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2SK3324 DESCRIPTION 2SK3324 N-Channel device that features g
Top Searches for this datasheetFIELD EFFECT TRANSISTOR 2SK3324 DESCRIPTION 2SK3324 N-Channel device that features gate charge excellent switching characteristics, Designed high voltage applications such switching power supply, adapter. ORDERING INFORMATION PART NUMBER 2SK3324 PACKAGE TO-3P FEATURES gate charge TYP. (VDD Gate voltage rating on-state resistance RDS(on) MAX. (VGS Avalanche capability ratings ABSOLUTE MAXIMUM RATINGS Drain Source Voltage Gate Source Voltage Drain Current (DC) Drain Current (Pulse) Note1 VDSS VGSS(AC) ID(DC) ID(pulse) Tstg Note2 Note2 21.6 Total Power Dissipation 25°C) Total Power Dissipation 25°C) Total Power Dissipation 25°C) Storage Temperature Single Avalanche Current Single Avalanche Energy Notes Duty cycle Starting information this document subject change without notice. Before using this document, please confirm that this latest version. devices/types available every country. Please check with local representative availability additional information. Document D14203EJ1V0DS00 (1st edition) Date Published July 1999 CP(K) Printed Japan 1999 2SK3324 ELECTRICAL CHARACTERISTICS CHARACTERISTICS Drain Leakage Current Gate Source Leakage Current Gate Source Cut-off Voltage Forward Transfer Admittance Drain Source On-state Resistance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Total Gate Charge Gate Source Charge Gate Drain Charge Body Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge SYMBOL IDSS IGSS VGS(off) RDS(on) Ciss Coss Crss td(on) td(off) VF(S-D) 1000 MIN. TYP. MAX. ±100 UNIT TEST CONDITIONS VGS(on) di/dt A/µs TEST CIRCUIT AVALANCHE CAPABILITY D.U.T. TEST CIRCUIT SWITCHING TIME D.U.T. Wave Form VGS(on) BVDSS Duty Cycle Wave Form td(on) td(off) toff Starting TEST CIRCUIT GATE CHARGE D.U.T. Data Sheet D14203EJ1V0DS00 2SK3324 TYPICAL CHARACTERISTICS DERATING FACTOR FORWARD BIAS SAFE OPERATING AREA TOTAL POWER DISSIPATION CASE TEMPERATURE Percentage Rated Power Total Power Dissipation Case Temperature Case Temperature FORWARD BIAS SAFE OPERATING AREA DRAIN CURRENT DRAIN SOURCE VOLTAGE Pulsed Drain Current Drain Current ID(pulse) 25°C Single Pulse 1000 Drain Source Voltage Drain Source Voltage FORWARD TRANSFER CHARACTERISTICS 125°C 75°C 25°C -25°C Drain Current 0.01 Pulsed Gate Source Voltage Data Sheet D14203EJ1V0DS00 2SK3324 TRANSIENT THERMAL RESISTANCE PULSE WIDTH rth(t) Transient Thermal Resistance °C/W Rth(ch-A)= 41.7 Rth(ch-C)= 1.04 0.01 0.001 0.0001 25°C Single Pulse 0.001 0.01 1000 Pulse Width FORWARD TRANSFER ADMITTANCE DRAIN CURRENT DRAIN SOURCE ON-STATE RESISTANCE GATE SOURCE VOLTAGE Pulsed Forward Transfer Admittance RDS(on) Drain Source On-state Resistance -25°C 25°C 75°C 125°C 0.01 Pulsed Drain Current Gate Source Voltage RDS(on) Drain Source On-state Resistance DRAIN SOURCE ON-STATE RESISTANCE DRAIN CURRENT GATE SOURCE CUT-OFF VOLTAGE CHANNEL TEMPERATURE VGS(off) Gate Source Cut-off Voltage Pulsed 0.01 Drain Current Channel Temperature Data Sheet D14203EJ1V0DS00 2SK3324 RDS(on) Drain Source On-state Resistance DRAIN SOURCE ON-STATE RESISTANCE CHANNEL TEMPERATURE SOURCE DRAIN DIODE FORWARD VOLTAGE Pulsed Diode Forward Current Source Drain Voltage Channel Temperature CAPACITANCE DRAIN SOURCE VOLTAGE 10000 SWITCHING CHARACTERISTICS 1000 Ciss, Coss, Crss Capacitance td(on), td(off), Switching Time Ciss td(off) td(on) 1000 Coss Crss Drain Source Voltage Drain Current REVERSE RECOVERY TIME DRAIN CURRENT 10000 Drain Source Voltage Reverse Recovery Time di/dt DYNAMIC INPUT/OUTPUT CHARACTERISTICS 1000 Drain Current Gate Charge Data Sheet D14203EJ1V0DS00 2SK3324 SINGLE AVALANCHE ENERGY INDUCTIVE LOAD 100.0 SINGLE AVALANCHE ENERGY DERATING FACTOR Single Avalanche Energy Energy Derating Factor 1.00E-01 10.0 1.00E-04 1.00E-03 1.00E-02 Inductive Load Starting Starting Channel Temperature Data Sheet D14203EJ1V0DS00 2SK3324 PACKAGE DRAWING (Unit TO-3P (MP-88) EQUIVALENT CIRCUIT Drain MAX. TYP. 4.5±0.2 3.2±0.2 15.7 MAX. TYP. 20.5 MAX. TYP. 18.7±0.4 TYP. Gate Body Diode Source MIN. MAX. 2.2±0.2 1.0±0.2 0.6±0.1 2.8±0.1 5.45 TYP. 5.45 TYP. Gate Drain Source (Drain) Remark Strong electric field, when exposed this device, cause destruction gate oxide ultimately degrade device operation. Steps must taken stop generation static electricity much possible, quickly dissipate once, when occurred. Data Sheet D14203EJ1V0DS00 2SK3324 information this document subject change without notice. Before using this document, please confirm that this latest version. part this document copied reproduced form means without prior written consent Corporation. Corporation assumes responsibility errors which appear this document. Corporation does assume liability infringement patents, copyrights other intellectual property rights third parties arising from device described herein other liability arising from such device. license, either express, implied otherwise, granted under patents, copyrights other intellectual property rights Corporation others. Descriptions circuits, software, other related information this document provided illustrative purposes semiconductor product operation application examples. incorporation these circuits, software, information design customer's equipment shall done under full responsibility customer. Corporation assumes responsibility losses incurred customer third parties arising from these circuits, software, information. While Corporation been making continuous effort enhance reliability semiconductor devices, possibility defects cannot eliminated entirely. minimize risks damage injury persons property arising from defect semiconductor device, customers must incorporate sufficient safety measures design, such redundancy, fire-containment, anti-failure features. devices classified into following three quality grades: "Standard", "Special", "Specific". Specific quality grade applies only devices developed based customer designated "quality assurance program" specific application. recommended applications device depend quality grade, indicated below. Customers must check quality grade each device before using particular application. Standard: Computers, office equipment, communications equipment, test measurement equipment, audio visual equipment, home electronic appliances, machine tools, personal electronic equipment industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment medical equipment (not specifically designed life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems medical equipment life support, etc. quality grade devices "Standard" unless otherwise specified NEC's Data Sheets Data Books. customers intend devices applications other than those specified Standard quality grade, they should contact sales representative advance. Other recent searchesTLHE5800 - TLHE5800 TLHE5800 Datasheet SW-217 - SW-217 SW-217 Datasheet PUB4311 - PUB4311 PUB4311 Datasheet
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