HBC546 EPITAXIAL PLANAR TRANSISTOR Description HBC546 p
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Spec. HE6417 Issued Date 1992.11.25 Revised Date 2002.02.18 Page
HBC546
EPITAXIAL PLANAR TRANSISTOR
Description
HBC546 primarily intended driver stage audio amplifiers.
Features
High Breakdown Voltage: High Current Gain: 110-800 IC=2mA VCE=5V
TO-92
Absolute Maximum Ratings
Maximum Temperatures Storage Temperature +150 Junction Temperature +150 Maximum Maximum Power Dissipation Total Power Dissipation (Ta=25°C) Maximum Voltages Currents (Ta=25°C) VCBO Collector Base Voltage VCEO Collector Emitter Voltage VEBO Emitter Base Voltage Collector Current
Characteristics (Ta=25°C)
Symbol BVCBO BVCEO BVEBO ICBO VBE(on)1 VBE(on)2 *VCE(sat)1 *VCE(sat)2 *VBE(sat)1 *VBE(sat)2 *hFE Min. Typ. Max. Unit Test Conditions IC=100uA, IE=0 IC=1mA, IB=0 IE=10uA, IC=0 VCB=30V, IE=0 IC=10mA, VCE=5V IC=2mA, VCE=5V IC=10mA, IB=0.5mA IC=100mA, IB=5mA IC=10mA, IB=0.5mA IC=100mA, IB=5mA VCE=5V, IC=2mA VCE=5V, IC=10mA, f=100MHz VCB=10V, IE=0, f=1MHz
*Pulse Test: Pulse Width 380us, Duty Cycle2%
Classification
Rank Range
HBC546
110-220
200-450
420-800
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
1000 1000
Spec. HE6417 Issued Date 1992.11.25 Revised Date 2002.02.18 Page
Saturation Voltage Collector Current
Saturation Voltage (mV)
VCE(sat) IC=20IB
VCE=5V
Collector Current-IC (mA)
Collector Current-IC (mA)
Voltage Collector Current
1000
Capacitance Reverse-Biased Voltage
Capacitance (pF)
Voltage (mV)
VBE(ON) VCE=5V
Collector Current-IC (mA)
Reverse-Biased Voltage
Safe Operating Area
10000 PT=1ms
PD-Ta
Collector Current-IC (mA)
1000
Power Dissipation-PD (mW)
PT=100ms PT=1s
Forward Voltage-VCE
Ambient Temperature-Ta
HBC546
HSMC Product Specification
TO-92 Dimension
Date Code
Spec. HE6417 Issued Date 1992.11.25 Revised Date 2002.02.18 Page
Marking:
Rank Control Code
Style: 1.Collector 2.Base 3.Emitter
3-Lead TO-92 Plastic Package HSMC Package Code:
Typical
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27
Notes: 1.Dimension tolerance based Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material:
Lead: Alloy; solder plating Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HBC546
HSMC Product Specification
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