MAXIMUM RATINGS 25°C) Rating Collector-Emitter Voltage Collector-

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NSL12TT1 High Current Surface Mount Silicon VCE(sat) Transistor Battery Operated Applications
MAXIMUM RATINGS 25°C)
Rating Collector-Emitter Voltage Collector-Base Voltage Emitter-Base Voltage Collector Current Peak Collector Current Continuous Electrostatic Discharge Symbol VCEO VCBO VEBO -4.0 -1.0 -0.5 Unit
VOLTS AMPS TRANSISTOR
COLLECTOR BASE EMITTER
Class Class
THERMAL CHARACTERISTICS
Characteristic Total Device Dissipation 25°C Derate above 25°C Thermal Resistance, Junction Ambient Total Device Dissipation 25°C Derate above 25°C Thermal Resistance, Junction Ambient Thermal Resistance, Junction Lead Junction Storage Temperature Range FR-4 Minimum FR-4 inch Specific Device Code Symbol (Note (Note (Note (Note Tstg +150 Unit mW/°C °C/W mW/°C °C/W °C/W CASE SOT-416/SC-75 STYLE
DEVICE MARKING
ORDERING INFORMATION
Device NSL12TT1 Package SOT-416 Shipping 3000/Tape Reel
Semiconductor Components Industries, LLC, 2002
February, 2002 Rev.
Publication Order Number: NSL12TT1/D
NSL12TT1
ELECTRICAL CHARACTERISTICS 25°C unless otherwise noted)
Characteristic Symbol Typical Unit
CHARACTERISTICS
Collector-Emitter Breakdown Voltage mAdc, Collector-Base Breakdown Voltage -0.1 mAdc, Emitter-Base Breakdown Voltage -0.1 mAdc, Collector Cutoff Current (VCB Vdc, Collector-Emitter Cutoff Current (VCES Vdc) Emitter Cutoff Current (VEB -4.0 Vdc) V(BR)CEO V(BR)CBO V(BR)EBO -4.0 ICBO ICES IEBO -0.01 -0.1 -0.03 -0.1 mAdc -0.03 -0.1 mAdc -7.0 mAdc
CHARACTERISTICS
Current Gain (Note -100 -1.0 -100 -2.0 -500 -2.0 Collector-Emitter Saturation Voltage (Note -0.5 -100 -1.0 -250 -2.5 -250 -5.0 -500 -5.0 -500 -1.0 -100 Base-Emitter Saturation Voltage (Note -150 Base-Emitter Turn-on Voltage (Note -150 -3.0 Input Capacitance (VEB MHz) Output Capacitance (VCB MHz) Turn-On Time (IBI -500 Turn-Off Time (IB1 -500 Pulsed Condition: Pulse Width msec, Duty Cycle VCE(sat) VBE(sat) VBE(on) Cibo Cobo toff -0.81 -0.875 -0.81 -0.90 -0.070 -0.110 -0.190 -0.165 -0.300 -0.210 -0.410 -0.110 -0.150 -0.240 -0.370
Figure
NSL12TT1
VCE(sat), COLLECTOR EMITTER SATURATION VOLTAGE VCE(sat), COLLECTOR EMITTER SATURATION VOLTAGE
IC/IB 25°C -55°C
IC/IB
0.01
125°C
0.001 0.001
25°C 0.01 COLLECTOR CURRENT (AMPS)
0.01 0.001
0.01
COLLECTOR CURRENT (AMPS)
Figure Collector Emitter Saturation Voltage Collector Current
Figure Collector Emitter Saturation Voltage Collector Current
hFE, CURRENT GAIN 125°C 25°C -55°C VCE(sat), COLLECTOR EMITTER SATURATION VOLTAGE
IC/IB 25°C
-55°C 125°C
0.001
0.01
0.01 0.001
0.01
COLLECTOR CURRENT (AMPS)
COLLECTOR CURRENT (AMPS)
Figure Current Gain
Figure Collector Emitter Saturation Voltage Collector Current
25°C VBE(sat), BASE EMITTER SATURATION VOLTAGE -55°C 0.001 25°C 125°C
VCE(sat), COLLECTOR EMITTER SATURATION VOLTAGE 0.00001 0.0001 0.001 0.01
0.01
BASE CURRENT (AMPS)
COLLECTOR CURRENT (AMPS)
Figure Collector Emitter Saturation Voltage Base Current
Figure Base Emitter Saturation Voltage Collector Current
NSL12TT1
VBE(on), BASE EMITTER TURN-ON VOLTAGE -55°C 0.001 25°C 125°C Cibo, INPUT CAPACITANCE 25°C
0.01
COLLECTOR CURRENT (AMPS)
VEB, EMITTER BASE VOLTAGE
Figure Base Emitter Turn-On Voltage Collector Current
Figure Input Capacitance
Cobo, OUTPUT CAPACITANCE 25°C
VCB, COLLECTOR BASE VOLTAGE
Figure Output Capacitance
r(t), EFFECTIVE TRANSIENT THERMAL RESISTANCE (NORMALIZED)
0.50 0.20 0.10 0.05 0.01 DUTY CYCLE, t1/t2 Copper Area 0.048 square inches 505.7 °C/W 0.01 TIME 1000
P(pk)
SINGLE PULSE 0.01 0.0001 0.001
Figure Normalized Thermal Response
NSL12TT1 INFORMATION USING SOT-416 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT SURFACE MOUNTED APPLICATIONS Surface mount board layout critical portion total design. footprint semiconductor packages must correct size insure proper solder connection interface between board package. With correct geometry, packages will self align when subjected solder reflow process.
