HS-1840RH Rad-Hard Channel CMOS Analog Multiplexer with High-Z An

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HS-1840RH Rad-Hard Channel CMOS Analog Multiplexer with High-Z An

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-1840
HS-1840RH
Rad-Hard Channel CMOS Analog Multiplexer with High-Z Analog Input Protection
Description
HS-1840RH radiation hardened, monolithic channel multiplexer constructed with Harris Linear Dielectric Isolation CMOS process. designed provide high input impedance analog source device power fails (open) analog signal voltage inadvertently exceeds supply rails during powered operation. Excellent redundant applications, since secondary device operated standby unpowered mode affording additional power drain. More significantly, very high impedance exists between active inactive devices preventing interaction. sixteen channel selection controlled 4-bit binary address plus Enable-Inhibit input which conveniently controls ON/OFF operation several multiplexers system. digital inputs have electrostatic discharge protection.
PKG.
Features
Radiation Environment Gamma Rate RAD(Si)/s (HS-1840RH) Gamma Dose RAD(Si) bject (Rad-Hard Power Consumption Channel CMOS Analog tiplexer High-Z Analog Input Protection) Fast Access Time 1000ns thor High Analog Input Impedance 500M During Power Loss (Open) ywords Dielectrically Isolated Device Islands eator Excellent Hi-Rel Redundant Systems OCINFO pdfmark Break-Before-Make Switching Latch-Up ageMode /UseOutlines
PART NUMBER HS1-1840RH-Q HS1-1840RH-8 HS1-1840RH/Proto HS1-1840RH/Sample HS9-1840RH-Q HS9-1840RH-8 HS9-1840RH/Proto HS9-1840RH/Sample TEMP. RANGE (oC)
Ordering Information OCVIEW pdfmark
PACKAGE CERDIP CERDIP CERDIP CERDIP
HS-1840RH been specifically designed meet exposure radiation environments. available lead Ceramic Sidebraze dual-in-line package lead Ceramic Flatpack. guaranteed operational from -55oC +125oC.
Pinouts
HS1-1840RH LEAD SIDEBRAZE CERDIP CASE OUTLINE GDIP1-T28, COMPLIANT MIL-STD1835 PACKAGE VIEW
(+5VS) VREF ADDR ENABLE ADDR ADDR ADDR
HS9-1840RH LEAD CERAMIC SIDEBRAZE CASE FLATPACK OUTLINE CDFP3-F28, COMPLIANT MIL-STD-1835 PACKAGE VIEW
(+5VS) VREF ADDR ENABLE ADDR ADDR ADDR
CAUTION: These devices sensitive electrostatic discharge. Users should follow proper Handling Procedures. Copyright
Harris Corporation 1997
File Number Spec Number
3992.1 518022
HS-1840RH Functional Diagram
DIGITAL ADDRESS
ADDRESS INPUT BUFFER LEVEL SHIFTER
DECODERS
MULTIPLEX SWITCHES
Truth Table
"ON" CHANNEL None
Spec Number
518022
Specifications HS-1840RH
Absolute Maximum Ratings
Supply Voltage Between Pins +40V +VSUPPLY Ground +20V -VSUPPLY Ground .-20V VREF Ground +20V Analog Input Overvoltage +25V (Power On/Off) -25V (Power On/Off) Digital Input Overvoltage +VEN, VREF -VEN, Continuous Current 10mA Storage Temperature Range -65oC +150oC Junction Temperature +175oC Lead Temperature (Soldering 10s) +275oC
Reliability Information
Thermal Resistance Sidebraze Package 83.1oC/W 19.1oC/W Flatpack Package 49.1oC/W 16.5oC/W Total Power Dissipation (Note) Sidebraze CerDIP Package 1600mW Ceramic Flatpack Package 1400mW Classification. Class NOTE: Derate 20.4mW/oC above +95oC Flatpack Derate 18.5mW/oC above +95oC
CAUTION: Stresses above those listed "Absolute Maximum Ratings" cause permanent damage device. This stress only rating operation device these other conditions above those indicated operational sections this specification implied.
