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HAD826 EPITAXIAL PLANAR TRANSISTOR Description HAD826 d


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Spec. HE6411-B Issued Date 199.03.06 Revised Date 2000.09.01 Page
HAD826
EPITAXIAL PLANAR TRANSISTOR
Description
HAD826 designed general purpose amplifier high speed, medium-power switching applications.
Features
Collector Saturation Voltage High Speed Switching
Absolute Maximum Ratings
Maximum Temperatures Storage Temperature +150 Junction Temperature. Maximum Maximum Power Dissipations Total Power Dissipation (Ta=25°C) Maximum Voltages Currents (Ta=25°C) VCBO Collector Base Voltage VCEO Collector Emitter Voltage. VEBO Emitter Base Voltage Collector Current 600mA
Characteristics (Ta=25°C)
Symbol BVCBO BVCEO BVEBO ICBO ICEX IEBO *VCE(sat)1 *VCE(sat)2 *VBE(sat)1 *VBE(sat)2 *hFE1 *hFE2 *hFE3 *hFE4 *hFE5 *hFE6 Min. Typ. Max. Unit Test Conditions IC=10uA, IE=0 IC=10mA, IB=0 IE=10uA, IC=0 VCB=60V, IE=0 VCB=60V, VEB(OFF)=3V VEB=3V, IC=0 IC=150mA, IB=15mA IC=500mA, IB=50mA IC=150mA, IB=15mA IC=500mA, IB=50mA VCE=10V, IC=100uA VCE=10V, IC=1mA VCE=10V, IC=10mA VCE=10V, IC=150mA VCE=10V, IC=500mA VCE=1V, IC=150mA IC=20mA, VCE=20V, f=100MHz VCB=10V, F=1MHz
HSMC Product Specification
Characteristics Curve
Current Gain Colletor Current
1000 10000
Spec. HE6411-B Issued Date 199.03.06 Revised Date 2000.09.01 Page
Saturation Voltage Collector Current
VCE=10V
Current Gain-hFE
Saturation Voltage (mV)
1000 VBE(sat)@IC=10IB
VCE=1V
VCE(sat)@IC=10IB
1000
1000
Collector Current-IC (mA)
Collector Current-IC (mA)
Cutoff Frequency Collector Current
1000
Capacitance Reverse-Biased Voltage
Cutoff Frequency (MHz)
VCE=20V
Capacitance-(Pf)
Collector Current-IC (mA)
Reverse Biased Voltage
Safe Operating Area
10000
PD-Ta
Collector Current-IC (mA)
1000 PT=1s
PT=1ms
Power Dissipation-PD(mW)
PT=100ms
Forward Voltage-VCE
Ambient Temperature-Ta(
HSMC Product Specification
TO-92 Dimension
Spec. HE6411-B Issued Date 199.03.06 Revised Date 2000.09.01 Page
Marking
HSMC Logo Part Number Date Code Rank Product Series
Laser Mark
HSMC Logo Product Series
Part Number
Mark Style 1.Base 2.Collector 3.Emitter
3-Lead TO-92 Plastic Package HSMC Package Code
*:Typical
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27
Notes 1.Dimension tolerance based Spec. dated Apr. 25,1996.
2.Controlling dimension millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material
Lead Alloy solder plating Mold Compound Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory
Head Office (Hi-Sincerity Microelectronics Corp.) 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. 886-2-25212056 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5983621~5 886-3-5982931 Factory 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5977061 886-3-5979220
HSMC Product Specification

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