HIGH DENSITY MOUNTING HIGH VOLTAGE DARLINGTON OPTICALLY COUPLED ISOLAT

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HIGH DENSITY MOUNTING HIGH VOLTAGE DARLINGTON OPTICALLY COUPLED ISOLAT

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IS127
HIGH DENSITY MOUNTING HIGH VOLTAGE DARLINGTON OPTICALLY COUPLED ISOLATORS
DESCRIPTION IS127 optically coupled isolator consisting infrared light emitting diode high voltage silicon photo darlington which integral base-emitter resistor optimise switching speed elevated temperature characteristics space efficient dual line plastic package.
FEATURES
Marked FPH1.
Current Transfer Ratio MIN. 1000%
High collector-emitter voltage, Vceo=300V
Isolation Voltage (3.75kVRMS ,5.3kVPK electrical parameters 100% tested Drop replacement Toshiba TLP127
APPLICATIONS Computer terminals Industrial systems controllers Measuring instruments Signal transmission between systems different potentials impedances
ISOCOM COMPONENTS Unit 25B, Park View Road West, Park View Industrial Estate, Brenda Road Hartlepool, Cleveland, TS25 Tel: (01429) 863609 :(01429) 863581
22/4/02
ISOCOM 1024 Greenville Ave, Suite 240, Allen, 75002 Tel: (214) 495-0755 Fax: (214) 495-0901 e-mail info@isocom.com http://www.isocom.com
DB92863l-AAS/A3
ABSOLUTE MAXIMUM RATINGS (25°C unless otherwise specified) Storage Temperature -55°C 150°C Operating Temperature -55°C 100°C Lead Soldering Temperature (1/16 inch (1.6mm) from case secs) 260°C INPUT DIODE Forward Current Reverse Voltage Power Dissipation 50mA 70mW
OUTPUT TRANSISTOR Collector-emitter Voltage BVCEO Emitter-collector Voltage BVECO Power Dissipation POWER DISSIPATION Total Power Dissipation
(derate linearly 2.26mW/°C above 25°C)
300V 0.1V 150mW
170mW
ELECTRICAL CHARACTERISTICS 25°C Unless otherwise noted PARAMETER Input Forward Voltage (VF) Reverse Voltage (VR) Reverse Current (IR) Collector-emitter Breakdown (BVCEO) Emitter-collector Breakdown (BVECO) Collector-emitter Dark Current (ICEO) Coupled Current Transfer Ratio (CTR) UNITS 1000 TEST CONDITION 10mA 10µA 0.1mA 10uA 200V 20mA 100mA note note 500V (note 2mA,
Output
Collector-emitter Saturation VoltageVCE (SAT) Input Output Isolation Voltage VISO 3750 5300
VRMS
Input-output Isolation Resistance RISO 5x1010 Output Rise Time Output Fall Time
Note
Measured with input leads shorted together output leads shorted together.
22/4/02
DB92863l-AAS/A3
TAPING DIMENSIONS
Description Tape wide Pitch sprocket holes Distance compartment Distance compartment compartment
Symbol
Dimensions inches .217 .079 .315
12/07/01
Appendix Mini Flat Pack FPH-AAS/A1
CHARACTERISTIC CURVES
Fig.1 Forward Current Ambient Temperature
Fig.2 Collector Power Dissipation Ambient Temperature
Collector power dissipation (mW)
(mA)
Forward current
Ambient temperature
Ambient temperature
Fig.3 Collector-emitter saturation Voltage Forward current
Fig.4 Forward Current Forward Voltage
Collector-emitter saturation voltage (sat)
Forward current (mA)
10mA 30mA 50mA 70mA 100mA
Forward current (mA)
Forward voltage
Fig.5 Current Transfer Ratio Forward Current
7000
Fig.6 Collector Current Collector-emitter Voltage
10mA 2.5mA 1.5mA 1.5mA (MAX.)
Current transfer ratio
6000 5000 4000 3000 2000 1000
Collector current (mA)
0.5mA
Forward current (mA) Collector-emitter voltage CE(V)
12/07/01
Appendix Mini Flat Pack FPH-AAS/A1
CHARACTERISTIC CURVES
Fig.7 Relative Current Transfer Ratio Ambient Temperature
Fig.8 Collector-emitter Saturation Voltage Ambient Temperature
Collector-emitter saturation voltage (sat)
Relative current transfer ratio
20mA 100mA
Ambient temperature
Ambient temperature
Fig.9 Collector Dark Current Temperature
1000
Fig.10 Response Time Load Resistance
1000
(nA)
200V
Collector dark current
Response time
20mA
Ambient temperature
Load resistance
Fig.11 Frequency Response
Test Circuit Response Time
Input Output Input Output
20mA
Voltage gain (dB)
Test Circuit Frequency Response
Output
Frequency (kHz)
12/07/01
Appendix Mini Flat Pack FPH-AAS/A1
TEMPERATURE PROFILE SOLDERING REFLOW
time soldering reflow recommended within condition temperature time profile shown below.
seconds
minute
minutes minutes minute
When using another soldering method such infrated lamp, temperature rise partially mold device. Keep temperature package device within condition above (1).
12/07/01
Appendix Mini Flat Pack FPH-AAS/A1

HIGH DENSITY MOUNTING HIGH VOLTAGE DARLINGTON OPTICALLY COUPLED ISOLAT

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