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MC74ACT241 octal buffer line driver designed employed memory address d


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MC74ACT241 Octal Buffer/Line Driver with 3-State Outputs1
MC74ACT241 octal buffer line driver designed employed memory address driver, clock driver oriented transmitter receiver which provides improved board density.
3-State Outputs Drive Lines Buffer Memory Address Compatible Inputs
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PDIP-20 SUFFIX CASE
Registers Outputs Source/Sink
SO-20 SUFFIX CASE
TSSOP-20 SUFFIX CASE 948E EIAJ-20 SUFFIX CASE
Figure Pinout: 20-Lead Packages Conductors (Top View)
ORDERING INFORMATION TRUTH TABLE
Inputs Outputs (Pins MC74ACT241DT MC74ACT241DTR2 MC74ACT241M MC74ACT241MEL TSSOP-20 Units/Rail TSSOP-20 2500 Tape Reel EIAJ-20 EIAJ-20 Units/Rail 2000 Tape Reel Device MC74ACT241N MC74ACT241DW MC74ACT241DWR2 Package PDIP-20 SOIC-20 Shipping Units/Rail Units/Rail
SOIC-20 1000 Tape Reel
HIGH Voltage Level Voltage Level Immaterial High Impedance
TRUTH TABLE
Inputs Outputs (Pins
DEVICE MARKING INFORMATION
general marking information device marking section page this data sheet.
HIGH Voltage Level Voltage Level Immaterial High Impedance
Semiconductor Components Industries, LLC, 2001
June, 2001 Rev.
Publication Order Number: MC74ACT241/D
MC74ACT241
MAXIMUM RATINGS (Note
Symbol IGND TSTG Supply Voltage Input Voltage Output Voltage Input Diode Current Output Diode Current Output Sink/Source Current Supply Current Output Ground Current Output Storage Temperature Range Lead temperature, from Case Seconds Junction temperature under Bias Thermal resistance PDIP SOIC TSSOP PDIP SOIC TSSOP (Note Parameter Value *0.5 )7.0 *0.5 )0.5 *0.5 )0.5 $100 )150 )150 Level Oxygen Index: Human Body Model (Note Machine Model (Note Charged Device Model (Note Above Below 85_C (Note UL-94-VO (0.125 2000 1000 $100 Unit _C/W
Power Dissipation Still 85_C
VESD
Moisture Sensitivity Flammability Rating Withstand Voltage
ILatch-Up
Latch-Up Performance
Absolute maximum continuous ratings those values beyond which damage device occur. Extended exposure these conditions conditions beyond those indicated adversely affect device reliability. Functional operation under absolute maximum-rated conditions implied. absolute maximum rating must observed. Tested EIA/JESD22-A114-A. Tested EIA/JESD22-A115-A. Tested JESD22-C101-A. Tested EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol Vin, Vout Parameter Input Voltage (Referenced GND) Input Voltage, Output Voltage (Referenced GND) Operating Temperature, Package Types Input Rise Fall Time (Note Junction Temperature (PDIP) Output Current High Unit ns/V
Output Current Unused Inputs left open. inputs must tied high voltage level logic voltage level. from refer individual Data Sheets devices that differ from typical input rise fall times.
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MC74ACT241
CHARACTERISTICS
+255C Symbol Parameter Minimum High Level Input Voltage Maximum Level Output Voltage DICCT Maximum Input Leakage Current Additional Maximum ICC/Input Maximum 3-State Current ±0.5 0.001 0.001 4.49 5.49 -405C +855C Unit Conditions VOUT VOUT IOUT *VIN IOUT *VIN VCC, (OE) VIL, VCC, VCC, VOLD 1.65 VOHD 3.85
Guaranteed Limits 3.86 4.86 0.36 0.36 ±0.1 3.76 4.76 0.44 0.44 ±1.0 ±5.0
Maximum Level Input Voltage
Minimum High Level Output Voltage
IOLD IOHD
Minimum Dynamic Output Current Maximum Quiescent Supply Current
*All outputs loaded; thresholds input associated with output under test. Maximum test duration output loaded time.
