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HBC327 EPITAXIAL PLANAR TRANSISTOR Description This HBC


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Spec. HE6413 Issued Date 1993.01.15 Revised Date 2002.02.05 Page
HBC327
EPITAXIAL PLANAR TRANSISTOR
Description
This HBC327 designed driver output-stages audio amplifiers.
Features
High Current Gain: 100-600 IC=100mA,VCE=1V Complementary HBC337
TO-92
Absolute Maximum Ratings
Maximum Temperatures Storage Temperature +150 Junction Temperature +150 Maximum Maximum Power Dissipation Total Power Dissipation (Ta=25°C) Maximum Voltages Currents (Ta=25°C) VCBO Collector Base Voltage VCEO Collector Emitter Voltage VEBO Emitter Base Voltage Collector Current -500
Characteristics (Ta=25°C)
Symbol BVCBO BVCEO BVEBO ICBO IEBO *hFE1 *hFE2 *VCE(sat)1 VBE(on) Min. Typ. Max. -100 -100 -0.7 -1.2 Unit Test Conditions IC=-100uA, IE=0 IC=-10mA, IB=0 IE=-100uA, IC=0 VCB=-30V, IE=0 VEB=-5V, IC=0 VCE=-1V, IC=-100Ma VCE=-1V, IC=-300mA IC=-500mA, IB=-50mA VCE=-1V, IC=-300mA, VCE=-5V, IC=-10mA, f=100MHZ VCB=-10V, f=1MHZ, IC=0
*Pulse Test: Pulse Width 380us, Duty Cycle2%
Classification hFE1
Rank Range 100-250 160-400 250-600
HBC327
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
1000
1000 VCE(sat) IC=10IB
Spec. HE6413 Issued Date 1993.01.15 Revised Date 2002.02.05 Page
Saturation Voltage Collector Current
Saturation Voltage (mV)
VCE=1V 1000
1000
Collector Current-IC (mA)
Collector Current-IC (mA)
Voltage Collector Current
1000
Cutoff Frequency Collector Current
1000
Cutoff Frequency (MHz).
Voltage (mV)
VCE=5V
VBE(ON) VCE=1V
1000
1000
Collector Current-IC (mA)
Collector Current (mA)
Capacitance Reverse-Biased Voltage
10000
Safe Operating Area
PT=100ms
PT=1ms
Collector Current-IC (mA)
1000 PT=1s
Capacitance (pF)
Reverse Biased Voltage
Forward Voltage-VCE
HBC327
HSMC Product Specification
Spec. HE6413 Issued Date 1993.01.15 Revised Date 2002.02.05 Page
PD-Ta
Power Dissipation-PD (mW)
Ambient Temperature-Ta
HBC327
HSMC Product Specification
TO-92 Dimension
Date Code
Spec. HE6413 Issued Date 1993.01.15 Revised Date 2002.02.05 Page
Marking:
Control Code
Style: 1.Collector 2.Base 3.Emitter
3-Lead TO-92 Plastic Package HSMC Package Code:
Typical
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27
Notes: 1.Dimension tolerance based Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material:
Lead: Alloy; solder plating Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HBC327
HSMC Product Specification

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