2.7V 5.5V Single Supply CMOS Amps Specifications rated from 2.7V
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MCP601/602/603/604
2.7V 5.5V Single Supply CMOS Amps
Specifications rated from 2.7V 5.5V supplies Rail-to-rail swing output Common-mode input swing below ground 2.8MHz GBWP Unity gain stable power 325µA Chip Select capability with MCP603 Industrial temperature range (-40°C 85°C) Available single, dual quad
PACKAGES
MCP601
PDIP, SOIC, TSSOP
MCP602
PDIP, SOIC, TSSOP
OUTA -INA +INA
OUTB -INB +INB
APPLICATIONS
Portable Equipment Converter Driver Photodiode Pre-amps Analog Filters Data Acquisition Notebooks PDAs Sensor Interface
MCP603
PDIP, SOIC, TSSOP
OUTA -INA +INA +INB -INB OUTB
MCP604
PDIP, SOIC, TSSOP
OUTD
-IND +IND +INC
-INC OUTC
AVAILABLE TOOLS
Spice Macromodels www.microchip.com) FilterLabSoftware www.microchip.com)
1999 Microchip Technology Inc.
TYPICAL APPLICATION
DESCRIPTION
Microchip Technology Inc. MCP601/602/603/604 family power operational amplifiers offered single (MCP601), single with Chip Select feature (MCP603), dual (MCP602) quad (MCP604) configurations. These operational amplifiers amps) utilize advanced CMOS technology, which provides bias current, high speed operation, high open-loop gain rail-to-rail output swing. This product offering operates with single supply voltage that 2.7V, while drawing less than 325µA quiescent current. addition, common-mode input voltage range goes 0.3V below ground, making these amplifiers ideal single supply operation. These devices appropriate low-power battery operated circuits quiescent current, Converter driver amplifiers because their wide bandwidth, anti-aliasing filters virtue their input bias current.
VOUT
MCP60X
VREF Input Bias Current Over Temperature
Rail-to-Rail Output Swing
Order Pass Filter MCP601, MCP602 MCP603 available standard 8-lead PDIP, SOIC TSSOP packages. quad MCP604 offered 14-lead PDIP, SOIC TSSOP packages. PDIP SOIC packages fully specified from -40°C +85°C with power supplies from 2.7V 5.5V.
1999 Microchip Technology Inc.
DS21314C-page
MCP601/602/603/604
ELECTRICAL CHARACTERISTICS
Maximum Ratings*
FUNCTION TABLE
NAME +IN, +INA, +INB, +INC, +IND -IN, -INA, -INB, -INC, -IND FUNCTION Non-inverting Input Terminals Inverting Input Terminals Positive Power Supply Negative Power Supply
.7.0V inputs outputs w.r.t. -0.3V +0.3V Difference Input voltage |VDD VSS| Output Short Circuit Current .continuous Current Input .±2mA Current Output Supply Pins .±30mA Storage temperature .-65°C +150°C Ambient temp. with power applied .-55°C +125°C Soldering temperature leads seconds) +300°C *Notice: Stresses above those listed under "Maximum Ratings" cause permanent damage device. This stress rating only functional operation device those other conditions above those indicated operational listings this specification implied. Exposure maximum rating conditions extended periods affect device reliability.
