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HBC547 EPITAXIAL PLANAR TRANSISTOR Description HBC547 d


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Spec. HE6418-C Issued Date 1992.11.25 Revised Date 2000.09.20 Page
HBC547
EPITAXIAL PLANAR TRANSISTOR
Description
HBC547 designed driver stage audio amplifier.
Features
High Breakdown Voltage: High Current Gain: 110-800 IC=2mA
Absolute Maximum Ratings
Maximum Temperatures Storage Temperature +150 Junction Temperature +150 Maximum Maximum Power Dissipation Total Power Dissipation (Ta=25°C) Maximum Voltages Currents (Ta=25°C) VCBO Collector Base Voltage VCEO Collector Emitter Voltage VEBO Emitter Base Voltage Collector Current 100mA
Characteristics (Ta=25°C)
Symbol BVCBO BVCEO BVEBO ICBO VBE(on)1 VBE(on)2 *VBE(sat)1 *VBE(sat)2 *VCE(sat)1 *VCE(sat)2 *hFE Min. 0.58 Typ. Max. 0.77 0.25 Unit Test Conditions IC=100uA, IE=0 IC=1mA, IB=0 IE=10uA, IC=0 VCB=30V, IE=0 IC=2mA, VCE=5V IC=10mA, VCE=5V IC=10mA, IB=0.5mA IC=100mA, IB=5mA IC=10mA, IB=0.5mA IC=100mA, IB=5mA VCE=5V, IC=2mA VCE=5V, IC=10mA, f=100MHz VCE=10V, IE=0, f=1MHZ
*Pulse Test Pulse Width 380us, Duty Cycle2%
Classification
Rank Range 110-220 200-450 420-800
HSMC Product Specification
Characteristics Curve
entG olect
1000 10000
Spec. HE6418-C Issued Date 1992.11.25 Revised Date 2000.09.20 Page
Saturation Voltage Collector Current
Saturation Voltage (mV)
1000 VBE(sat) IC=20IB
VCE(sat) IC=20IB
1000
1000
ent(
Collector Current (mA)
Voltage Collector Current
10000
Capacitance Reverse-Biased Voltage
Voltage (mV)
1000
Capacitance (pF)
VBE(on) VCE=5V
1000
Collector Current (mA)
Reverse-Biased Voltage
Cutoff Frequency Collector Current
1000 10000 PT=1ms
Safe Operating Area
PT=100ms
Collector Current-IC (mA)
Cutoff Frequency (MHz)
1000 PT=1s
VCE=5V
Collector Current (mA)
Forward Voltage-VCE
HSMC Product Specification
Spec. HE6418-C Issued Date 1992.11.25 Revised Date 2000.09.20 Page
PD-Ta
Power Dissipation-PD(mW)
Ambient Temperature-Ta(
HSMC Product Specification
TO-92 Dimension
Spec. HE6418-C Issued Date 1992.11.25 Revised Date 2000.09.20 Page
Marking
HSMC Logo Part Number Date Code Rank Product Series
Laser Mark
HSMC Logo Product Series
Part Number
Mark Style 1.Collector 2.Base 3.Emitter
3-Lead TO-92 Plastic Package HSMC Package Code
*:Typical
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27
Notes 1.Dimension tolerance based Spec. dated Apr. 25,1996.
2.Controlling dimension millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material
Lead Alloy solder plating Mold Compound Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory
Head Office (Hi-Sincerity Microelectronics Corp.) 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. 886-2-25212056 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5983621~5 886-3-5982931 Factory 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5977061 886-3-5979220
HSMC Product Specification

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