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HI6718 EPITAXIAL PLANAR TRANSISTOR Description HI6718 d


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Spec. HE9008-A Issued Date 1998.04.10 Revised Date 2000.11.01 Page
HI6718
EPITAXIAL PLANAR TRANSISTOR
Description
HI6718 designed general purpose medium power amplifier switching.
Features
High power: 1.2W High current:
Absolute Maximum Ratings (Ta=25°C)
Maximum Temperatures Storage Temperature +150 Junction Temperature +150 Maximum Power Dissipation Total Power Dissipation (Tc=25°C) Maximum Voltages Currents BVCBO Collector Base Voltage BVCEO Collector Emitter Voltage. BVEBO Emitter Base Voltage Collector Current
Characteristics (Ta=25°C)
Symbol BVCBO BVCEO BVEBO ICBO *VCE(sat) *hFE1 *hFE2 *hFE3 Min. Typ. Max. Unit Test Conditions IC=100uA IC=1mA IC=10uA VCB=80V IC=350mA, IB=35mA VCE=1V, IC=50mA VCE=1V, IC=250mA VCE=1V, IC=500mA VCE=10V, IC=50mA, f=100MHz VCB=10V, f=1MHz
*Pulse Test Pulse Width 380us, Duty Cycle2%
HSMC Product Specification
TO-251 Dimension
Marking
HSMC Logo
Spec. HE9008-A Issued Date 1998.04.10 Revised Date 2000.11.01 Page
Product Series Rank
Part Number Date Code
Mark
Style 1.Base 2.Collector 3.Emitter
3-Lead TO-251 Plastic Package HSMC Package Code *:Typical
Inches Min. Max. 0.0177 0.0217 0.0354 0.0591 0.0177 0.0236 0.0866 0.0945 0.2520 0.2677 0.2677 0.2835
Millimeters Min. Max. 0.45 0.55 0.90 1.50 0.45 0.60 2.20 2.40 6.40 6.80 6.80 7.20
Inches Min. Max. 0.2559 *0.1811 0.0354 0.0315 0.2047 0.2165
Millimeters Min. Max. 6.50 *4.60 0.90 0.80 5.20 5.50
Notes 1.Dimension tolerance based Spec. dated May. 24,1995.
2.Controlling dimension millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material
Lead Alloy solder plating Mold Compound Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory
Head Office (Hi-Sincerity Microelectronics Corp.) 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. 886-2-25212056 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5983621~5 886-3-5982931 Factory 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5977061 886-3-5979220
HSMC Product Specification

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