HSA733 EPITAXIAL PLANAR TRANSISTOR Description HSA733 d
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Spec. HE6507 Issued Date 1992.12.16 Revised Date 2002.03.26 Page
HSA733
EPITAXIAL PLANAR TRANSISTOR
Description
HSA733 designed driver stage amplifier applications.
Absolute Maximum Ratings
TO-92
Maximum Temperatures Storage Temperature +150 Junction Temperature +150 Maximum Maximum Power Dissipation Total Power Dissipation (Ta=25°C) Maximum Voltages Currents (Ta=25°C) VCBO Collector Base Voltage VCEO Collector Emitter Voltage VEBO Emitter Base Voltage Collector Current -100 Base Current
Characteristics (Ta=25°C)
Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) VBE(on) *hFE Min. -0.55 Typ. -0.18 -0.62 Max. -0.1 -0.1 -0.3 -0.7 Unit Test Conditions IC=-100uA, IE=0 IC=-1mA, IB=0 IE=-10uA, IC=0 VCB=-60V, IE=0 VEB=-5V, IC=0 IC=-100mA, IB=-10mA VCE=-6V, IC=-1mA VCE=-6V, IC=-1mA VCE=-6V, IC=-10mA VCB=-10V, f=1MHz, IE=0
*Pulse Test: Pulse Width 380us, Duty Cycle2%
Classification hFE1
Rank Range 90-180 135-270 200-400 300-600
HSA733
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
1000 1000
Spec. HE6507 Issued Date 1992.12.16 Revised Date 2002.03.26 Page
Saturation Voltage Collector Current
Saturation Voltage (mV)
VCE(sat) IC=10IB
VCE=6V
1000
1000
Collector Current-IC (mA)
Collector Current-IC (mA)
Voltage Collector Current
1000
Cutoff Frequancy Collector Current
1000
Cutoff Frequance (MHz).
VCE=6V
Voltage (mV)
VBE(ON) VCE=6V
1000
Collector Current-IC (mA)
Collector Current (mA)
Capacitance Reverse-Biased Voltage
10000 PT=1ms 1000
Safe Operating Area
Collector Current-IC (mA)
PT=100ms
Capacitance (pF)
PT=1s
Reverse-Biased Voltage
Forward Voltage-VCE
HSA733
HSMC Product Specification
Spec. HE6507 Issued Date 1992.12.16 Revised Date 2002.03.26 Page
PD-Ta
Power Dissipation-PD (mW)
Ambient Temperature-Ta
HSA733
HSMC Product Specification
TO-92 Dimension
Date Code
Spec. HE6507 Issued Date 1992.12.16 Revised Date 2002.03.26 Page
Marking:
Rank Control Code
Style: 1.Emitter 2.Collector 3.Base
3-Lead TO-92 Plastic Package HSMC Package Code:
Typical
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27
Notes: 1.Dimension tolerance based Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material:
Lead: Alloy; solder plating Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSA733
HSMC Product Specification
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