HI122 EPITAXIAL PLANAR TRANSISTOR Description HI122 des

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HI122 EPITAXIAL PLANAR TRANSISTOR Description HI122 des

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Spec. HI200102 Issued Date 1998.07.01 Revised Date 2003.04.14 Page
HI122
EPITAXIAL PLANAR TRANSISTOR
Description
HI122 designed general purpose speed switching applications.
TO-251 Darlington Schematic
Features
High current gain Bult-in damper diode
Absolute Maximum Ratings (Ta=25°C)
Maximum Temperatures Storage Temperature -55~+150°C Junction Temperature .+150°C Maximum Power Dissipation Total Power Dissipation (Tc=25°C). Maximum Voltages Currents BVCBO Collector Base Voltage .100 BVCEO Collector Emitter Voltage .100 BVEBO Emitter Base Voltage Collector Current
Characteristics (Ta=25°C)
Symbol BVCBO BVEBO ICBO ICEO IEBO *VCE(sat)1 *VCE(sat)2 *VBE(sat) *VBE(on) *hFE1 *hFE2 Min. Typ. Max. Unit Test Conditions IC=1mA IE=1mA VCB=100V VCE=100V VEB=5V IC=4A, IB=16mA IC=8A, IB=80mA IC=8A, IB=80mA VCE=4V, IC=4A VCE=4V, IC=4A VCE=4V, IC=8A VCB=10V, f=1MHz
*Pulse Test Pulse Width 380us, Duty Cycle2%
HI122
HSMC Product Specification
TO-251 Dimension
Marking:
Spec. HI200102 Issued Date 1998.07.01 Revised Date 2003.04.14 Page
Date Code
Control Code
Style: 1.Base 2.Collector 3.Emitter
3-Lead TO-251 Plastic Package HSMC Package Code: Typical
Inches Min. Max. 0.0177 0.0217 0.0354 0.0591 0.0177 0.0236 0.0866 0.0945 0.2520 0.2677 0.2677 0.2835
Millimeters Min. Max. 0.45 0.55 0.90 1.50 0.45 0.60 2.20 2.40 6.40 6.80 6.80 7.20
Inches Min. Max. 0.2559 *0.1811 0.0354 0.0315 0.2047 0.2165
Millimeters Min. Max. 6.50 *4.60 0.90 0.80 5.20 5.50
Notes: 1.Dimension tolerance based Spec. dated May. 24,1995.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material:
Lead: Alloy solder plating Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HI122
HSMC Product Specification

HI122 EPITAXIAL PLANAR TRANSISTOR Description HI122 des

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