Operating Conditions
Operating Supply Voltage (±VSUPPLY) ±15V Operating Temperature Range -55oC +125oC VREF (Pin Logic Level (VAL). +0.8V Logic High Level (VAH) +4.0V
TABLE ELECTRICAL PERFORMANCE CHARACTERISTICS Device Guaranteed 100% Tested. Unless Otherwise Specified: -15V, +15V, VREF +5V, +4.0V, 0.8V GROUP SUBGROUPS Measure Inputs Sequentially Ground Unused Pins +10V, Unused Inputs Output -10V, -10V, Unused Inputs, Output +10V, VREF, A3,A4, GND, Unused Inputs Tied GND, +25V +25V, Unused Inputs Tied -25V, Unused Inputs Tied +10V, Unused Inputs -10V -10V, Unused Inputs +10V +25V, Measure Unused Inputs -25V, Measure Unused Inputs LIMITS TEMPERATURE -55oC, +25oC, +125oC Input Leakage Current, Address, Enable Pins Leakage Current Into Source Terminal "Off" Switch +IS(OFF) -55oC, +25oC, +125oC +25oC +125oC,-55oC +25oC +125oC, -55oC -1000 1000 UNITS
PARAMETER Analog Signal Range
SYMBOL
CONDITIONS
-100 -100 -100
-IS(OFF)
Leakage Current into Source Terminal "Off" Switch With Power "Off" Leakage Current Into Source Terminal "Off" Switch With Overvoltage Applied Leakage Current Into Drain Terminal "Off" Switch
+IS(OFF) Power
+25oC +125oC, -55oC
+IS(OFF) Overvoltage -IS(OFF) Overvoltage +ID(OFF)
-55oC, +25oC, +125oC -55oC, +25oC, +125oC +25oC +125oC, -55oC
-1000 -1000 -100 -100 -1000
1000 1000 1000
-ID(OFF)
+25oC +125oC, -55oC, -55oC
Leakage Current Into Drain Terminal "Off" Switch With Overvoltage Applied
+ID(OFF) Overvoltage -ID(OFF) Overvoltage
+25oC,
+125oC -55oC, +25oC, +125oC -1000 1000
Spec Number
518022
Specifications HS-1840RH
TABLE ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) Device Guaranteed 100% Tested. Unless Otherwise Specified: -15V, +15V, VREF +5V, +4.0V, 0.8V GROUP SUBGROUPS LIMITS TEMPERATURE +25oC +125oC, -55oC -100 -100 -0.5 -0.5 1000 4000 2500 UNITS
PARAMETER Leakage Current from "On" Driver into Switch (Drain Source)
SYMBOL +ID(ON)
CONDITIONS +10V, +10V, 0.8V Unused Inputs -10V -10V, -10V, 0.8V, Unused Inputs +10V +15V, -1mA, 0.8V -5V, +1mA, 0.8V +5V, -1mA, 0.8V 0.8V 0.8V 4.0V 4.0V
-ID(ON)
+25oC +125oC, -55oC, -55oC
Switch Resistance
+15V R(ON) R(ON) R(ON)
+25oC,
+125oC -55oC, +25oC, +125oC -55oC, +25oC, +125oC -55oC, +25oC, +125oC -55oC, +25oC, +125oC -55oC, +25oC, +125oC -55oC, +25oC, +125oC
Positive Supply Current Negative Supply Current Positive Standby Supply Current Negative Standby Supply Current
I(+) I(-) +ISBY -ISBY
TABLE ELECTRICAL PERFORMANCE CHARACTERISTICS Device Guaranteed 100% Tested. Unless Otherwise Specified: -15V, +15V, VREF +5V, +4.0V, 0.8V GROUP SUBGROUPS TON(A), TOFF(A) TON(EN), TOFF(EN) 10k, 50pF 1000, 50pF LIMITS TEMPERATURE +25oC +125oC, -55oC 1000 1000 UNITS
PARAMETER Break-Before-Make Time Delay Propagation Delay Times: Address Inputs Channels Enable
SYMBOL
CONDITIONS 1000, 50pF
+25oC +125oC, -55oC
+25oC +125oC, -55oC
TABLE ELECTRICAL PERFORMANCE CHARACTERISTICS Device Characterized -15V, +15V, VREF +5V, +4.0V, 0.8V, Unless Otherwise Specified LIMITS PARAMETER Capacitance Address Input Capacitance Channel Input Capacitance Channel Output Isolation SYMBOL CS(OFF) CD(OFF) TOFF(EN) VISO CONDITIONS 1MHz 1MHz 1MHz 4.0V, 200kHz, 7pF, 3.0VRMS NOTE TEMPERATURE +25oC +25oC +25oC +25oC UNITS
NOTE: parameters listed Table controlled design process parameters directly tested. These parameters characterized upon initial design after major process and/or design changes.
