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FQT4N20 200V N-Channel MOSFET General Description These
Top Searches for this datasheetFQT4N20 FQT4N20 200V N-Channel MOSFET General Description These N-Channel enhancement mode power field effect transistors produced using Fairchild's proprietary, planar stripe, DMOS technology. This advanced technology been especially tailored minimize on-state resistance, provide superior switching performance, withstand high energy pulse avalanche commutation mode. These devices well suited high efficiency switching DC/DC converters, switch mode power supply, DC-AC converters uninterrupted power supply, motor control. Features 0.85A, 200V, RDS(on) @VGS gate charge typical Crss typical Fast switching Improved dv/dt capability SOT-223 Series Absolute Maximum Ratings Symbol VDSS VGSS dv/dt TSTG 25°C unless otherwise noted Parameter Drain-Source Voltage Continuous 25°C) Drain Current Continuous 70°C) Drain Current Pulsed (Note FQT4N20 0.85 0.68 (Note (Note (Note (Note Units V/ns W/°C Gate-Source Voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Power Dissipation 25°C) 0.85 0.22 0.018 +150 Derate above 25°C Operating Storage Temperature Range Maximum lead temperature soldering purposes, 1/8" from case seconds Thermal Characteristics Symbol Parameter Thermal Resistance, Junction-to-Ambient -Max Units °C/W When mounted minimum size recommended (PCB Mount) ©2001 Fairchild Semiconductor Corporation Rev. FQT4N20 Electrical Characteristics Symbol Parameter 25°C unless otherwise noted Test Conditions Units Characteristics BVDSS BVDSS IDSS IGSSF IGSSR Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage Current, Forward Gate-Body Leakage Current, Reverse Referenced 25°C 125°C -0.24 -100 V/°C Characteristics VGS(th) RDS(on) Gate Threshold Voltage Static Drain-Source On-Resistance Forward Transconductance VGS, 0.425 0.425 (Note -1.12 1.08 Dynamic Characteristics Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance -170 Switching Characteristics td(on) td(off) Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge (Note (Note Drain-Source Diode Characteristics Maximum Ratings Maximum Continuous Drain-Source Diode Forward Current Maximum Pulsed Drain-Source Diode Forward Current 0.85 Drain-Source Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge A/µs (Note 0.24 0.85 Notes: Repetitive Rating Pulse width limited maximum junction temperature 108mH, 0.85A, 50V, Starting 25°C 3.6A, di/dt 300A/µs, BVDSS, Starting 25°C Pulse Test Pulse width 300µs, Duty cycle Essentially independent operating temperature ©2001 Fairchild Semiconductor Corporation Rev. FQT4N20 Typical Characteristics Drain Current Drain Current Bottom Notes Pulse Test Notes Pulse Test Drain-Source Voltage Gate-Source Voltage Figure On-Region Characteristics Figure Transfer Characteristics RDS(on) Drain-Source On-Resistance Reverse Drain Current Notes Pulse Test Drain Current Source-Drain Voltage Figure On-Resistance Variation Drain Current Gate Voltage Figure Body Diode Forward Voltage Variation Source Current Temperature Ciss (Cds shorted) Coss Crss 100V 160V VGS, Gate-Source Voltage Ciss Capacitances [pF] Coss Crss Notes Note VDS, Drain-Source Voltage Total Gate Charge [nC] Figure Capacitance Characteristics Figure Gate Charge Characteristics ©2001 Fairchild Semiconductor Corporation Rev. FQT4N20 Typical Characteristics (Continued) (Normalized) Drain-Source Breakdown Voltage RDS(ON) (Normalized) Drain-Source On-Resistance Notes Notes 0.425 -100 -100 Junction Temperature Junction Temperature Figure Breakdown Voltage Variation Temperature Figure On-Resistance Variation Temperature Operation This