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HSA1300D SILICON EPITAXIAL TYPE Description Strobo Flas


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Spec. HD200202 Issued Date 1999.07.01 Revised Date 2002.02.20 Page
HSA1300D
SILICON EPITAXIAL TYPE
Description
Strobo Flash Applications Medium Power Amplifier Applications
Features
High Current Gain Excellenr Linearity hFE(1)=140-600, (VCE=-1V, IC=-0.5A) hFE(2)=60 (Min.), 120(Typ.), (VCE=-1V, IC=-4A) Saturation Voltage. VCE(sat)=-0.5V(Max.), (IC=-2A, IE=-50mA)
TO-126ML
Absolute Maximum Ratings (Ta=25°C)
Characteristic Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Pulsed (Note1) Symbol VCBO VCES VCEO VEBO Tstg Ratios -55~150 Unit
Base Current Collector Power Dissipation Junction Temperature Storage Temperature Range
Note Pulse Width=10ms(Max.), Duty Cycle=30%(Max.)
Electrical Characteristics (Ta=25°C)
Symbol V(BR)CEO V(BR)EBO ICBO IEBO *hFE(1) (Note *hFE(2) *VCE(sat) Min. Typ. -0.20 -0.83 Max. -100 -100 -0.50 -1.5 Unit Test Condition IC=10mA, IB=0 IE=-1mA, IC=0 VCE=-20V, IE=0 VBE=-6V, IC=0 VCE=-1V, IC=0.5A VCE=-1V, IC=-4A IC=-2A, IB=-50mA VCE=-1V, IC=-2A VCE=-1V, IC=-0.5A VCE=-10V, IE=0, f=1KHZ
*Pulse Test: Pulse Width 380us, Duty Cycle2%
Classifications
Rank hFE(1) 140-280 200-400 300-600
HSA1300D
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
1000
Spec. HD200202 Issued Date 1999.07.01 Revised Date 2002.02.20 Page
Saturation Voltage Collector Current
1000 VCE(sat) IC=40IB
Saturation Voltage (mV)
VCE=1V
1000 10000
1000
Collector Current-IC (mA)
Collector Current-IC (mA)
Voltage Collector Current
1000
Capacitance Reverse-Biased Voltage
1000
Voltage (mV)
VBE(ON) VCE=1V
Capacitance (pF)
1000 10000
Collector Current-IC (mA)
Reverse Biased Voltage
Safe Operating Area
Collector Current-IC (mA)
PT=1ms PT=100ms PT=1s
Forward Voltage-VCE
HSA1300D
HSMC Product Specification
TO-126ML Dimension
Marking:
Spec. HD200202 Issued Date 1999.07.01 Revised Date 2002.02.20 Page
Date Code
Control Code
Style: 1.Emitter 2.Collector 3.Base
3-Lead TO-126ML Plastic Package HSMC Package Code Typical
Inches Min. Max. 0.1356 0.1457 0.0170 0.0272 0.0344 0.0444 0.0501 0.0601 0.1131 0.1231 0.0737 0.0837 0.0294 0.0494 0.0462 0.0562
Millimeters Min. Max. 3.44 3.70 0.43 0.69 0.87 1.12 1.27 1.52 2.87 3.12 1.87 2.12 0.74 1.25 1.17 1.42
Inches Min. Max. *0.1795 0.0268 0.0331 0.5512 0.5906 0.2903 0.3003 0.1378 0.1478 0.1525 0.1625 0.0740 0.0842
Millimeters Min. Max. *4.56 0.68 0.84 14.00 15.00 7.37 7.62 3.50 3.75 3.87 4.12 1.88 2.14
Notes: 1.Dimension tolerance based Spec. dated Mar. 6,1995.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material:
Lead: Alloy; solder plating Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSA1300D
HSMC Product Specification

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