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NDS351AN N-Channel, Logic Level, PowerTrench® MOSFET General
Top Searches for this datasheetNDS351AN NDS351AN N-Channel, Logic Level, PowerTrench® MOSFET General Description These N-Channel Logic Level MOSFETs produced using Fairchild Semiconductor's advanced PowerTrench process that been especially tailored minimize on-state resistance maintain superior switching performance. These devices particularly suited voltage applications notebook computers, portable phones, PCMCIA cards, other battery powered circuits where fast switching, in-line power loss needed very small outline surface mount package. Features RDS(ON) RDS(ON) Ultra-Low gate charge Industry standard outline SOT-23 surface mount package using proprietary SuperSOTTM-3 design superior thermal electrical capabilities High performance trench technology extremely RDS(ON) SuperSOT TA=25oC unless otherwise noted Absolute Maximum Ratings Symbol VDSS VGSS TSTG Drain-Source Voltage Gate-Source Voltage Drain Current Continuous Pulsed Parameter Ratings (Note Units 0.46 +150 Power Dissipation Single Operation (Note (Note Operating Storage Junction Temperature Range Thermal Characteristics Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case (Note (Note °C/W Package Marking Ordering Information Device Marking 351A Device NDS351AN Reel Size Tape width Quantity 3000 units ©2003 Fairchild Semiconductor Corporation NDS351AN E(W) NDS351AN Electrical Characteristics Symbol BVDSS BVDSS IDSS IGSS 25°C unless otherwise noted Parameter Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage (Note Test Conditions Units Characteristics µA,Referenced 25°C ±100 mV/°C 55°C Characteristics VGS(th) VGS(th) RDS(on) Gate Threshold Voltage Gate Threshold Voltage Temperature Coefficient Static Drain-Source On-Resistance On-State Drain Current Forward Transconductance VGS, mV/°C µA,Referenced 25°C 125°C 4.5V, ID(on) Dynamic Characteristics Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance (Note Switching Characteristics td(on) td(off) Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge RGEN Drain-Source Diode Characteristics Maximum Ratings Maximum Continuous Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage Diode Reverse Recovery Time Diode Reverse Recovery Charge 0.42 (Note 0.42 diF/dt A/µs Notes: junction-to-case case-to-ambient thermal resistance where case thermal reference defined solder mounting surface drain pins. guaranteed design while determined user's board design. 250°C/W when mounted 0.02 copper. 270°C/W when mounted minimum pad. Scale letter size paper Pulse Test: Pulse Width Duty Cycle 2.0% NDS351AN E(W) NDS351AN Typical Characteristics 6.0V DRAIN CURRENT 4.5V RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE 3.5V 3.5V 4.0V 4.5V 5.0V 6.0V 3.0V VDS, DRAIN SOURCE VOLTAGE DRAIN CURRENT Figure On-Region Characteristics. Figure On-Resistance Variation with Drain Current Gate Voltage. 0.25 RDS(ON), ON-RESISTANCE (OHM) RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE 1.4A 0.7A 0.225 0.175 125oC 0.15 0.125 0.075 25oC JUNCTION TEMPERATURE VGS, GATE SOURCE VOLTAGE Figure On-Resistance Variation with Temperature. REVERSE DRAIN CURRENT Figure On-Resistance Variation with Gate-to-Source Voltage. DRAIN CURRENT 125oC 25oC 0.01 125oC 25oC -55oC VGS, GATE SOURCE VOLTAGE -55oC 0.001 0.0001 VSD, BODY DIODE FORWARD VOLTAGE Figure Transfer Characteristics. Figure Body Diode Forward Voltage Variation with Source Current Temperature. NDS351AN E(W) NDS351AN Typical Characteristics VGS, GATE-SOURCE VOLTAGE =1.4A CAPACITANCE (pF) CISS COSS CRSS GATE CHARGE (nC) VDS, DRAIN SOURCE VOLTAGE Figure Gate Charge Characteristics. P(pk), PEAK TRANSIENT POWER Figure Capacitance Characteristics. DRAIN CURRENT RDS(ON) LIMIT 10ms 100ms SINGLE PULSE 270oC/W 25oC 100µs SINGLE PULSE 270°C/W 25°C 0.01 VDS, DRAIN-SOURCE VOLTAGE 0.01 1000 TIME (sec) Figure Maximum Safe Operating Area. Figure Single Pulse Maximum Power Dissipation. r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE RJA(t) r(t) P(pk) RJA(t) Duty Cycle, 0.05 0.02 0.01 0.01 SINGLE PULSE 0.001 0.0001 0.001 0.01 TIME (sec) 1000 Figure Transient Thermal Response Curve. Thermal characterization performed using conditions described Note Transient thermal response will change depending circuit board design. NDS351AN E(W) TRADEMARKS following registered unregistered trademarks Fairchild Semiconductor owns authorized intended exhaustive list such trademarks. ACExFACT Quiet SeriesActiveArrayFAST board. Around world.The Power FranchiseProgrammable Active DroopDISCLAIMER OPTOPLANARPACMANPOP Power247PowerTrench QFET QSQT OptoelectronicsQuiet SWITCHER SMART STARTSPMStealthSuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTinyLogic VCX FAIRCHILD SEMICONDUCTOR RESERVES RIGHT MAKE CHANGES WITHOUT FURTHER NOTICE PRODUCTS HEREIN IMPROVE RELIABILITY, FUNCTION DESIGN. FAIRCHILD DOES ASSUME LIABILITY ARISING APPLICATION PRODUCT CIRCUIT DESCRIBED HEREIN; NEITHER DOES CONVEY LICENSE UNDER PATENT RIGHTS, RIGHTS OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS AUTHORIZED CRITICAL COMPONENTS LIFE SUPPORT DEVICES SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL FAIRCHILD SEMICONDUCTOR CORPORATION. used herein: critical component component life Life support devices systems devices support device system whose failure perform systems which, intended surgical implant into reasonably expected cause failure life body, support sustain life, whose support device system, affect safety failure perform when properly used accordance with instructions provided labeling, effectiveness. reasonably expected result significant injury user. PRODUCT STATUS DEFINITIONS Definition Terms Datasheet Identification Advance Information Product Status Formative Design Definition This datasheet contains design specifications product development. Specifications change manner without notice. This datasheet contains preliminary data, supplementary data will published later date. Fairchild Semiconductor reserves right make changes time without notice order improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves right make changes time without notice order improve design. Preliminary First Production Identification Needed Full Production Obsolete Production This datasheet contains specifications product that been discontinued Fairchild semiconductor. datasheet printed reference information only. Rev. Other recent searchesTM6521 - TM6521 TM6521 Datasheet TC74HCT04AP - TC74HCT04AP TC74HCT04AP Datasheet TC74HCT04AF - TC74HCT04AF TC74HCT04AF Datasheet TC74HCT04AFN - TC74HCT04AFN TC74HCT04AFN Datasheet STRH12P10ESY1 - STRH12P10ESY1 STRH12P10ESY1 Datasheet STRH12P10ESY3 - STRH12P10ESY3 STRH12P10ESY3 Datasheet SD1460 - SD1460 SD1460 Datasheet Q48T20033 - Q48T20033 Q48T20033 Datasheet CM150DU-34K - CM150DU-34K CM150DU-34K Datasheet 2SB628 - 2SB628 2SB628 Datasheet
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