Collector Current Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO *VCE(sat) *hFE1 *hFE2 *hFE3 Min. Typ. Max. Unit Test Conditions IC=100uA IC=1mA IC=10uA VCB=80V IC=350mA, IB=35mA VCE=1V, IC=50mA VCE=1V, IC=250mA VCE=1V, IC=500mA VCE=10V, IC=50mA, f=100MHz VCB=10V, f=1MHz *Pulse Test Pulse Width 380us, Duty Cycle2% HSMC Product Specification TO-251 Dimension Marking HSMC Logo Spec. HE9008-A Issued Date 1998.04.10 Revised Date 2000.11.01 Page Product Series Rank Part Number Date Code Mark Style 1.Base 2.Collector 3.Emitter 3-Lead TO-251 Plastic Package HSMC Package Code *:Typical Inches Min. Max. 0.0177 0.0217 0.0354 0.0591 0.0177 0.0236 0.0866 0.0945 0.2520 0.2677 0.2677 0.2835 Millimeters Min. Max. 0.45 0.55 0.90 1.50 0.45 0.60 2.20 2.40 6.40 6.80 6.80 7.20 Inches Min. Max. 0.2559 *0.1811 0.0354 0.0315 0.2047 0.2165 Millimeters Min. Max. 6.50 *4.60 0.90 0.80 5.20 5.50 Notes 1.Dimension tolerance based Spec. dated May. 24,1995. 2.Controlling dimension millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office. Material Lead Alloy solder plating Mold Compound Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance. Head Office Factory Head Office (Hi-Sincerity Microelectronics Corp.) 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. 886-2-25212056 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5983621~5 886-3-5982931 Factory 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5977061 886-3-5979220 HSMC Product Specification Other recent searchesUPC2709T - UPC2709T UPC2709T Datasheet UPC2712T - UPC2712T UPC2712T Datasheet SMU11A - SMU11A SMU11A Datasheet SMU16A - SMU16A SMU16A Datasheet SC-70 - SC-70 SC-70 Datasheet SOT-323 - SOT-323 SOT-323 Datasheet RS1A - RS1A RS1A Datasheet RS1M - RS1M RS1M Datasheet CER0003A - CER0003A CER0003A Datasheet AVR034 - AVR034 AVR034 Datasheet
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