Area Limited DS(on) Drain Current Notes Single Pulse Drain Current VDS, Drain-Source Voltage Case Temperature Figure Maximum Safe Operating Area Figure Maximum Drain Current Case Temperature (t), Figure Transient Thermal Response Curve ©2001 Fairchild Semiconductor Corporation Rev. FQT4N20 Gate Charge Test Circuit Waveform 200nF 300nF Same Type Charge Resistive Switching Test Circuit Waveforms rated td(on) td(off) Unclamped Inductive Switching Test Circuit Waveforms BVDSS BVDSS IAS2 BVDSS Time ©2001 Fairchild Semiconductor Corporation Rev. FQT4N20 Peak Diode Recovery dv/dt Test Circuit Waveforms Driver Same Type dv/dt controlled controlled pulse period Driver Gate Pulse Width -Gate Pulse Period Body Diode Forward Current di/dt Body Diode Reverse Current Body Diode Recovery dv/dt Body Diode Forward Voltage Drop ©2001 Fairchild Semiconductor Corporation Rev. FQT4N20 Package Dimensions SOT-223 0.08MAX MAX1.80 1.75 ±0.20 3.50 ±0.20 (0.60) 3.00 ±0.10 0.65 ±0.20 +0.04 0.06 -0.02 2.30 (0.95) 4.60 ±0.25 0.70 ±0.10 (0.95) 0.25 -0.05 +0.10 (0.60) 1.60 ±0.20 (0.46) ©2001 Fairchild Semiconductor Corporation (0.89) 6.50 ±0.20 Rev. 7.00 ±0.30 TRADEMARKS following registered unregistered trademarks Fairchild Semiconductor owns authorized intended exhaustive list such trademarks. Quiet SeriesDISCLAIMER FAST® OPTOPLANARPACMANPOPPowerTrench® QFETQSQT OptoelectronicsQuiet SeriesSLIENT SWITCHER® SMART STARTStealth SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTinyLogicUHCUltraFET® VCX FAIRCHILD SEMICONDUCTOR RESERVES RIGHT MAKE CHANGES WITHOUT FURTHER NOTICE PRODUCTS HEREIN IMPROVE RELIABILITY, FUNCTION DESIGN. FAIRCHILD DOES ASSUME LIABILITY ARISING APPLICATION PRODUCT CIRCUIT DESCRIBED HEREIN; NEITHER DOES CONVEY LICENSE UNDER PATENT RIGHTS, RIGHTS OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS AUTHORIZED CRITICAL COMPONENTS LIFE SUPPORT DEVICES SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL FAIRCHILD SEMICONDUCTOR CORPORATION. used herein: Life support devices systems devices systems which, intended surgical implant into body, support sustain life, whose failure perform when properly used accordance with instructions provided labeling, reasonably expected result significant injury user. critical component component life support device system whose failure perform reasonably expected cause failure life support device system, affect safety effectiveness. PRODUCT STATUS DEFINITIONS Definition Terms Datasheet Identification Advance Information Product Status Formative Design First Production Definition This datasheet contains design specifications product development. Specifications change manner without notice. This datasheet contains preliminary data, supplementary data will published later date. Fairchild Semiconductor reserves right make changes time without notice order improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves right make changes time without notice order improve design. This datasheet contains specifications product that been discontinued Fairchild semiconductor. datasheet printed reference information only. Preliminary Identification Needed Full Production Obsolete Production ©2001 Fairchild Semiconductor Corporation Rev. Other recent searchesSC9153 - SC9153 SC9153 Datasheet NNCD6 - NNCD6 NNCD6 Datasheet MTW7N80E - MTW7N80E MTW7N80E Datasheet MSC23B236A-xxBS8 - MSC23B236A-xxBS8 MSC23B236A-xxBS8 Datasheet KDS126E - KDS126E KDS126E Datasheet IS64LV6416AL - IS64LV6416AL IS64LV6416AL Datasheet HE9216-A - HE9216-A HE9216-A Datasheet FW100S4R0 - FW100S4R0 FW100S4R0 Datasheet FW150S4R0 - FW150S4R0 FW150S4R0 Datasheet
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