HD122 EPITAXIAL SILICON DARLINGTON TRANSISTOR Description
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Spec. HD200101 Issued Date 1998.12.01 Revised Date 2003.03.10 Page
HD122
EPITAXIAL SILICON DARLINGTON TRANSISTOR
Description
HD122 designed medium power linear switching applications.
Absolute Maximum Ratings (Ta=25°C)
TO-126ML
Maximum Temperatures Storage Temperature +150 Junction Temperature +150 Maximum Maximum Power Dissipation Total Power Dissipation (Tc=25°C) Maximum Voltages Currents BVCBO Collector Base Voltage. BVCEO Collector Emitter Voltage. BVEBO Emitter Base Voltage. Collector Current. Collector Current (Pulse)
Electrical Characteristics (Ta=25°C)
Symbol BVCBO *BVCEO BVEBO ICEO ICBO IEBO *VCE(sat)1 *VCE(sat)2 *VBE(on) *hFE1 *hFE2 Min. 1000 1000 Typ. Max. Unit Test Conditions IC=1mA IC=100mA IE=100uA VCE=50V VCB=100V VBE=5V IC=1.5A, IB=30mA IC=2A, IB=40mA IC=3A, VCE=3V IC=0.5A, VCE=3V IC=3A, VCE=3V
*Pulse Test: Pulse Width 380us, Duty Cycle2%
HD122
HSMC Product Specification
Characteristics Curve
Collector Gain Collector Current
10000 10000
Spec. HD200101 Issued Date 1998.12.01 Revised Date 2003.03.10 Page
Sturation Voltage Collector Current
25°C VCE=4V -40°C VCE=4V
Sturation Voltage (mV)
1000
-40°C VCE(s IC=100IB 1000 25°C VCE(s IC=100IB
1000 10000
1000 10000
Collector Current-IC (mA)
Collector Current-IC (mA)
Sturation Voltage Collector Current
10000 10000
Voltage Collector Current
Sturation Voltage (mV)
-40°C VBE(sat) IC=100IB
1000
25°C VBE(s IC=100IB
Voltage (mV)
-40°C VBE(on) VCE=4V
1000
25°C VBE(on) VCE=4V
1000 10000
1000 10000
Collector Current-IC (mA)
Collector Current-IC (mA)
Switching Time Collector Current
VCC=30V, IC=250, IB1= -250IB2 1000
Capacitance Reverse-Biased Voltage
Switching Times (us)
Tstg
Capacitance (pF)
Collector Current-IC
Reverse-Biased Voltage
HD122
HSMC Product Specification
Spec. HD200101 Issued Date 1998.12.01 Revised Date 2003.03.10 Page
Safe Operating Area
100000 PT=1ms
Power Derating
PD/PD(max) Normalized Power Dissipation
10000
Collector Current-IC (mA)
PT=100ms 1000 PT=1s
Forward-VCE
Temperature (°C) Ta/Tc
HD122
HSMC Product Specification
TO-126ML Dimension
Marking:
Spec. HD200101 Issued Date 1998.12.01 Revised Date 2003.03.10 Page
Date Code
Control Code
Style: 1.Emitter 2.Collector 3.Base
3-Lead TO-126ML Plastic Package HSMC Package Code: Typical
Inches Min. Max. 0.1356 0.1457 0.0170 0.0272 0.0344 0.0444 0.0501 0.0601 0.1131 0.1231 0.0737 0.0837 0.0294 0.0494 0.0462 0.0562
Millimeters Min. Max. 3.44 3.70 0.43 0.69 0.87 1.12 1.27 1.52 2.87 3.12 1.87 2.12 0.74 1.25 1.17 1.42
Inches Min. Max. *0.1795 0.0268 0.0331 0.5512 0.5906 0.2903 0.3003 0.1378 0.1478 0.1525 0.1625 0.0740 0.0842
Millimeters Min. Max. *4.56 0.68 0.84 14.00 15.00 7.37 7.62 3.50 3.75 3.87 4.12 1.88 2.14
Notes: 1.Dimension tolerance based Spec. dated Mar. 6,1995.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material:
Lead: Alloy solder plating Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HD122
HSMC Product Specification
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