Spec Number
518022
Specifications HS-1840RH
TABLE POST 200K RAD(Si) ELECTRICAL CHARACTERISTICS Tested, MIL-STD-883. Unless Otherwise Specified: -15V, +15V, VREF +5V, +4.5V, 0.5V GROUP SUBGROUPS LIMITS TEMPERATURE +25oC +25oC +25oC +25oC -1000 -100 -100 -100 1000 UNITS
PARAMETER Input Leakage Current, Address, Enable Pins Leakage Current Into Source Terminal "Off" Switch
SYMBOL +IS(OFF) -IS(OFF) +IS(OFF) Power
CONDITIONS Measure Inputs Sequentially, Ground Unused Pins +10V, Unused Inputs Output -10V, 4.5V -10V, Unused Inputs Output +10V, 4.5V VREF, GND, Unused Inputs Tied GND, +25V +25V, 4.5V Unused Inputs Tied -25V, 4.5V Unused Inputs Tied +10V, 4.5V Unused Inputs -10V -10V, 4.5V Unused Inputs +10V +25V, Measure 4.5V Unused Inputs -25V, Measure 4.5V Unused Inputs +10V, +10V, 0.5V Unused Inputs -10V -10V, -10V, 0.5V Unused Inputs +10V +15V, -1mA, 0.5V -5V, +1mA, 0.5V +5V, -1mA, 0.5V 0.5V 0.5V 4.5V 4.5V 1000, 50pf 10K, 50pf
Leakage Current into Source Terminal "Off" Switch With Power "Off" Leakage Current Into Source Terminal "Off" Switch With Overvoltage Applied Leakage Current Into Drain Terminal "Off" Switch
+IS(OFF) Overvoltage -IS(OFF) Overvoltage +ID(OFF) -ID(OFF) +ID(OFF) Overvoltage -ID(OFF) Overvoltage +ID(ON)
+25oC +25oC +25oC +25oC +25oC
-1500 -1500 -100 -100 -1000
1500 1500 1000
Leakage Current Into Drain Terminal "Off" Switch With Overvoltage Applied
+25oC
-1000
1000
Leakage Current from "On" Driver into Switch (Drain Source)
+25oC
-100
-ID(ON)
+25oC
-100
Switch Resistance
+15V R(ON) R(ON) R(ON)
+25oC +25oC +25oC +25oC +25oC +25oC +25oC +25oC +25oC
-0.50 -0.50
1000 4000 2500 0.50 0.50 3000
Positive Supply Current Negative Supply Current Positive Standby Supply Current Negative Standby Supply Current Make-Before-Break Time Delay Propagation Delay Times: Address Inputs Channels Enable
I(+) I(-) +I(SBY) -I(SBY) TOFF (EN) TOFF (EN)
1000, 50pf
+25oC
3000
Spec Number
518022
Specifications HS-1840RH
TABLE POST BURN-IN DELTA ELECTRICAL CHARACTERISTICS Guaranteed, MIL-STD-883, Method 1019. Unless Otherwise Specified: -15V, +15V, VREF +5V, +4.0V, 0.8V GROUP SUBGROUPS LIMITS TEMPERATURE +25oC -100 UNITS
PARAMETER Input Leakage Current, Address, Enable Pins Leakage Current Into Source Terminal "Off" Switch
SYMBOL +IS(OFF) -IS(OFF) +ID(OFF) -ID(OFF) ID(ON)
CONDITIONS Measure Inputs Sequentially, Ground Unused Pins +10V, Unused Inputs Output -10V, 4.0V -10V, Unused Inputs Output +10V, 4.0V +10V, 4.0V Unused Inputs -10V -10V, 4.0V Unused Inputs +10V +10V, +10V, 0.8V Unused Inputs -10V -10V, -10V, 0.8V Unused Inputs +10V +15V, -1mA, 0.8V -5V, +1mA, 0.8V 0.8V 0.8V 4.0V 4.0V
+25oC +25oC +25oC +25oC +25oC
Leakage Current Into Drain Terminal "Off" Switch
Leakage Current from "On" Driver into Switch (Drain Source)
-ID(ON)
+25oC
Switch Resistance
+15V R(ON) R(ON)
+25oC +25oC +25oC +25oC +25oC +25oC
-150 -250
Positive Supply Current Negative Supply Current Positive Standby Supply Current Negative Standby Supply Current
I(+) I(-) +ISBY -ISBY
TABLE APPLICABLE SUBGROUPS CONFORMANCE GROUPS Initial Test Interim Test Final Test Group Group Others Group Group Group Subgroup METHOD 100%/5004 100%/5004 100%/5004 100%/5004 Samples/5005 Samples/5005 Samples/5005 Samples/5005 Samples/5005 Samples/5005 SUBGROUPS SUBGROUPS
Spec Number
518022
HS-1840RH Performance Characteristics Test Circuits
ACCESS TIME LOGIC LEVEL (HIGH)
4.0V 0.8V
0.8V
15V,
VOUT
VOUT
50pF
BREAK-BEFORE-MAKE DELAY (tOPEN)
4.0V
VOUT
0.8V
0.8V
VOUT 50pF
tOPEN
ENABLE DELAY (tON(EN), tOFF(EN))
4.0V 0.8V OUTPUT VOUT 50pF +10V
VOUT tON(EN)
tOFF(EN)
Spec Number
518022
HS-1840RH Burn-In/Life Test Circuits
DYNAMIC BURN-IN LIFE TEST CIRCUIT NOTES: +15.5V ±0.5V, -15.5V ±0.5V 0.01µF ±10%, each socket, minimum 1N4002, each board, minimum Input Signals: square wave, duty cycle, peak ±10% 100kHz; F1/2; F1/4; F1/8; F1/16 NOTES: above test circuits utilized package types. Dynamic Test Circuit utilized life testing. NOTES:
STATIC BURN-IN TEST CIRCUIT ±5%, 1/4W 0.01µF minimum, each socket, minimum 15.5V ±0.5V, -15.5V ±0.5V, 15.5 ±0.5V
Irradiation Circuit
HS-1840RH LEAD
+15V
-15V
NOTE: irradiation testing performed lead CerDIP package.
