HA3669 EPITAXIAL PLANAR TRANSISTOR Description HA3669 d

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HA3669 EPITAXIAL PLANAR TRANSISTOR Description HA3669 d

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Spec. HA200210 Issued Date 2000.11.01 Revised Date 2002.04.18 Page
HA3669
EPITAXIAL PLANAR TRANSISTOR
Description
HA3669 designed using power amplifier applications, power switching application.
Absolute Maximum Ratings (Ta=25°C)
TO-92
Maximum Temperatures Tstg Storage Temperature +150 Junction Temperature +150 Maximum Power Dissipation Total Power Dissipation (Ta=25°C) Maximum Voltages Currents BVCBO Collector Base Breakdown Voltage BVCEO Collector Emitter Breakdown Voltage. BVEBO Emitter Base Emitter Breakdown Voltage. Collector Current (DC)
Characteristics (Ta=25°C)
Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE Tstg Min. Typ. 0.15 Max. 1000 1000 Unit Test Conditions IC=100uA IC=10mA IE=100uA VCB=80V VEB=5V IC=1A, IB=50mA IC=1A, IB=50mA VCE=2V, IC=500mA VCE=2V, IC=500mA VCB=10V, f=1MHz IB1=-IB2=50mA, Duty Cycle1%
*Pulse Test: Pulse Width 380us, Duty Cycle2%
HA3669
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
10000 1000
Spec. HA200210 Issued Date 2000.11.01 Revised Date 2002.04.18 Page
Saturation Voltage Collector Current
1000
VCE(sat) IC=20IB
Saturation Voltage (mV)
VCE=2V
1000 10000
1000 10000
Collector Current-IC (mA)
Collector Current-IC (mA)
Saturation Voltage Collector Current
1000
Power Derating
Power Dissipation-PD (mW)
Saturation Voltage (mV)
VBE(s IC=20IB
1000 10000
Collector Current-IC (mA)
Ambient Temperature-Ta
HA3669
HSMC Product Specification
TO-92 Dimension
Date Code
Spec. HA200210 Issued Date 2000.11.01 Revised Date 2002.04.18 Page
Marking:
Control Code
Style: 1.Emitter 2.Collector 3.Base
3-Lead TO-92 Plastic Package HSMC Package Code:
Typical
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27
Notes: 1.Dimension tolerance based Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material:
Lead: Alloy; solder plating Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HA3669
HSMC Product Specification

HA3669 EPITAXIAL PLANAR TRANSISTOR Description HA3669 d

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