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NDS0610 General Description These P-Channel enhancement mode
Top Searches for this datasheetNDS0610 NDS0610 General Description These P-Channel enhancement mode field effect transistors produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process been designed minimize onstate resistance, provide rugged reliable performance fast switching. They used, with minimum effort, most applications requiring 120mA deliver current This product particularly suited voltage applications requiring current high side switch. Features -0.12A, -60V. RDS(ON) RDS(ON) -4.5 Voltage controlled p-channel small signal switch High density cell design RDS(ON) High saturation current SOT-23 TA=25oC unless otherwise noted Absolute Maximum Ratings Symbol VDSS VGSS TSTG Drain-Source Voltage Gate-Source Voltage Drain Current Continuous Pulsed Maximum Power Dissipation Derate Above 25°C Parameter Ratings (Note Units mW/°C -0.12 0.36 +150 (Note Operating Storage Junction Temperature Range Maximum Lead Temperature Soldering Purposes, 1/16" from Case Seconds Thermal Characteristics Thermal Resistance, Junction-to-Ambient (Note °C/W Package Marking Ordering Information Device Marking Device NDS0610 Reel Size Tape width Quantity 3000 units 2002 Fairchild Semiconductor Corporation NDS0610 B(W) NDS0610 Electrical Characteristics Symbol BVDSS BVDSS IDSS IGSS 25°C unless otherwise noted Parameter Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage. (Note Test Conditions µA,Referenced 25°C Units mV/°C Characteristics -200 V,VGS 125°C Characteristics VGS(th) VGS(th) RDS(on) Gate Threshold Voltage Gate Threshold Voltage Temperature Coefficient Static Drain-Source On-Resistance On-State Drain Current Forward Transconductance VGS, mA,Referenced 25°C -0.5 -4.5 -0.25 V,ID -0.5 A,TJ=125°C -10V, -1.7 -3.5 mV/°C ID(on) -0.6 Dynamic Characteristics Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance (Note Switching Characteristics td(on) td(off) Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge 0.12 RGEN 12.6 -0.5 Drain-Source Diode Characteristics Maximum Ratings Maximum Continuous Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage Diode Reverse Recovery Time Diode Reverse Recovery Charge -0.24 A(Note -0.8 (Note -0.24 -1.5 -0.5A diF/dt A/µs Notes: junction-to-case case-to-ambient thermal resistance where case thermal reference defined solder mounting surface drain pins. guaranteed design while determined user's board design. 350°C/W when mounted minimum pad. Scale letter size paper Pulse Test: Pulse Width Duty Cycle 2.0% NDS0610 B(W) NDS0610 Typical Characteristics VGS=-10V -ID, DRAIN CURRENT -4.5V RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE -4.0V VGS=-3.0V -3.5V -4.0V -4.5V -6.0V -10V -6.0V -3.5V -3.0V -2.5V -VDS, DRAIN SOURCE VOLTAGE -ID, DRAIN CURRENT Figure On-Region Characteristics. Figure On-Resistance Variation with Drain Current Gate Voltage. RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE RDS(ON), ON-RESISTANCE (OHM) -0.5A -10V -0.25A 125oC 25oC -VGS, GATE SOURCE VOLTAGE JUNCTION TEMPERATURE Figure On-Resistance Variation with Temperature. Figure On-Resistance Variation with Gate-to-Source Voltage. -55oC 125oC -ID, DRAIN CURRENT -VGS, GATE SOURCE VOLTAGE -IS, REVERSE DRAIN CURRENT -10V 25oC 125oC 25oC 0.01 -55oC 0.001 0.0001 -VSD, BODY DIODE FORWARD VOLTAGE Figure Transfer Characteristics. Figure Body Diode Forward Voltage Variation with Source Current Temperature. NDS0610 B(W) NDS0610 Typical Characteristics -VGS, GATE-SOURCE VOLTAGE -0.5A -48V -12V -24V CISS CAPACITANCE (pF) COSS CRSS GATE CHARGE (nC) -VDS, DRAIN SOURCE VOLTAGE Figure Gate Charge Characteristics. P(pk), PEAK TRANSIENT POWER Figure Capacitance Characteristics. -ID, DRAIN CURRENT 100us RDS(ON) LIMIT 10ms 100ms -10V SINGLE PULSE 350oC/W 25oC SINGLE PULSE 350°C/W 25°C 0.01 0.001 -VDS, DRAIN-SOURCE VOLTAGE 0.01 TIME (sec) Figure Maximum Safe Operating Area. Figure Single Pulse Maximum Power Dissipation. r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE RJA(t) r(t) 350oC/W P(pk) RJA(t) Duty Cycle, 0.05 0.02 0.01 0.01 SINGLE PULSE 0.001 0.0001 0.001 0.01 TIME (sec) 1000 Figure Transient Thermal Response Curve. Thermal characterization performed using conditions described Note Transient thermal response will change depending circuit board design. NDS0610 B(W) TRADEMARKS following registered unregistered trademarks Fairchild Semiconductor owns authorized intended exhaustive list such trademarks. ACEx ActiveArray Bottomless CoolFET CROSSVOLT DOME EcoSPARK E2CMOSEnSigna FACT FACT Quiet Series FASTr FRFET GlobalOptoisolator HiSeC Across board. Around world. Power Franchise DISCLAIMER ImpliedDisconnect PACMAN ISOPLANAR Power247 LittleFET MicroFET QFET MicroPak MICROWIRE Optoelectronics Quiet Series MSXPro RapidConfigure RapidConnect OCXPro SILENT SMART START OPTOPLANAR Stealth SuperSOT-3 SuperSOT-6 SuperSOT-8 SyncFET TinyLogic TruTranslation FAIRCHILD SEMICONDUCTOR RESERVES RIGHT MAKE CHANGES WITHOUT FURTHER NOTICE PRODUCTS HEREIN IMPROVE RELIABILITY, FUNCTION DESIGN. FAIRCHILD DOES ASSUME LIABILITY ARISING APPLICATION PRODUCT CIRCUIT DESCRIBED HEREIN; NEITHER DOES CONVEY LICENSE UNDER PATENT RIGHTS, RIGHTS OTHERS. LIFE SUPPORT POLICY FAIRCHILDS PRODUCTS AUTHORIZED CRITICAL COMPONENTS LIFE SUPPORT DEVICES SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL FAIRCHILD SEMICONDUCTOR CORPORATION. used herein: critical component component life Life support devices systems devices support device system whose failure perform systems which, intended surgical implant into reasonably expected cause failure life body, support sustain life, whose support device system, affect safety failure perform when properly used accordance with instructions provided labeling, effectiveness. reasonably expected result significant injury user. PRODUCT STATUS DEFINITIONS Definition Terms Datasheet Identification Advance Information Product Status Formative Design First Production Definition This datasheet contains design specifications product development. Specifications change manner without notice. This datasheet contains preliminary data, supplementary data will published later date. Fairchild Semiconductor reserves right make changes time without notice order improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves right make changes time without notice order improve design. This datasheet contains specifications product that been discontinued Fairchild semiconductor. datasheet printed reference information only. Preliminary Identification Needed Full Production Obsolete Production Rev. 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