Spec Number
518022
HS-1840RH Schematic Diagrams
ADDRESS INPUT BUFFER LEVEL SHIFTER
LEVEL SHIFTER LEVEL SHIFTED ADDRESS DECODE LEVEL SHIFTED ADDRESS DECODE
OVERVOLTAGE PROTECTION
ADDRESS DECODER
MULTIPLEX SWITCH
SWITCH
FROM DECODE
ENABLE
Spec Number
518022
HS-1840RH Harris Space Level Product Flow
Traceable Diffusion Method 2018, Modified This device does meet MIL-STD-883 Method 2018.3 Class minimum metal step coverage 50%. metal does meet intent Class requirement meeting current density requirement <2E5 A/cm2. Calculation based continuous current 10mA. Data provided upon request. Wafer Acceptance Method 5007 Internal Visual Inspection (Note Gamma Radiation Assurance Tests Method 1019 100% Nondestructive Bond Pull Method 2023 Customer Pre-Cap Visual Inspection (Notes Temperature Cycling Method 1010 Condition Constant Acceleration Method 2001 30KG Particle Impact Noise Detection Method 2020, Condition Marking Serialization X-Ray Inspection Method 2012 Initial Electrical Tests (T0) Static Burn-In Hour, +125oC (Min) Method 1015 Condition
NOTES: Visual Inspection performed MIL-STD-883 Method 2010, Condition These steps optional, should listed purchase order required. Data package contains: Assembly Attributes (post seal) Test Attributes (includes Group -55oC, +25oC, +125oC Shippable Serial Number List Radiation Testing Certificate Conformance Wafer Acceptance Report (includes report) X-Ray Report Film Test Variables Data, (Table Parameters only) +25oC Initial Test +25oC Interim Test +25oC Interim Test +25oC Delta Over Burn-In Group data package contains Attributes Data Variables Data, (Table Parameters only). Group data package contains Attributes only.
Room Temperature Electrical Tests (T1) Burn-In Delta Calculation (T0-T1) Calculation Functional Subgroups Dynamic Burn-In Hours +125oC equivalent Method 1015 Condition Electrical Tests Subgroups (T2) Burn-In Delta Calculation Calculation Functional Subgroups Electrical Test +125oC, -55oC Alternate Group Inspection Method 5005 Fine Gross Leak Tests Method 1014 Customer Source Inspection (Note Group Inspection (Notes Method 5005 Group Inspection (Notes Method 5005 External Visual Inspection Method 2009 Data Package Generation (Note
Harris Product Flow
Internal Visual Inspection, Alternate Condition (Note Gamma Radiation Assurance Tests Method 1019 Customer Pre-Cap Visual Inspection (Notes Temperature Cycling Method 1010 Condition Cycles) Constant Acceleration Method 2001 30kG Fine Gross Leak Tests Method 1014 Marking Initial Electrical Tests (T0) Dynamic Burn-In Hours, +125oC Method 1015 Equivalent Condition
NOTES: Visual inspection performed MIL-STD-883 Method 2010, Alternate Condition These steps optional, should listed purchase order required. Data Package Contents: Test Attributes (including Group -55oC, +25oC, +125oC Radiation Testing Certificate Conformance Group data package contains Attributes Data only.
