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Band High Gain MMIC eless Silicon Discr etes Edition 20
Top Searches for this datasheetBand High Gain MMIC eless Silicon Discr etes Edition 2002-05-03 Published Infineon Technologies St.-Martin-Strasse D-81541 Infineon Technologies 2002 Rights Reserved. Attention please! information herein given describe certain components shall considered warranted characteristics. Terms delivery rights technical change reserved. hereby disclaim warranties, including limited warranties non-infringement, regarding circuits, descriptions charts stated herein. Infineon Technologies approved CECC manufacturer. Information further information technology, delivery terms conditions prices please contact your nearest Infineon Technologies Office Germany Infineon Technologies Representatives worldwide (see address list). Warnings technical requirements components contain dangerous substances. information types question please contact your nearest Infineon Technologies Office. Infineon Technologies Components only used life-support devices systems with express written approval Infineon Technologies, failure such components reasonably expected cause failure that life-support device system, affect safety effectiveness that device system. Life support devices systems intended implanted human body, support and/or maintain sustain and/or protect human life. they fail, reasonable assume that health user other persons endangered. BGA430 Preliminary data sheet Revision History: 2002-05-03 Previous Version: Page 2002-01-22 Subjects (major changes since last revision) Maximum input power specified Preliminary questions technology, delivery prices please contact Infineon Technologies Offices Germany Infineon Technologies Companies Representatives worldwide: webpage http://www.infineon.com Preliminary Broad Band High Gain BGA430 Features High gain |S21|2: GHz, 2.15 noise figure F50: GHz, 2.15 Matched Reverse isolation 40dB Small SOT363 package Typical supply voltage: SIEGET®-25 technology VPS05604 Applications amplifiers CATV systems Boxes Buffer amplifiers wide band applications Description GND2 RFout GND1 GND1 BGA430 broad band high gain amplifier based upon Infineon Technologies' Silicon Bipolar Technology B6HF. Housed small SOT363 package this Silicon Monolithic Microwave Integrated Circuit (MMIC) requires very external components integrated biasing concept. advanced B6HF process BGA430 achieves exceptional noise figure high gain 2.15 GHz. RFin Bias ESD: Electrostatic discharge sensitive device, observe handling precaution! Type BGA430 Package SOT363 Marking Chip T0509 2002-05-03 Preliminary data sheet BGA430 Preliminary Maximum Ratings Note: voltages refer GND-Node Parameter Device voltage Device current Current into Input power1) Total power dissipation, 80°C2) Junction temperature Ambient temperature range Storage temperature range Thermal resistance: junction-soldering point Symbol Ptot TSTG Value +150 +150 Unit Valid ZS=ZL=50, VCC=5V VCC=0V measured emitter lead soldering point Electrical Characteristics TA=25°C (measured application fig. VCC=5V, unless otherwise specified Parameter Insertion power gain Noise figure (ZS=50) f=0.9GHz f=2.15GHz f=0.9GHz f=2.15GHz Symbol |S21|2 P-1dB OIP3 RLIn RLOut min. typ. max. Unit Output power gain compression ZL=50 f=0.9GHz f=2.15GHz Output third order intercept point f=0.9GHz ZS/L=50 f=2.15GHz Input return loss Output return loss Device current f=0.9GHz f=2.15GHz f=0.9GHz f=2.15GHz Note: measurement results compensated losses: 0.05 GHz, 2.15 RFin RFout Preliminary data sheet 2002-05-03 BGA430 Preliminary Power Gain |S21|2, f(f) Reverse Isolation |S12| f(f) |S21|2 |S21|2, [dB] |S12| [dB] Frequency [GHz] Frequency [GHz] Matching |S11|, |S22| f(f) Stability f(f) |S11|, |S22| [dB] Frequency [GHz] Frequency [GHz] Preliminary data sheet 2002-05-03 BGA430 Preliminary Noise figure f(f) Power Gain |S21|2=f(TA,f) parameter |S21|2 [dB] [dB] [GHz] [GHz] Output Compression Point P-1dB=f(TA,f) Output Order Intercept Point parameter =f(T ,f), parameter P-1dB [dBm] [dBm] [GHz] [GHz] Preliminary data sheet 2002-05-03 BGA430 Preliminary Typical Application RFout GND2 RFout GND1 GND1 RFin RFin Bias Voltage Supply Figure Notes: Typical application circuit high gain BGA430 blocking supply (VCC) done very carefully. broad-band impedance path provided VCC. appropriate blocking used, couple internal power lines input device might oscillate. layout application circuit Part list: BGA430 coupling capacitors (not used measurements) 100pF 100pF BGA430 Figure Double sided glass fiber epoxy board, thickness 0.5mm, r=4.5 Preliminary data sheet 2002-05-03 BGA430 Preliminary Package Outline ±0.2 +0.1 ±0.1 ±0.1 0.65 ±0.05 0.20 0.15 +0.1 -0.05 0.20 Tape Loading Orientation View Direction Unreeling Position tape: opposite feed hole side EHA07193 Marking SOT-363 package (for example PHs) corresponds device Preliminary data sheet 1.25 ±0.1 2.1±0.1 +0.2 acc. 6784 2002-05-03 Other recent searchesTYNx12 - TYNx12 TYNx12 Datasheet SN74GTLP1394 - SN74GTLP1394 SN74GTLP1394 Datasheet RNC90Z - RNC90Z RNC90Z Datasheet HMC136 - HMC136 HMC136 Datasheet HIP9011 - HIP9011 HIP9011 Datasheet FPT-24C-A03 - FPT-24C-A03 FPT-24C-A03 Datasheet
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