HBC558 EPITAXIAL PLANAR TRANSISTOR Description HBC558 d
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Spec. HA200104 Issued Date 2001.10.01 Revised Date 2001.10.23 Page
HBC558
EPITAXIAL PLANAR TRANSISTOR
Description
HBC558 designed switching amplifier amplification suitable automatic insertion thick thin-film circuits.
Absolute Maximum Ratings
TO-92
Maximum Temperatures Storage Temperature +150 Junction Temperature. +150 Maximum Power Dissipation Total Power Dissipation (Ta=25°C) Maximum Voltages Currents (Ta=25°C) VCBO Collector Base Voltage VCEO Collector Emitter Voltage. VEBO Emitter Base Voltage Collector Current. -100
Characteristics (Ta=25°C)
Symbol BVCBO BVCEO BVEBO ICBO *VCE(sat)1 *VCE(sat)2 *VBE(sat)1 *VBE(sat)2 VBE(on)1 VBE(on)2 *hFE Min. -600 Typ. -250 -700 -900 Max. -300 -650 -750 -800 Unit Test Conditions IC=-100uA IC=-1mA IE=-10uA VCB=-30V IC=-10mA, IB=-0.5mA IC=-100mA, IB=-5mA IC=-10mA, IB=-0.5mA IC=-100mA, IB=-5mA VCE=-5V, IB=-2mA VCE=-5V, IB=-10mA VCE=-5V, IC=-2mA VCE=-5V, IC=-10mA VCB=-10V, f=1MHz
*Pulse Test Pulse Width 380us, Duty Cycle2%
Classification
Rank 110-220 200-450 420-800
HBC558
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
1000
Spec. HA200104 Issued Date 2001.10.01 Revised Date 2001.10.23 Page
Saturation Voltage Collector Current
10000
1000
Saturation Voltage (mV)
VCE=5V
VCE(sat) IC=20IB
1000
1000
Collector Current (mA)
Collector Current (mA)
Saturation Voltage Collector Current
10000
10000
Voltage Collector Current
Saturation Voltage (mV)
Voltage (mV)
1000 BE(sat) IC=20IB
1000 BE(on) VCE=5V
1000
1000
Collector Current (mA)
Collector Current (mA)
Cutoff Frequency Collector Current
1000
Cutoff Frequency (MHz)
CE=5V
1000
Collector Current (mA)
HBC558
HSMC Product Specification
TO-92 Dimension
Date Code
Spec. HA200104 Issued Date 2001.10.01 Revised Date 2001.10.23 Page
Marking:
Rank
Style: 1.Collector 2.Base 3.Emitter
3-Lead TO-92 Plastic Package HSMC Package Code:
Typical
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27
Notes: 1.Dimension tolerance based Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material:
Lead: Alloy solder plating Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HBC558
HSMC Product Specification
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