CHARACTERISTICS (For Figures Waveforms, Figures
+255C Symbol tPLH tPHL tPZH tPZL tPHZ tPLZ Parameter Propagation Delay Data Output Propagation Delay Data Output Output Enable Time Output Enable Time Output Disable Time Output Disable Time VCC* 10.0 10.5 10.5 -405C +855C 10.0 10.0 10.0 11.0 11.5 11.5 Unit
*Voltage Range ±0.5
CAPACITANCE
Symbol Input Capacitance Power Dissipation Capacitance Parameter Value Unit Test Conditions
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MC74ACT241
SWITCHING WAVEFORMS
INPUT DATA 1/fmax tPLH OUTPUT OUTPUT tPHL OUTPUT (12, tPZL tPLZ tPZH tPHZ HIGH IMPEDANCE HIGH IMPEDANCE
Figure
Figure
INPUT OUTPUT DEVICE UNDER TEST SCOPE TEST POINT
*Includes probe capacitance
Figure Test Circuit
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MC74ACT241
MARKING DIAGRAMS23
PDIP-20 SO-20 TSSOP-20 EIAJ-20
MC74ACT241N AWLYYWW
ACT241 AWLYYWW
ALYW
74ACT241 AWLYWW
Assembly Location Wafer Year Work Week
PACKAGE DIMENSIONS
PDIP-20 SUFFIX PLASTIC PACKAGE CASE 738-03 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION CENTER LEAD WHEN FORMED PARALLEL. DIMENSION DOES INCLUDE MOLD FLASH. INCHES 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 0.050 0.070 0.100 0.008 0.015 0.110 0.140 0.300 0.020 0.040 MILLIMETERS 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 1.27 1.77 2.54 0.21 0.38 2.80 3.55 7.62 0.51 1.01
SEATING PLANE
0.25 (0.010)
0.25 (0.010)
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MC74ACT241
PACKAGE DIMENSIONS
SO-20 SUFFIX PLASTIC SOIC PACKAGE CASE 751D-05 ISSUE
NOTES: DIMENSIONS MILLIMETERS. INTERPRET DIMENSIONS TOLERANCES ASME Y14.5M, 1994. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL 0.13 TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. MILLIMETERS 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 10.05 10.55 0.25 0.75 0.50 0.90
0.25
0.25
SEATING PLANE
TSSOP-20 SUFFIX PLASTIC TSSOP PACKAGE CASE 948E-02 ISSUE
0.15 (0.006)
0.10 (0.004)
IDENT
SECTION 0.25 (0.010)
0.15 (0.006)
0.100 (0.004) SEATING
PLANE
DETAIL
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DETAIL
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH, PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-. MILLIMETERS 6.40 6.60 4.30 4.50 -1.20 0.05 0.15 0.50 0.75 0.65 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 INCHES 0.252 0.260 0.169 0.177 -0.047 0.002 0.006 0.020 0.030 0.026 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252
MC74ACT241
PACKAGE DIMENSIONS
EIAJ-20 SUFFIX PLASTIC EIAJ PACKAGE CASE 967-01 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD FLASH PROTRUSIONS MEASURED PARTING LINE. MOLD FLASH PROTRUSIONS SHALL EXCEED 0.15 (0.006) SIDE. TERMINAL NUMBERS SHOWN REFERENCE ONLY. LEAD WIDTH DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS LEAD WIDTH DIMENSION MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT LOCATED LOWER RADIUS FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS ADJACENT LEAD 0.46 0.018). MILLIMETERS -2.05 0.05 0.20 0.35 0.50 0.18 0.27 12.35 12.80 5.10 5.45 1.27 7.40 8.20 0.50 0.85 1.10 1.50 0.70 0.90 -0.81 INCHES -0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.486 0.504 0.201 0.215 0.050 0.291 0.323 0.020 0.033 0.043 0.059 0.028 0.035 -0.032
DETAIL
VIEW
0.13 (0.005)
0.10 (0.004)
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MC74ACT241
Semiconductor trademarks Semiconductor Components Industries, (SCILLC). SCILLC reserves right make changes without further notice products herein. SCILLC makes warranty, representation guarantee regarding suitability products particular purpose, does SCILLC assume liability arising application product circuit, specifically disclaims liability, including without limitation special, consequential incidental damages. "Typical" parameters which provided SCILLC data sheets and/or specifications vary different applications actual performance vary over time. operating parameters, including "Typicals" must validated each customer application customer's technical experts. SCILLC does convey license under patent rights rights others. SCILLC products designed, intended, authorized components systems intended surgical implant into body, other applications intended support sustain life, other application which failure SCILLC product could create situation where personal injury death occur. Should Buyer purchase SCILLC products such unintended unauthorized application, Buyer shall indemnify hold SCILLC officers, employees, subsidiaries, affiliates, distributors harmless against claims, costs, damages, expenses, reasonable attorney fees arising directly indirectly, claim personal injury death associated with such unintended unauthorized use, even such claim alleges that SCILLC negligent regarding design manufacture part. SCILLC Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
Literature Fulfillment: Literature Distribution Center Semiconductor P.O. 5163, Denver, Colorado 80217 Phone: 303-675-2175 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com American Technical Support: 800-282-9855 Toll Free USA/Canada JAPAN: Semiconductor, Japan Customer Focus Center 4-32-1 Nishi-Gotanda, Shinagawa-ku, Tokyo, Japan 141-0031 Phone: 81-3-5740-2700 Email: r14525@onsemi.com Semiconductor Website: http://onsemi.com additional information, please contact your local Sales Representative.
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MC74ACT241/D

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