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Feature N-Channel Enhancement mode Logic Level dv/dt rated Drain
Top Searches for this datasheetSN7002N SIPMOS® Small-Signal-Transistor Feature N-Channel Enhancement mode Logic Level dv/dt rated Drain Gate pin1 Source Product Summary RDS(on) SOT-23 Type SN7002N SN7002N Package SOT-23 SOT-23 Ordering Code Q67042-S4185 Q67042-S4192 Tape Reel Information E6327: 3000 pcs/reel E6433: 10000 pcs/reel Marking Maximum Ratings, unless otherwise specified Parameter Continuous drain current TA=25°C TA=70°C Symbol Value 0.16 Unit Pulsed drain current TA=25°C puls dv/dt Ptot Tstg Class 0.36 -55. +150 55/150/56 kV/µs Reverse diode dv/dt IS=0.2A, VDS=48V, di/dt=200A/µs, jmax=150°C Gate source voltage Sensitivity (HBM) MIL-STD Power dissipation TA=25°C Operating storage temperature climatic category; 68-1 Page 2003-03-26 SN7002N Thermal Characteristics Parameter Characteristics Thermal resistance, junction ambient minimal footprint RthJA Symbol min. Values typ. max. Unit Electrical Characteristics, unless otherwise specified Parameter Static Characteristics Drain-source breakdown voltage VGS=0, ID=250µA Symbol min. V(BR)DSS VGS(th) RDS(on) RDS(on) Values typ. max. Unit Gate threshold voltage, ID=26µA Zero gate voltage drain current VDS=60V, Tj=25°C VDS=60V, Tj=150°C Gate-source leakage current VGS=20V, VDS=0 Drain-source on-state resistance VGS=4.5V, ID=0.17A Drain-source on-state resistance VGS=10V, ID=0.5A Page 2003-03-26 SN7002N Electrical Characteristics, unless otherwise specified Parameter Dynamic Characteristics Transconductance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate source charge Gate drain charge Gate charge total Gate plateau voltage =48V, =0.5A, =48V, =0.5A Symbol Conditions min. Values typ. 0.17 max. Unit td(on) td(off) VDS2*ID*RDS(on)max, ID=0.16A VGS=0, VDS=25V, f=1MHz 0.09 VDD=30V, VGS=10V, ID=0.5A, RG=6 0.14 0.42 0.21 0.63 V(plateau) =48V, Reverse Diode Inverse diode continuous forward current Inv. diode direct current, pulsedISM Inverse diode forward voltage Reverse recovery time Reverse recovery charge VGS=0, VR=30V, diF/dt=100A/µs TA=25°C 0.83 14.2 21.3 Page 2003-03-26 SN7002N Power dissipation Ptot (TA) 0.38 SN7002N Drain current (TA) parameter: 0.22 SN7002N 0.32 0.28 0.18 0.16 Ptot 0.24 0.16 0.14 0.12 0.08 0.12 0.06 0.08 0.04 0.04 0.02 Safe operating area parameter SN7002N Transient thermal impedance ZthJA parameter SN7002N 200.0µs ZthJA 0.50 0.20 0.10 0.05 0.02 single pulse 0.01 Page 2003-03-26 SN7002N Typ. output characteristic (VDS) parameter: Typ. drain-source resistance RDS(on) (ID) parameter: 0.75 0.625 4.5V 4.0V 3.7V 3.5V 3.0V 5.25 3.75 2.25 3.1V 3.5V 3.7V 4.1V 4.5V 0.375 0.25 0.125 0.75 RDS(on) Typ. transfer characteristics RDS(on)max parameter: Typ. forward transconductance f(ID) parameter: 0.25 0.15 0.05 Page 2003-03-26 SN7002N Drain-source on-state resistance RDS(on) parameter SN7002N Typ. gate threshold voltage VGS(th) parameter: =26µA RDS(on) VGS(th) typ. Typ. capacitances (VDS) parameter: MHz, Forward character. reverse diode (VSD) parameter: SN7002N Ciss Coss Crss (98%) (98%) Page 2003-03-26 SN7002N Typ. gate charge (QG); parameter: pulsed, SN7002N SN7002N Drain-source breakdown voltage V(BR)DSS V(BR)DSS Page 2003-03-26 SN7002N Published Infineon Technologies Bereichs Kommunikation St.-Martin-Strasse D-81541 Infineon Technologies 1999 Rights Reserved. Attention please! information herein given describe certain components shall considered warranted characteristics. Terms delivery rights technical change reserved. hereby disclaim warranties, including limited warranties non-infringement, regarding circuits, descriptions charts stated herein. Infineon Technologies approved CECC manufacturer. Information further information technology, delivery terms conditions prices please contact your nearest Infineon Technologies Office Germany Infineon Technologies Reprensatives worldwide (see address list). Warnings technical requirements components contain dangerous substances. information types question please contact your nearest Infineon Technologies Office. Infineon Technologies Components only used life-support devices systems with express written approval Infineon Technologies, failure such components reasonably expected cause failure that life-support device system, affect safety effectiveness that device system Life support devices systems intended implanted human body, support and/or maintain sustain and/or protect human life. they fail, reasonable assume that health user other persons endangered. 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