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HBC337 EPITAXIAL PLANAR TRANSISTOR Description HBC337 d
Top Searches for this datasheetSpec. HE6415 Issued Date 1992.11.25 Revised Date 2002.02.05 Page HBC337 EPITAXIAL PLANAR TRANSISTOR Description HBC337 designed driver output-stage audio amplifiers. Features High Current Gain: 100-600 IC=100mA,VCE=1V Complementary HBC327 TO-92 Absolute Maximum Ratings Maximum Temperatures Storage Temperature +150 Junction Temperature +150 Maximum Maximum Power Dissipation Total Power Dissipation (Ta=25°C) Maximum Voltages Currents (Ta=25°C) VCBO Collector Base Voltage VCEO Collector Emitter Voltage VEBO Emitter Base Voltage Collector Current Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO *VCE(sat) VBE(on) *hFE1 *hFE2 Min. Typ. Max. Unit Test Conditions IC=100uA, IE=0 IC=10mA, IB=0 IE=10uA, IC=0 VCB=45V, IE=0 IB=500mA, IB=50mA IC=300mA, VCE=1V VCE=1V, IC=100mA VCE=1V, IC=300mA VCE=5V, IC=10mA, f=100MHZ VCB=10V, IE=0, f=1MHZ *Pulse Test: Pulse Width 380us, Duty Cycle2% Classification hFE1 Rank Range 100-250 160-400 250-600 HBC337 HSMC Product Specification Characteristics Curve Current Gain Collector Current 1000 Spec. HE6415 Issued Date 1992.11.25 Revised Date 2002.02.05 Page Saturation Voltage Collector Current 1000 VCE(s IC=10IB Saturation Voltage (mV) VCE=1V 1000 1000 Collector Current-IC (mA) Collector Current-IC (mA) Voltage Collector Current 1000 Capacitance Reverse-Biased Voltage Capacitance (pF) Voltage (mV) VBE(ON) VCE=1V 1000 Collector Current-IC (mA) Reverse-Biased Voltage Cutoff Frequency Collector Current 1000 10000 Safe Operating Area PT=1ms PT=100ms Cutoff Frequency (MHz). Collector Current-IC (mA) 1000 PT=1s VCE=5V 1000 Collector Current (mA) Forward Voltage-VCE HBC337 HSMC Product Specification Spec. HE6415 Issued Date 1992.11.25 Revised Date 2002.02.05 Page PD-Ta Power Dissipation-PD (mW) Ambient Temperature-Ta HBC337 HSMC Product Specification TO-92 Dimension Date Code Spec. HE6415 Issued Date 1992.11.25 Revised Date 2002.02.05 Page Marking: Control Code Style: 1.Collector 2.Base 3.Emitter 3-Lead TO-92 Plastic Package HSMC Package Code: Typical Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 Notes: 1.Dimension tolerance based Spec. dated Apr. 25,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office. Material: Lead: Alloy; solder plating Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance. Head Office Factory: Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HBC337 HSMC Product Specification Other recent searchesSN74LV14A - SN74LV14A SN74LV14A Datasheet SN54LV14A - SN54LV14A SN54LV14A Datasheet SL-156 - SL-156 SL-156 Datasheet SiS452DN - SiS452DN SiS452DN Datasheet PCN12895 - PCN12895 PCN12895 Datasheet MHPM6B1OA6ODID - MHPM6B1OA6ODID MHPM6B1OA6ODID Datasheet MGM016I - MGM016I MGM016I Datasheet AZ734 - AZ734 AZ734 Datasheet
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