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HAD825SP EPITAXIAL PLANAR TRANSISTOR Features Darlingto


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Spec. :Preliminary Data Issued Date 2000.10.01 Revised Date 2001.05.01 Page
HAD825SP
EPITAXIAL PLANAR TRANSISTOR
Features
Darlington Transistor
Absolute Maximum Ratings
Maximum Temperatures Storage Temperature +150 Junction Temperature. +150 Maximum Maximum Power Dissipation Total Power Dissipation (Ta=25°C) Maximum Voltages Currents (Ta=25°C) VCBO Collector Base Voltage VCES Collector Emitter Voltage VEBO Emitter Base Voltage Collector Current
Characteristics (Ta=25°C)
Symbol BVCBO BVCES BVEBO ICBO IEBO ICES *VCE(sat)1 *VCE(sat)2 *VBE(on) *hFE1 *hFE2 Min. Typ. Max. 100K Unit Test Conditions IC=100uA, IE=0 IC=100uA, IB=0 IE=10uA, IC=0 VCB=60V, IE=0 VEB=10V, IC=0 VCE=50V, IB=0 IC=10mA, IB=0.01mA IC=100mA, IB=0.1mA IC=100mA, VCE=5V IC=10mA, VCE=5V IC=100mA, VCE=5V VCE=5V, IC=10mA, =100MHz VCB=10V, f=1MHz
*Pulse Test Pulse Width 380us, Duty Cycle2%
HAD825SP
HSMC Product Specification
TO-92SP Dimension
Spec. :Preliminary Data Issued Date 2000.10.01 Revised Date 2001.05.01 Page
Style 1.Emitter 2.Collector 3.Base
3-Lead TO-92SP Plastic Package, HSMC Package Code
*:Typical
Inches Min. Max. 0.1450 0.1650 0.1063 0.1300 0.5000 *0.1000
Millimeters Min. Max. 3.70 4.20 2.70 3.30 12.7 *2.54
Inches Min. Max. 0.0160 0.0240 *0.0150 0.0800 0.1050
Millimeters Min. Max. 0.41 0.61 *0.38 2.03 2.67
Notes 1.Dimension tolerance based Spec. dated Sep. 07,1997.
2.Controlling dimension millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material
Lead Alloy solder plating Mold Compound Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory
Head Office (Hi-Sincerity Microelectronics Corp.) 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. 886-2-25212056 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5983621~5 886-3-5982931
HAD825SP
HSMC Product Specification

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