OUT, OUTA, OUTB, OUTC, OUTD Output Terminals Chip Select internal connection
CHARACTERISTICS
Unless otherwise indicated, limits specified +2.7V +5.5V, GND, VDD/2, 100k VDD/2, VOUT VDD/2 PARAMETERS INPUT OFFSET VOLTAGE Input Offset Voltage Over Temperature(1) Drift with Temperature Power Supply Rejection INPUT CURRENT IMPEDANCE Input Bias Current Over Temperature(1) SYMBOL dVOS/dT PSRR ZDIFF CMRR VSS-0.3 ±2.5 1013||6 1013||3 VDD-1.2 UNITS µV/°C µV/V ||pF ||pF 3.8V VDD/2, 50mV VOUT (VDD VDD/2, 100mV VOUT (VDD 100mV) VDD/2 VDD/2 VDD/2, 100dB VDD/2, 95dB VOUT 2.5V, -40°C +85°C -40°C +85°C -40°C +85°C 2.7V 5.5V CONDITIONS
Input Offset Bias Current Common Mode Input Impedance Differential Input Impedance COMMON MODE Common-Mode Input Range Common-Mode Rejection Ratio OPEN LOOP GAIN Open Loop Gain
Open Loop Gain
OUTPUT Level/High Level Output Swing
VOL, VOL,
0.015 0.045 0.050 0.100
0.020 0.060 0.050 0.100
Linear Region Maximum Output Voltage Swing
VOUT VOUT
Output Short Circuit Current POWER SUPPLY Supply Voltage Quiescent Current
Note Max. Min. specified PDIP SOIC packages only. Typical refers packages.
DS21314C-page
1999 Microchip Technology Inc.
MCP601/602/603/604
CHARACTERISTICS
Unless otherwise indicated, limits specified +2.7V +5.5V, GND, 25°C, VDD/2, 100k VDD/2, VOUT VDD/2 PARAMETERS Gain Bandwidth Product Phase Margin Slew Rate Setting Time 0.01% SYMBOL GBWP UNITS degrees V/µs CONDITIONS 50pF, +1V/V, VOUT 3.8VSTEP, 50pF, +1V/V
NOISE Input Voltage Noise Input Voltage Noise Density Input Current Noise Density µVP-P 0.1Hz 10Hz 1kHz 1kHz
SPECIFICATIONS MCP603 CHIP SELECT FEATURE
Unless otherwise indicated, limits specified +2.7V +5.5V, GND, 25°C, VDD/2, 100k VDD/2, VOUT VDD/2 PARAMETERS SPECIFICATIONS Logic Threshold, Input Current, Amplifier Output Leakage, High HIGH SPECIFICATIONS Logic Threshold, High Input High, Shutdown Current Input High, Shutdown Current DYNAMIC SPECIFICATIONS Amplifier Output High Turn-on Time High Amplifier Output High Threshold Hysteresis tOFF 0.2VDD high 0.8VDD, Load ICSH 0.51 entire range ICSL -1.0 0.42 entire range 0.2VDD SYMBOL UNITS CONDITIONS
TEMPERATURE SPECIFICATIONS
Unless otherwise indicated, limits specified +2.7V +5.5V, PARAMETERS TEMPERATURE RANGE Specified Temperature Range Operating Temperature Range Storage Temperature Range THERMAL PACKAGE RESISTANCE Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC Thermal Resistance, 8L-TSSOP Thermal Resistance, 14L-PDIP Thermal Resistance, 14L-SOIC Thermal Resistance, 14L-TSSOP °C/W °C/W °C/W °C/W °C/W °C/W +150 SYMBOL UNITS CONDITIONS
1999 Microchip Technology Inc.
DS21314C-page
MCP601/602/603/604
TYPICAL PERFORMANCE CURVES
Note: Unless otherwise indicated, +2.7V +5.5V, 25°C, VDD/2, VDD/2 VOUT VDD/2
Quiescent Current Amplifier (µA) Power Supply,
Open Loop Gain (dB) Phase Gain
-100 -150 -200
-250 1000 100000 10000000 100K Frequency (Hz)
FIGURE 2-1: Frequency
Open Loop Gain, Phase Margin
Phase Margin (degrees)
50pF, 100k
FIGURE 2-4:
Quiescent Current Power Supply
Slew Rate (V/µs)
High-to-Low Transition
CL=50pF, RL=100k, VDD=5V
Quiescent Current Amplifier (µA)
2.7V 5.5V
IL=0
Low-to-High Transition
Temperature (°C)
Temperature (°C)
FIGURE 2-2:
Slew Rate Temperature
FIGURE 2-5:
10000 Input Voltage Noise Density (nV/
Quiescent Current Temperature
Gain Bandwidth Product (MHz) Temperature (°C) Phase 55pF Gain Bandwidth Product
Phase Margin (degrees)
1000
100k
Frequency (Hz)
