HSA1300 SILICON EPITAXIAL TYPE Description Strobo Flash
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Spec. HE6571 Issued Date 1998.07.15 Revised Date 2002.08.15 Page
HSA1300
SILICON EPITAXIAL TYPE
Description
Strobo Flash Applications Medium Power Amplifier Applications
Features
High Current Gain Excellenr Linearity hFE(1)=140-600, (VCE=-1V, IC=-0.5A) hFE(2)=60 (Min.), (VCE=-1V, IC=-2A) Saturation Voltage VCE(sat)=-0.5V(Max.), (IC=-2A, IE=-50mA)
TO-92
Absolute Maximum Ratings (Ta=25°C)
Characteristic Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Pulsed (Note Symbol VCBO VCES VCEO VEBO Tstg Ratios -0.2 -55~150 Unit
Base Current Collector Power Dissipation Junction Temperature Storage Temperature Range
Note Pulse Width=10ms(Max.), Duty Cycle=30%(Max.)
Electrical Characteristics (Ta=25°C)
Symbol V(BR)CEO V(BR)EBO ICBO IEBO *hFE1 *hFE2 *VCE(sat) Min. Typ. -0.83 Max. -100 -100 1000 -0.5 -1.5 Unit Test Condition IC=-10mA, IB=0 IE=-1mA, IC=0 VCE=-20V, IE=0 VBE=-6V, IC=0 VCE=-1V, IC=-0.5A VCE=-1V, IC=-2A IC=-2A, IB=-50mA VCE=-1V, IC=-2A VCE=-1V, IC=-0.5A VCE=-10V, IE=0, f=1KHZ
*Pulse Test: Pulse Width 380us, Duty Cycle2%
Classifications hFE1
Rank hFE1 140-280 200-400 300-600 500~1000
HSA1300
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
1000
Spec. HE6571 Issued Date 1998.07.15 Revised Date 2002.08.15 Page
Saturation Voltage Collector Current
1000 VCE(sat) IC=40IB
Saturation Voltage (mV)
VCE=1V
1000 10000
1000
Collector Current-IC (mA)
Collector Current-IC (mA)
Voltage Collector Current
1000
Capacitance Reverse-Biased Voltage
1000
Voltage (mV)
VBE(ON) VCE=1V
Capacitance (Pf)
1000 10000
Collector Current-IC (mA)
Reverse Biased Voltage
Cutoff Frequency Collector Current
1000
Safe Operating Area
PT=1ms
Cutoff Frequency (MHz).
Collector Current-IC
PT=100ms PT=1s
1000
0.01
Collector Current (mA)
Forward Biased Voltage-VCE
HSA1300
HSMC Product Specification
TO-92 Dimension
Date Code
Spec. HE6571 Issued Date 1998.07.15 Revised Date 2002.08.15 Page
Marking:
Rank Control Code
Style: 1.Emitter 2.Collector 3.Base
3-Lead TO-92 Plastic Package HSMC Package Code:
Typical
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27
Notes: 1.Dimension tolerance based Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material:
Lead: Alloy; solder plating Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSA1300
HSMC Product Specification
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