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HSB564A EPITAXIAL PLANAR TRANSISTOR Description HSB564A


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Spec. HE6519 Issued Date 1993.01.15 Revised Date 2001.10.15 Page
HSB564A
EPITAXIAL PLANAR TRANSISTOR
Description
HSB564A designed general purpose frequency power amplifier applications.
Absolute Maximum Ratings
Maximum Temperatures Storage Temperature +150 Junction Temperature +150 Maximum Maximum Power Dissipation Total Power Dissipation (Ta=25°C) Maximum Voltages Currents (Ta=25°C) VCBO Collector Base Voltage VCEO Collector Emitter Voltage VEBO Emitter Base Voltage Collector Current
Characteristics (Ta=25°C)
Symbol BVCBO BVCEO BVEBO ICBO *VCE(sat) *VBE(sat) *hFE Min. Typ. Max. -100 -0.5 -1.2 Unit Test Conditions IC=-100uA, IE=0 IC=-10mA. IB=0 IE=-100uA, IC=0 VCB=-30V, IE=0 IC=-1A, IB=-100mA IC=-1A, IB=-100mA VCE=-1V, IC=-100mA VCE=-6V, IC=-10mA, f=100MHz VCB=-6V, f=1MHz
*Pulse Test Pulse Width 380us, Duty Cycle2%
Classification
Rank Range 70-140 120-240 200-400
HSB564A
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
1000
10000
Spec. HE6519 Issued Date 1993.01.15 Revised Date 2001.10.15 Page
Saturation Voltage Collector Current
Saturation Voltage (mV)
1000 VBE(sat) IC=10IB
VCE=1V
VCE(sat) IC=10IB
1000
1000
Collector Current (mA)
Collector Current (mA)
Capcitance Reverse-Biased Voltage
1000
Cutoff Frequency Collector Current
Cutoff Frequency (MHz)
Capacitance (pF)
VCE=6V
1000
Reverse Biased Voltage
Collector Current (mA)
Safe Operating Area
10000 PT=1ms
Power Derating
PT=100ms 1000
Power Dissipation-PD(mW)
Collector Current (mA)
PT=1s
Forward Voltage
Ambient Temperature-Ta(
HSB564A
HSMC Product Specification
TO-92 Dimension
Spec. HE6519 Issued Date 1993.01.15 Revised Date 2001.10.15 Page
Marking:
HSMC Logo Part Number Date Code Rank Product Series
Laser Mark
HSMC Logo Product Series
Part Number
Mark
3-Lead TO-92 Plastic Package HSMC Package Code:
Style: 1.Emitter 2.Collector 3.Base
Typical
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27
Notes: 1.Dimension tolerance based Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material:
Lead: Alloy solder plating Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSB564A
HSMC Product Specification

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