FIGURE 2-3: Temperature
Gain Bandwidth Product
FIGURE 2-6: Frequency
Input
Voltage
Noise
Density
DS21314C-page
1999 Microchip Technology Inc.
MCP601/602/603/604
Note: Unless otherwise indicated, +2.7V +5.5V, 25°C, VDD/2, VDD/2 VOUT VDD/2
Offset Voltage (µV) -100 -200 -300 -400 -500 Temperature (°C) 5.5V 2.7V 100k Common Mode Rejection Ratio, Power Supply Rejection Ratio (dB)
CMRR 2.7V -0.3V 1.5V PSRR, 2.7V 5.5V CMRR 5.5V -0.3V 4.3V
Temperature
FIGURE 2-7: Normalized Offset Voltage Temperature with 2.7V
FIGURE 2-10: Common-Mode Rejection Ratio, Power Supply Rejection Ratio Temperature
Offset Voltage (µV) Common Mode Voltage 2.7V 5.5V Representative Part
PSRR, CMRR (dB)
PSRR+ PSRRCMRR
VDD=5.0V, CL=50
1.E+00 1.E+01
1.E+02
1.E+03 1.E+04
Frequency (Hz)
100K 1.E+05
1.E+06
1.E+07
FIGURE 2-8: Voltage
Offset Voltage Common-Mode
FIGURE 2-11: Common-Mode Rejection Power Supply Rejection Ratio Frequency
Ratio,
Input Bias Current, Input Offset Current (pA) Temperature (°C) Input Bias Current Levels Typically less than Below 25°C Input Bias Current
Input Bias, Input Offset Current (pA)
5.5V
5.5V 85°C Input Bias Current
Input Offset Current
Input Offset
Common-mode Voltage
FIGURE 2-9: Input Bias Current, Input Offset Current Temperature
FIGURE 2-12: Input Bias Current, Input Offset Current Common Mode Input Voltage
1999 Microchip Technology Inc.
DS21314C-page
MCP601/602/603/604
Note: Unless otherwise indicated, +2.7V +5.5V, GND, 25°C, VDD/2, VDD/2 VOUT VDD/2
5.5V Open Loop Gain (dB)
Open Loop Gain (dB)
2.7V
20000
40000
60000
80000
100000
Power Supply Voltage,
Load Resistance
FIGURE 2-13: Open Loop Gain Output Load
FIGURE 2-16: Open Loop Gain Power Supply
Gain-Bandwidth Gain-Bandwidth (MHz)
Open Loop Gain (dB)
Phase Margin (degrees)
Phase Margin
5.5V, VOUT 50mV 5.45V
5.0V,
2.7V, VOUT 50mV 2.65V
1000 10000 Load Resistance
100K 100000
Temperature (°C)
FIGURE 2-14: Gain Bandwidth, Phase Margin Load Resistance
FIGURE 2-17: Open Loop Gain Temperature
VDD-VOH, VOL-VSS (mV) VDD=2.7V VDD-VOH VDD=5.5V VDD=5.5V VDD-VOH VDD=2.7V
VOL-VSS, VDD=2.7V VDD-VOH, VDD=5.5V
VOH, (mV)
VOL-VSS, VDD=5.5V VDD-VOH, VDD=2.7V
1000
10000
100000
100K
Temperature (°C)
