HSD468 EPITAXIAL PLANAR TRANSISTOR Description HSD468 d
|
|
|
Top Searches for this datasheet
Spec. HE6535 Issued Date 1992.11.25 Revised Date 2002.02.08 Page
HSD468
EPITAXIAL PLANAR TRANSISTOR
Description
HSD468 designed general purpose frequency power amplifier applications.
Absolute Maximum Ratings
TO-92
Maximum Temperatures Storage Temperature +150 Junction Temperature Maximum Maximum Power Dissipation Total Power Dissipation (Ta=25°C) Maximum Voltages Currents (Ta=25°C) VCBO Collector Base Voltage VCEO Collector Emitter Voltage VEBO Emitter Base Voltage Collector Current
Characteristics (Ta=25°C)
Symbol BVCBO BVCEO BVEBO ICBO *VCE(sat) VBE(on) *hFE Min. Typ. Max. Unit Test Conditions IC=10uA, IE=0 IC=1mA, IB=0 IE=10uA, IC=0 VCB=20V, IE=0 IC=0.8A, IB=80mA VCE=2V, IC=500mA VCE=2V, IC=500mA VCE=2V, IC=500mA VCB=10V, f=1MHz, IE=0
*Pulse Test: Pulse Width 380us, Duty Cycle2%
Classification
Rank Range 85-170 120-240
HSD468
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
1000 1000.0 VCE(sat) IC=10IB
Spec. HE6535 Issued Date 1992.11.25 Revised Date 2002.02.08 Page
Saturation Voltage Collector Current
Saturation Voltage (mV)
100.0
VCE=2V 1000 10.0
1000
Collector Current-IC (mA)
Collector Current-IC (mA)
Voltage Collector Current
1000
Cutoff Frequency
1000
Cutoff Frequency (MHz).
Voltage (mV)
VCE=2V
VBE(ON) VCE=2V
1000
1000
Collector Current-IC (mA)
Collector Current (mA)
Capacitance Reverse-Biased Voltage
10000 PT=1ms PT=100m
Safe Operating Area
Collector Current-IC (mA)
1000 PT=1s
Capacitance (pF)
1000
Reverse Biased Voltage
Forward Voltage-Vce
HSD468
HSMC Product Specification
Spec. HE6535 Issued Date 1992.11.25 Revised Date 2002.02.08 Page
Power Temperature Derating
1000
Reflow Profile
10+/-2
Power Dissipation (mW)
Temperature(
150+/-30 40+/-20
Case Temperature (°C)
Time(sec)
Temperature Profile Soldering
10+/-2
Temperature(
120+/-20
Time(sec)
HSD468
HSMC Product Specification
TO-92 Dimension
Date Code
Spec. HE6535 Issued Date 1992.11.25 Revised Date 2002.02.08 Page
Marking:
Rank Control Code
Style: 1.Emitter 2.Collector 3.Base
3-Lead TO-92 Plastic Package HSMC Package Code:
Typical
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27
Notes: 1.Dimension tolerance based Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material:
Lead: Alloy; solder plating Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSD468
HSMC Product Specification
Other recent searches
SHD519011 - SHD519011 SHD519011 Datasheet
PCI600 - PCI600 PCI600 Datasheet
MGI1253N - MGI1253N MGI1253N Datasheet
MGI1254 - MGI1254 MGI1254 Datasheet
MA2SD100G - MA2SD100G MA2SD100G Datasheet
LX5212 - LX5212 LX5212 Datasheet
IRG4BC10S - IRG4BC10S IRG4BC10S Datasheet
Privacy Policy | Disclaimer
© 2012 Datasheet Archive
