HSB1109S EPITAXIAL PLANAR TRANSISTOR Description HSB110
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Spec. HE6514 Issued Date 1993.03.15 Revised Date 2002.02.06 Page
HSB1109S
EPITAXIAL PLANAR TRANSISTOR
Description
HSB1109S designed frequency high voltage amplifier applications complementary pair with HSD1609S.
Absolute Maximum Ratings
TO-92
Maximum Temperatures Storage Temperature +150 Junction Temperature +150 Maximum Maximum Power Dissipation Total Power Dissipation (Ta=25°C) Maximum Voltages Currents (Ta=25°C) VCBO Collector Base Voltage -160 VCEO Collector Emitter Voltage -160 VEBO Emitter Base Voltage Collector Current -100
Characteristics (Ta=25°C)
Symbol BVCBO BVCEO BVEBO ICBO *VCE(sat) VBE(on) *hFE1 *hFE2 Min. -160 -160 Typ. Max. -1.5 Unit Test Conditions IC=-10uA, IE=0 IC=-1mA. IB=0 IE=-10uA, IC=0 VCB=-140V, IE=0 IC=-30mA, IB=-3mA VCE=-5V, IC=-10mA VCE=-5V, IC=-10mA VCE=-5V, IC=-1mA VCE=-5V, IC=-10mA, f=100MHz VCB=-10V, IE=0, f=1MHz
*Pulse Test Pulse Width 380us, Duty Cycle2%
Classification hFE1
Rank Range 60-120 100-200 160-320
HSB1109S
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
1000
Spec. HE6514 Issued Date 1993.03.15 Revised Date 2002.02.06 Page
Saturation Voltage Collector Current
1000
Saturation Voltage (mV)
VCE=5V
VCE(sat) IC=10IB
Collector Current-IC (mA)
Collector Current-IC (mA)
Voltage Collector Current
1000
Output Capacitance Reverse-Blased Voltage
Output Capacttance-Cob (pF)
Voltage (mV)
VBE(ON) VCE=5V
1000
Collector Current-IC (mA)
Reverse-Biased-VCB
Cutoff Frequency Collector Current
1000 1000
Safe Operating Area
Cutoff Frequency (MHz)
Collector Current (mA)
1000
1000
Collector Current-IC (mA)
Forward Biased Voltage
HSB1109S
HSMC Product Specification
Spec. HE6514 Issued Date 1993.03.15 Revised Date 2002.02.06 Page
Power Derating
1000
Power Dissipation-PD (mW)
Ambient Temperature-Ta
HSB1109S
HSMC Product Specification
TO-92 Dimension
Date Code
Spec. HE6514 Issued Date 1993.03.15 Revised Date 2002.02.06 Page
Marking:
Rank Control Code
Style: 1.Emitter 2.Collector 3.Base
3-Lead TO-92 Plastic Package HSMC Package Code:
Typical
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27
Notes: 1.Dimension tolerance based Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material:
Lead: Alloy; solder plating Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSB1109S
HSMC Product Specification
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