Load Resistance
FIGURE 2-15: Level High Level Output Swing Resistive Load
FIGURE 2-18: Level High Level Output Swing Temperature
DS21314C-page
1999 Microchip Technology Inc.
MCP601/602/603/604
Note: Unless otherwise indicated, +2.7V +5.5V, GND, 25°C, VDD/2, VDD/2 VOUT VDD/2
100k 50pF +1V/V mV/div
CL=50pF, RL=100k, -1V/V
mV/div
FIGURE 2-19: Large Signal Non-Inverting Signal Pulse Response
FIGURE 2-22: Large Signal Inverting Signal Pulse Response
100k
mV/div
mV/div
CL=50 +1V/V
CL=50pF, RL=100k, -1V/V
FIGURE 2-20: Small Response
Signal
Non-inverting
Pulse
FIGURE 2-23: Small Signal Inverting Signal Pulse Response
Full-Scale Output Voltage Swing
Short Circuit Current (mA) Negative Short Circuit Current 5.5V Negative Short Circuit Current 2.7V Positive Short Circuit Current 2.7V Positive Short Circuit Current 5.5V
1000
10000
100K 100000
Frequency (Hz)
1000000
10000000
Temperature (°C)
FIGURE 2-21: Maximum Full Scale Output Voltage Swing Frequency
FIGURE 2-24: Output Temperature
Short
Circuit
Current
1999 Microchip Technology Inc.
DS21314C-page
MCP601/602/603/604
Note: Unless otherwise indicated, +2.7V +5.5V, GND, 25°C, VDD/2, VDD/2 VOUT VDD/2
mV/div
Amplifier Output Active
50pF +1V/V VIN+ 2.5V
Current (µA)
100k
-100 -200 -300 -400 -500 -600 -700 -800 Voltage 5.5V
Hi-Z
µS/div
FIGURE 2-25: Chip Response Time
Select
Amplifier
Output
FIGURE 2-28: Current Voltage
-0.1
Internal Switch Output
5.5V
Current (µA)
-0.5
Amplifier Output Active (driven)
Input High Input High Amplifier Output Hi-Z state
Voltage
Input Voltage
FIGURE 2-26: Input Current Voltage
FIGURE 2-29: Hysterisis
-150 Channel Channel Isolation (dB) -145 -140 -135 -130 -125 -120 -115 -110 -105 -100 1000
10000 Frequency (Hz)
100000
100K
1000000
FIGURE 2-27: Channel Channel Separation
DS21314C-page
1999 Microchip Technology Inc.
MCP601/602/603/604
APPLICATIONS INFORMATION
MCP601/602/603/604 family operational amplifiers fabricated Microchip's state-of-the-art CMOS process. They unity gain stable suitable wide range general purpose applications. With this family operational amplifiers, power supply should by-passed with capacitor. Linear Region Maximum Output Voltage Swing MCP601/602/603/604 family specified within 50mV from positive negative rail with load 100mV from rails with load. overriding condition that defines linear region amplifier open loop gain that specified over that region. voltage output region between 50mV 50mV, open loop gain specified 100dB (min) with load. classical definition open loop gain amplifier VOUT where: open loop gain amplifier, VOUT equal (VDD 50mV) (VSS 50mV) 25k, change offset voltage with changing output voltage amplifier.
Rail-to-Rail Output Swing
There specifications that describe output swing capability MCP601/602/603/604 family operational amplifiers. first specification, Level High Level Output Voltage Swing, defines absolute maximum swing that achieved under specified loaded conditions. instance, Level Output Voltage Swing MCP601/602/603/ family specified able swing least 15mV from negative rail with load VDD/2. This output swing performance shown Figure 3-1, where output MCP601 configured gain +2V/V over driven with 40kHz triangle wave. this figure, degradation output swing linearity clearly illustrated. This degradation occurs after point which open loop gain amplifier specified before amplifier reaches maximum minimum output swing.
VOH, (0.1mV/div)
Input Voltage Phase Reversal
Since MCP601/602/603/604 amplifier family designed with CMOS devices, does exhibit phase inversion when input pins exceed negative supply voltage. Figure shows input voltage exceeding both supplies with resulting phase inversion.
