HBC237 EPITAXIAL PLANAR TRANSISTOR Description HBC237 p

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HBC237 EPITAXIAL PLANAR TRANSISTOR Description HBC237 p

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Spec. HE6446-B Issued Date 1992.11.25 Revised Date 2000.09.20 Page
HBC237
EPITAXIAL PLANAR TRANSISTOR
Description
HBC237 primarily intended driver stage audio amplifiers.
Features
High Breakdown Voltage: IC=2mA
Absolute Maximum Ratings
Maximum Temperatures Storage Temperature +150 Junction Temperature +150 Maximum Maximum Power Dissipation Total Power Dissipation (Ta=25°C) Maximum Voltages Currents (Ta=25°C) VCES Collector Emitter Voltage. VCEO Collector Emitter Voltage VEBO Emitter Base Voltage Collector Current
Characteristics (Ta=25°C, *Pulse Test Pulse Width 380us, Duty Cycle2%)
Symbol BVCES BVCEO BVEBO ICES IEBO VBE(on) *VCE(sat)1 *VCE(sat)2 *VBE(sat)1 *VBE(sat)2 *hFE1 *hFE2 *hFE3 Min. Typ. Max. 1.05 Unit Test Conditions IC=100uA, VEB=0 IC=2mA, IB=0 IE=100uA, IC=0 VCB=50V, IE=0 VEB=4V, IC=0 IC=2mA, VCE=5V IC=10mA, IB=0.5mA IC=100mA, IB=5mA IC=100mA, IB=5mA IC=10mA, IB=0.5mA VCE=5V, IC=10uA VCE=5V, IC=2mA VCE=5V, IC=100mA VCE=5V, IC=10mA, f=100MHz VCB=10V, IE=0, f=1MHz
Classification hFE2
Rank Range 120-220 180-460 300-800
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
1000
Spec. HE6446-B Issued Date 1992.11.25 Revised Date 2000.09.20 Page
Saturation Voltage Collector Current
VCE=5V
Saturation Voltage (mV)
VBE(sat) IC=10IB IC=10IB
VCE(sat)
1000
0.01
Collector Current (mA)
Collector Current (mA)
1000
10000
Voltage Collector Current
1000
Cutoff Frequency Collector Current
Cutoff Frequency (MHz)
VCE=5V
Voltage (mV)
VBE(on) VCE=5V
1000
Collector Current (mA)
Collector Current (mA)
Capacitance Reverse-Biased Voltage
Safe Operating Area
PT=1ms
Collector Current (mA)
Capacitance (Pf)
PT=100ms
PT=1s
0.01
Reverse Biased Voltage
Forward Voltage
HSMC Product Specification
Spec. HE6446-B Issued Date 1992.11.25 Revised Date 2000.09.20 Page
PD-Ta
Power Dissipation-PD(mW)
Ambient Temperature-Ta(
HSMC Product Specification
TO-92 Dimension
Spec. HE6446-B Issued Date 1992.11.25 Revised Date 2000.09.20 Page
Marking
HSMC Logo Part Number Date Code Rank Product Series
Laser Mark
HSMC Logo Product Series
Part Number
Mark Style 1.Collector 2.Base 3.Emitter
3-Lead TO-92 Plastic Package HSMC Package Code
*:Typical
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27
Notes 1.Dimension tolerance based Spec. dated Apr. 25,1996.
2.Controlling dimension millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material
Lead Alloy solder plating Mold Compound Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory
Head Office (Hi-Sincerity Microelectronics Corp.) 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. 886-2-25212056 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5983621~5 886-3-5982931 Factory 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5977061 886-3-5979220
HSMC Product Specification

HBC237 EPITAXIAL PLANAR TRANSISTOR Description HBC237 p

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