HBC548 EPITAXIAL PLANAR TRANSISTOR Description HBC548 d

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HBC548 EPITAXIAL PLANAR TRANSISTOR Description HBC548 d

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Spec. HA200103 Issued Date 2001.10.01 Revised Date 2001.10.23 Page
HBC548
EPITAXIAL PLANAR TRANSISTOR
Description
HBC548 designed switching amplifier amplification suitable automatic insertion thick thin-film circuits.
Absolute Maximum Ratings
TO-92
Maximum Temperatures Storage Temperature +150 Junction Temperature. +150 Maximum Power Dissipation Total Power Dissipation (Ta=25°C) Maximum Voltages Currents (Ta=25°C) VCBO Collector Base Voltage VCEO Collector Emitter Voltage. VEBO Emitter Base Voltage Collector Current.
Characteristics (Ta=25°C)
Symbol BVCBO BVCEO BVEBO ICBO *VCE(sat)1 *VCE(sat)2 *VBE(sat)1 *VBE(sat)2 VBE(on)1 VBE(on)2 *hFE Min. Typ. Max. Unit Test Conditions IC=100uA IC=1mA IE=10uA VCB=30V IC=10mA, IB=0.5mA IC=100mA, IB=5mA IC=10mA, IB=0.5mA IC=100mA, IB=5mA VCE=5V, IC=2mA VCE=5V, IC=10mA VCE=5V, IC=2mA VCE=5V, IC=10mA VCB=10V, f=1MHz, IE=0
*Pulse Test Pulse Width 380us, Duty Cycle2%
Classification
Rank 110-220 200-450 420-800
HBC548
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
1000 100000
Spec. HA200103 Issued Date 2001.10.01 Revised Date 2001.10.23 Page
Saturation Voltage Collector Current
10000
Current Gain-hFE
VCE=5V
Saturation Voltage (mV)
1000
BE(sat) IC=20IB
CE(sat) IC=20IB
1000
1000
Collector Current-IC (mA)
Collector Current-IC (mA)
Voltage Collector Current
10000
Capacitance Reverse-Biased Voltage
Voltage (mV)
Capacitance (pF)
1000
BE(on) VCE=5V
1000
Collector
Current-IC (mA)
Reverse-Biased Voltage
Cutoff Frequency Collector Current
1000
PD-Ta
Power Dissipation-PD(mW)
Cutoff Frequence (MHz)
VCE=5V
Collector Current-IC (mA)
Ambient Temperature-Ta(
HBC548
HSMC Product Specification
TO-92 Dimension
Date Code
Spec. HA200103 Issued Date 2001.10.01 Revised Date 2001.10.23 Page
Marking:
Rank
Style: 1.Collector 2.Base 3.Emitter
3-Lead TO-92 Plastic Package HSMC Package Code:
Typical
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27
Notes: 1.Dimension tolerance based Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material:
Lead: Alloy solder plating Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HBC548
HSMC Product Specification

HBC548 EPITAXIAL PLANAR TRANSISTOR Description HBC548 d

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