Input Signal G=+2V/V, VDD= Time (µs)
-0.1 -0.3 -0.5 -0.7
Input Output Voltage
Time(µS) Input Signal +2V/V Output Signal
FIGURE 3-1: Swing
Level High Level Output
second specification that describes output swing capability these amplifiers Linear Region Maximum Output Voltage Swing. This specification defines maximum output swing that achieved while amplifier still operating linear region.
FIGURE 3-2: MCP601/602/603/604 family amps have phase reversal issues. graph, amplifier unity gain buffer configuration.
1999 Microchip Technology Inc.
DS21314C-page
MCP601/602/603/604
maximum operating common-mode voltage that applied inputs 0.3V 1.2V. contrast, absolute maximum input voltage 0.3V 0.3V. Voltages input that exceed this absolute maximum rating cause excessive current flow input pins. Current beyond ±2mA cause possible reliability problems. Applications that exceed this rating must externally limited with input resistor shown Figure 3-3.
Gain-Bandwidth (MHz)
1000 10E3 10000 100E3 100000
Gain-Bandwidth VDD=5.0V, RL=100 Phase Margin 1000000 Phase Margin (degrees)
Capacitance (pF)
FIGURE 3-4: Gain Bandwidth, Phase Margin Capacitive Load
MCP60X
(Maximum expected voltage VDD) (VSS Minimum expected voltage)/ 2mA.
RISO MCP60X
VOUT
FIGURE 3-3: inputs amplifier exceed Absolute Maximum Specifications, input resistor, should used limit current flow into that pin.
FIGURE 3-5: Amplifier circuits that used when driving heavy capacitive loads.
amplifier required drive larger capacitive loads, circuit shown Figure used. small series resistor (RISO) output amplifier improves phase margin when driving large capacitive loads. This resistor decouples capacitive load from amplifier introducing zero transfer function. This zero adjusts phase margin approximately: tan-1 GBWP RISO where: improvement phase margin, GBWP gain bandwidth product amplifier, RISO capacitive decoupling resistor, load capacitance
Capacitive Load Stability
Driving capacitive loads cause stability problems with many higher speed amplifiers. closed loop amplifier circuit, good rule thumb design phase margin that less than 45°. This conservative theoretical value, however, phase margin lower, layout parasitics degrade phase margin further causing truly unstable circuit. system phase shift will have overshoot step response approximately 25%. buffer configuration with capacitive load most difficult configuration amplifier maintain stability. Phase versus Capacitive Load MCP60X amplifier shown Figure 3-4. this figure, seen that amplifier phase margin above 40°, while driving capacitance loads 100pF.
DS21314C-page
1999 Microchip Technology Inc.
MCP601/602/603/604
Chip Select Option MCP603
MCP603 single amplifier with Chip Select option. When pulled high supply current drops 0.7µA (typ) ,which pulled through VSS. this state, amplifier into high impedance state. pulling letting float, amplifier enabled. Figure shows output voltage supply current response pulse. Output Hi-Z 230µA (typ) Supply Current Current 2.0nA (typ) 0.7µA (typ) 230µA (typ) 2.0nA (typ) 0.7µA (typ) tOFF Hi-Z
Current
0.7µA (typ)
2nA(typ)
0.7µA (typ)
FIGURE 3-6:
Timing Diagram Function MCP603 Amplifier
Layout Considerations
applications where input bias current critical, board surface leakage effects signal coupling from trace trace need taken into consideration. 3.5.1 SURFACE LEAKAGE
Surface leakage across board consequence differing voltages between traces combined with high humidity, dust contamination board. instance, typical resistance from board trace approximately 1012 under humidity conditions. adjacent trace biased input amplifier biased near zero volts, leakage current will appear amplifier's input node. This type leakage five times room temperature input bias current (1pA, typ) MCP601/602/603/604 family amplifiers. simplest technique that used reduce effects board leakage design ring around sensitive pins traces. example this type layout shown Figure 3-7.
