HBC557 EPITAXIAL PLANAR TRANSISTOR Description HBC557 d

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HBC557 EPITAXIAL PLANAR TRANSISTOR Description HBC557 d

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Spec. HE6423-B Issued Date 1992.11.25 Revised Date 2000.09.20 Page
HBC557
EPITAXIAL PLANAR TRANSISTOR
Description
HBC557 designed driver stage audio amplifier applications.
Features
High Breakdown Voltage: High Current Gain: 75-800 IC=2mA
Absolute Maximum Ratings
Maximum Temperatures Storage Temperature +150 Junction Temperature +150 Maximum Maximum Power Dissipation Total Power Dissipation (Ta=25°C) Maximum Voltages Currents (Ta=25°C) VCBO Collector Base Voltage VCEO Collector Emitter Voltage VEBO Emitter Base Voltage Collector Current -100
Characteristics (Ta=25°C)
Symbol BVCBO BVCEO BVEBO ICBO IEBO VBE(on)1 VBE(on)2 *VCE(sat)1 *VCE(sat)2 *hFE Min. -600 Typ. Max. -100 -750 -820 -300 -650 Unit Test Conditions IC=-100uA IC=-1mA IE=-10uA VCB=-20V VEB=-5V IC=-2mA, VCE=-5V IC=-10mA, VCE=-5V IC=-10mA, IB=-1mA IC=-100mA, IB=-10mA VCB=-5V, IC=-2mA VCE=-5V, IC=-10mA, f=100MHz VCB=-10V, IE=0, f=1MHz
*Pulse Test Pulse Width 380us, Duty Cycle2%
Classification
Rank Range 125-260 240-500 420-800 Normal 75-260
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
1000 100.000
Spec. HE6423-B Issued Date 1992.11.25 Revised Date 2000.09.20 Page
Saturation Voltage Collector Current
VCE=5V
Saturation Voltage (mV)
10.000
1.000
0.100 VCE(sat) IC=10IB
1000
0.010 1000
Collector Current (mA)
Collector Current (mA)
Voltage Collector Current
1000
Cutoff Frequency Collector Current
Cutoff Frequency (MHz)
VCE=5V
Voltage (mV)
VBE(on) VCE=5V
1000
1000
Collector Current (mA)
Collector Current (mA)
Capacitance Reverse-Biased Voltage
Safe Operating Area
PT=1ms
Collector Current-IC (mA)
PT=100ms PT=1s
Capacitance (pF)
0.01
Reverse Biased Voltage
Forward Voltage-VCE
HSMC Product Specification
TO-92 Dimension
Spec. HE6423-B Issued Date 1992.11.25 Revised Date 2000.09.20 Page
Marking
HSMC Logo Part Number Date Code Rank Product Series
Laser Mark
HSMC Logo Product Series
Part Number
Mark Style 1.Collector 2.Base 3.Emitter
3-Lead TO-92 Plastic Package HSMC Package Code
*:Typical
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27
Notes 1.Dimension tolerance based Spec. dated Apr. 25,1996.
2.Controlling dimension millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material
Lead Alloy solder plating Mold Compound Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory
Head Office (Hi-Sincerity Microelectronics Corp.) 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. 886-2-25212056 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5983621~5 886-3-5982931 Factory 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5977061 886-3-5979220
HSMC Product Specification

HBC557 EPITAXIAL PLANAR TRANSISTOR Description HBC557 d

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