Electrical Tests Subgroups (T1) Method 5004 Calculation Subgroups Method 5004 Electrical Test +125oC, -55oC Method 5004 Alternate Group Inspection Method 5005 Customer Source Inspection (Note Group Inspection (Notes Method 5005 (Optional) Group Inspection (Notes Method 5005 (Optional) Group Inspection (Notes Method 5005 (Optional) External Visual Inspection Method 2009 Data Package Generation (Note
Spec Number
518022
HS-1840RH Metallization Topology
DIMENSIONS: 11mils METALLIZATION: Type: Thickness: GLASSIVATION: Type: SiO2 Thickness: ATTACH: Material: Gold Eutectic Temperature: Sidebrazed CerDIP 460oC (Max) Flatpack 460oC (Max) WORST CASE CURRENT DENSITY: Modified LEAD TEMPERATURE (10s Soldering): <275oC PROCESS: CMOS-DI
Metallization Mask Layout
HS-1840RH
ENABLE
VREF
IN16
IN15
IN14
IN13
IN12
IN11
IN10
Spec Number
518022
HS-1840RH Ceramic Dual-In-Line Frit Seal Packages (CerDIP)
-A-DBASE METAL -Bbbb BASE PLANE SEATING PLANE SECTION LEAD FINISH
F28.6 MIL-STD-1835 GDIP1-T28 (D-10, CONFIGURATION
LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE INCHES SYMBOL 0.014 0.014 0.045 0.023 0.008 0.008 0.500 0.232 0.026 0.023 0.065 0.045 0.018 0.015 1.490 0.610 MILLIMETERS 0.36 0.36 1.14 0.58 0.20 0.20 12.70 5.92 0.66 0.58 1.65 1.14 0.46 0.38 37.85 15.49 NOTES Rev. 4/94
eA/2
eA/2
0.100 0.600 0.300 0.125 0.015 0.005 0.200 0.060 105o 0.015 0.030 0.010 0.0015
2.54 15.24 7.62 3.18 0.38 0.13 5.08 1.52 105o 0.38 0.76 0.25 0.038
NOTES: Index area: notch identification mark shall located adjacent shall located within shaded area shown. manufacturer's identification shall used identification mark. maximum limits lead dimensions shall measured centroid finished lead surfaces, when solder plate lead finish applied. Dimensions apply lead base metal only. Dimension applies lead plating finish thickness. Corner leads N/2, N/2+1) configured with partial lead paddle. this configuration dimension replaces dimension This dimension allows off-center lid, meniscus, glass overrun. Dimension shall measured from seating plane base plane. Measure dimension four corners. maximum number terminal positions. Dimensioning tolerancing ANSI Y14.5M 1982. Controlling dimension: INCH.
Spec Number
518022
HS-1840RH Ceramic Metal Seal Flatpack Packages (Flatpack)
K28.A MIL-STD-1835 CDFP3-F28 (F-11A, CONFIGURATION
LEAD CERAMIC METAL SEAL FLATPACK PACKAGE INCHES SYMBOL 0.045 0.015 0.015 0.004 0.004 0.460 0.180 0.030 0.115 0.022 0.019 0.009 0.006 0.740 0.520 0.550 MILLIMETERS 1.14 0.38 0.38 0.10 0.10 11.68 4.57 0.76 1.27 0.20 6.35 0.66 0.00 0.38 9.40 1.14 0.04 2.92 0.56 0.48 0.23 0.15 18.80 13.21 13.97 NOTES Rev. 5/18/94
AREA
0.004
0.036
-D-H-
LEAD FINISH
0.050 0.008 0.250 0.026 0.00 0.015 0.370 0.045 0.0015
SEATING BASE PLANE
BASE METAL SECTION
NOTES: Index area: notch identification mark shall located adjacent shall located within shaded area shown. manufacturer's identification shall used identification mark. Alternately, (dimension used identify one. identification mark used addition tab, limits dimension apply. This dimension allows off-center lid, meniscus, glass overrun. Dimensions apply lead base metal only. Dimension applies lead plating finish thickness. maximum limits lead dimensions shall measured centroid finished lead surfaces, when solder plate lead finish applied. maximum number terminal positions. Measure dimension four corners. bottom-brazed lead packages, organic polymeric materials shall molded bottom package cover leads. Dimension shall measured point exit (beyond meniscus) lead from body. Dimension minimum shall reduced 0.0015 inch (0.038mm) maximum when solder lead finish applied. Dimensioning tolerancing ANSI Y14.5M 1982. Controlling dimension: INCH.
Spec Number
518022

HS-1840RH Rad-Hard Channel CMOS Analog Multiplexer with High-Z An

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