Guard Ring
FIGURE 3-7: Example Guard Ring MCP601, A-amplifier MCP602 MCP603 Board Layout
1999 Microchip Technology Inc.
DS21314C-page
MCP601/602/603/604
Circuit examples ring implementations shown Figure 3-8. Figure 3-8A, guard ring biased common-mode voltage amplifier. This type guard ring most effective applications where common-mode voltage input stage changes, such buffers, inverting gain amplifiers instrumentation amplifiers. strategy shown Figure 3-8D, biases common-mode voltage guard ring ground. This type guard ring typically used precision photo sensing circuits. Figure 3-8A 3.5.2 SIGNAL COUPLING input pins MCP601/602/603/604 amplifiers have high impedance providing opportunity noise injection, layout issues considered. These high impedance input terminals sensitive injected currents. This occur trace from high impedance input next trace that fast changing voltages, such digital clock signal. When high impedance trace close proximity trace with these types voltage changes, charge capacitively coupled into high impedance trace.
Trace
MCP60X
(typ 0.003mm)
Figure 3-8B
thickness trace
Cross-Section
length trace distance between traces
MCP60X
FIGURE 3-9: Capacitors built with traces allowing coupling signals from trace another.
shown Figure 3-9, value capacitance between traces primarily dependent distance between traces distance that traces parallel (L). From this model, amount current generated into high impedance trace equal
Figure 3-8C
MCP60X
Voltage Reference (could ground)
where: equals current that appears high impedance trace, equals value capacitance between traces, equals change voltage trace that switching,
Figure 3-8D
MCP60X
equals amount time that voltage change took from level next.
FIGURE 3-8: Examples design Board traces minimize leakage paths high impedance input pins MCP601/602/603/604 amplifiers.
DS21314C-page
1999 Microchip Technology Inc.
MCP601/602/603/604
3.6.1
Typical Applications
ANALOG FILTERS
poles that required application. Finally, program will generate SPICE macromodel, which used spice simulations. 3.6.2 INSTRUMENTATION AMPLIFIER CIRCUITS
Examples second order pass filters shown Figure 3-10 Figure 3-11. filter Figure 3-10 configured gain +1V/V greater. filter Figure 3-11 configured inverting gains.
Sallen-Key
MCP60X
instrumentation amplifier differential input, which subtracts analog signal from another rejects common mode signals. This amplifier also provides single ended analog output signal. three instrumentation amplifier illustrated Figure 3-12 instrumentation amplifier shown Figure 3-13.
MCP60X
VOUT
VOUT
MCP60X
MCP60X
s2+s(1/R1C2+1/R2C2+1/R2C1 K/R2C1+1/R1R2C2C1)
K/(R1R2C2C1)
VOUT
FIGURE 3-10: Order Pass Sallen-Key Filter
VREF
VOUT *Bypass Capacitor, VOUT
MCP60X
FIGURE 3-12: instrumentation amplifier built using three operational amplifiers seven resistors.
VOUT
-1/R1R3C2C1 s2C2C1 sC1(1/R1 1/R2 1/R3) 1/(R2R3C2C1)
VREF
MCP60X
FIGURE 3-11: Order Multiple-Feedback Filter
Pass
MCP601/602/603/604 family operational amplifiers particularly well suited these types filters. input bias current, which typically 60pA temperature), allows designer select higher value resistors, which turn reduces capacitive values. This allows designer select surface mount capacitors, which turn produce compact layout. rail-to-rail output operation MCP601/602/ 603/604 family amplifiers make these circuits well suited single supply operation. Additionally, wide bandwidth allows pass filter design 1/10 GBWP 300kHz. These filters designed using calculations provided Figures with Microchip's interactive FilterLab software. FilterLab will calculate capacitor resistor values, well determine number
MCP60X
VOUT
VOUT VREF *Bypass Capacitor,
FIGURE 3-13: instrumentation amplifier also built using operational amplifiers five resistors.
1999 Microchip Technology Inc.
DS21314C-page
MCP601/602/603/604
advantage three configuration that capable unity gain operation. disadvantage, compared instrumentation amplifier, that common mode range reduces with higher gains. configuration uses fewer amps, power consumption also low. Disadvantages this configuration that common-mode range reduces with gain must configured gains higher. 3.6.3 PHOTO DETECTION contrast, photodiode that configured photoconductive mode reverse bias voltage, which applied across photo sensing element shown Figure 3-14. width depletion region reduced when this voltage applied across photo detector, which reduces photodiode parasitic capacitance significantly. This reduced parasitic capacitance facilitates high speed operation, however, linearity offset errors optimized. design trade this action increased diode leakage current linearity errors. amplifier specification this application high speed digital communication. MCP601/602/603/604 family well suited medium speed photoconductive applications with their wide bandwidth rail-to-rail output swing.
amplifiers MCP601/602/603/604 family devices used easily convert signal from sensor that produces output current, such photodiode, into voltage. This implemented with single resistor optional capacitor feedback loop amplifier shown Figure 3-14. Photodiode Photovoltaic Mode
MCP60X
Light
VOUT
Photodiode Photoconductive Mode VBIAS Light
MCP60X
VOUT
VOUT
FIGURE 3-14: Photo Sensing Circuits Using MCP60X Amplifier
photodiode that configured photovoltaic mode voltage potential placed across element zero biased (Figure 3-14). this mode, light sensitivity linearity maximized making best suited precision applications. amplifier specifications this application input bias current, noise rail-to-tail output swing. MCP601/602/603/604 family capable meeting three these difficult requirements.
DS21314C-page
1999 Microchip Technology Inc.
MCP601/602/603/604
SPICE MACROMODEL
Spice macromodel MCP601, MCP602, MCP603 MCP604 simulates typical amplifier performance offset voltage, power supply rejection, input capacitance, common mode rejection ratio, open loop gain over frequency, phase margin with capacitive load, output swing, power supply current, power supply current change with supply voltage, input common mode range input voltage noise. characteristics MCP601, MCP602, MCP603, MCP604 amplifiers similar terms performance behavior. This single macromodel supports four devices with exception chip select function MCP603, which modeled. listing this macromodel shown next page. most recent revision model down loaded from Microchip's site www.microchip.com.
1999 Microchip Technology Inc.
DS21314C-page
MCP601/602/603/604
Macromodel MCP601 (single), MCP602 (dual), MCP603 (single w/CS), MCP604 (quad) Revision History: 6-30-99
created
.subckt mcp601 *Input Stage, pole 5MHz Ptype Ptype CDIFF 3E-12 CCM1 6E-12 CCM2 6E-12 30e-6 1.485e3 1.485e3 10.71e-12 *Input Stage Common-Mode Clamping VCMM 0.35 DCMP VCMP GCMP -0.1E-3 *Input errors (vos, psr, cmr) poly(3) (67,4) (1,34) 40e-6 3.2e-6 *Second Stage, pole 3.3Hz 5.7e-3 0.397e9 122.8e-12 VSOP 4.784 VSOM -3.48 DSOP DSOM *HCM VCMP -0.132 *mid-supply reference, output swing limit RMID1 61.62E3 RMID2 61.62E3 ELEVEL *output stage 10E-3 10E-3 10E-3 10E-3 input voltage noise 13E3 .model Ptype PMOS (L=2 W=275) .model D(IS=1e-15 =50) .model D(IS=1e-18 AF=0.6 KF=10e-17) .ENDS
DS21314C-page
1999 Microchip Technology Inc.
MCP601/602/603/604
MCP60X PRODUCT IDENTIFICATION SYSTEM
order obtain information, e.g., pricing delivery, refer factory listed sales office. MCP60X
Package: Plastic (300 Body), 8-lead 14-lead Plastic SOIC (150 Body), 8-lead Plastic SOIC (150 Body), 14-lead TSSOP, 8-lead 14-lead
Temperature Range:
-40°C +85°C
Device:
Single Operational Amplifier Single Operational Amplifier (Tape Reel-SOIC/TSSOP) Dual Operational Amplifier Dual Operational Amplifier (Tape Reel-SOIC/TSSOP) Single Operational Amplifier w/CS Function Single Operational Amplifier w/CS Function (Tape Reel-SOIC/TSSOP) MCP604 Quad Operational Amplifier MCP604T Quad Operational Amplifier (Tape Reel-SOIC/TSSOP)
MCP601 MCP601T MCP602 MCP602T MCP603 MCP603T
Sales Support
Data Sheets Products supported preliminary Data Sheet have errata sheet describing minor operational differences recommended workarounds. determine errata sheet exists particular device, please contact following: Your local Microchip sales office Microchip Corporate Literature Center U.S. FAX: (602) 786-7277 Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision silicon Data Sheet (include Literature using. Customer Notification System Register site (www.microchip.com/cn) receive most current information products.
1999 Microchip Technology Inc.
DS21314C-page
MCP601/602/603/604
NOTES:
DS21314C-page
1999 Microchip Technology Inc.
MCP601/602/603/604
NOTES:
1999 Microchip Technology Inc.
DS21314C-page
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Microchip Technology Denmark Regus Business Centre Lautrup Ballerup DK-2750 Denmark Tel: 4420 9895 Fax: 4420 9910
Dallas
Microchip Technology Inc. 4570 Westgrove Drive, Suite Addison, 75248 Tel: 972-818-7423 Fax: 972-818-2924
Japan
Microchip Technology Intl. Inc. Benex 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa 222-0033 Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122
France
Arizona Microchip Technology SARL Parc d'Activite Moulin Massy Saule Trapu Batiment Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Dayton
Microchip Technology Inc. Prestige Place, Suite Miamisburg, 45342 Tel: 937-291-1654 Fax: 937-291-9175
Detroit
Microchip Technology Inc. Tri-Atria Office Building 32255 Northwestern Highway, Suite Farmington Hills, 48334 Tel: 248-538-2250 Fax: 248-538-2260
Korea
Microchip Technology Korea 168-1, Youngbo Bldg. Floor Samsung-Dong, Kangnam-Ku Seoul, Korea Tel: 82-2-554-7200 Fax: 82-2-558-5934
Germany
Arizona Microchip Technology GmbH Gustav-Heinemann-Ring D-81739 Germany Tel: 49-89-627-144 Fax: 49-89-627-144-44
Angeles
Microchip Technology Inc. 18201 Karman, Suite 1090 Irvine, 92612 Tel: 949-263-1888 Fax: 949-263-1338
Italy
Arizona Microchip Technology Centro Direzionale Colleoni Palazzo Taurus Colleoni 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883
11/15/99
Shanghai
Microchip Technology Shanghai Golden Bridge Bldg. 2077 Yan'an Road West, Hong Qiao District Shanghai, 200335 Tel: 86-21-6275-5700 Fax: 21-6275-5060
York
Microchip Technology Inc. Motor Parkway, Suite Hauppauge, 11788 Tel: 631-273-5305 Fax: 631-273-5335
Jose
Microchip Technology Inc. 2107 North First Street, Suite Jose, 95131 Tel: 408-436-7950 Fax: 408-436-7955
Microchip received QS-9000 quality system certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona July 1999. Company's quality system processes procedures QS-9000 compliant PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs microperipheral products. addition, Microchip's quality system design manufacture development systems 9001 certified.
rights reserved. 1999 Microchip Technology Incorporated. Printed USA. 11/99
Printed recycled paper.
Information contained this publication regarding device applications like intended suggestion only superseded updates. representation warranty given liability assumed Microchip Technology Incorporated with respect accuracy such information, infringement patents other intellectual property rights arising from such otherwise. Microchip's products critical components life support systems authorized except with express written approval Microchip. licenses conveyed, implicitly otherwise, under intellectual property rights. Microchip logo name registered trademarks Microchip Technology Inc. U.S.A. other countries. rights reserved. other trademarks mentioned herein property their respective companies.
1999 Microchip Technology Inc.
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