min. (3x)
Unit:
min. (3x)
SOT-416/SC-90 POWER DISSIPATION power dissipation SOT-416/SC-90 function size. This vary from minimum size soldering size given maximum power dissipation. Power dissipation surface mount device determined TJ(max), maximum rated junction temperature die, RJA, thermal resistance from device junction ambient; operating temperature, Using values provided data sheet, calculated follows.
TJ(max)
equation ambient temperature 25°C, calculate power dissipation device which this case milliwatts.
150°C 25°C 833°C/W milliwatts
values equation found maximum ratings table data sheet. Substituting these values into
833°C/W assumes recommended footprint glass epoxy printed circuit board achieve power dissipation milliwatts. Another alternative would ceramic substrate aluminum core board such Thermal CladTM. Using board material such Thermal Clad, higher power dissipation achieved using same footprint.
SOLDERING PRECAUTIONS melting temperature solder higher than rated temperature device. When entire device heated high temperature, failure complete soldering within short time could result device failure. Therefore, following items should always observed order minimize thermal stress which devices subjected. Always preheat device. delta temperature between preheat soldering should 100°C less.* When preheating soldering, temperature leads case must exceed maximum temperature ratings shown data sheet. When using infrared heating with reflow soldering method, difference should maximum 10°C.
soldering temperature time should exceed
260°C more than seconds. When shifting from preheating soldering, maximum temperature gradient should less. After soldering been completed, device should allowed cool naturally least three minutes. Gradual cooling should used forced cooling will increase temperature gradient result latent failure mechanical stress. Mechanical stress shock should applied during cooling
Soldering device without preheating cause excessive thermal shock stress which result damage device.
TYPICAL SOLDERING PATTERN
NSL12TT1
SOLDER STENCIL GUIDELINES Prior placing surface mount components onto printed circuit board, solder paste must applied pads. solder stencil required screen optimum amount solder paste onto footprint. stencil made brass stainless steel with typical thickness 0.008 inches. stencil opening size surface mounted package should same size printed circuit board, i.e., registration.
TYPICAL SOLDER HEATING PROFILE given circuit board, there will group control settings that will give desired heat pattern. operator must temperatures several heating zones, figure belt speed. Taken together, these control settings make heating "profile" that particular circuit board. machines controlled computer, computer remembers these profiles from operating session next. Figure shows typical heating profile when soldering surface mount device printed circuit board. This profile will vary among soldering systems good starting point. Factors that affect profile include type soldering system use, density types components board, type solder used, type board substrate material being used. This profile shows temperature versus time. line graph shows actual temperature that might experienced surface test board near central solder joint. profiles based high density density board. Vitronics SMD310 convection/infrared reflow soldering system used generate this profile. type solder used 62/36/2 Lead Silver with melting point between 177-189°C. When this type furnace used solder reflow work, circuit boards solder joints tend heat first. components board then heated conduction. circuit board, because large surface area, absorbs thermal energy more efficiently, then distributes this energy components. Because this effect, main body component degrees cooler than adjacent solder joints.
STEP PREHEAT ZONE RAMP" 200°C
STEP STEP VENT HEATING SOAK" ZONES RAMP"
STEP STEP HEATING HEATING ZONES ZONES SPIKE" SOAK" 170°C 160°C
STEP STEP VENT COOLING 205° 219°C PEAK SOLDER JOINT
DESIRED CURVE HIGH MASS ASSEMBLIES 150°C
150°C
100°C 100°C
140°C
SOLDER LIQUID SECONDS (DEPENDING MASS ASSEMBLY)
50°C
DESIRED CURVE MASS ASSEMBLIES
TIME MINUTES TOTAL)
TMAX
Figure Typical Solder Heating Profile
NSL12TT1
PACKAGE DIMENSIONS SC-75/SOT-416 CASE 463-01 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. MILLIMETERS 0.70 0.80 1.40 1.80 0.60 0.90 0.15 0.30 1.00 -0.10 0.10 0.25 1.45 1.75 0.10 0.20 0.50 INCHES 0.028 0.031 0.055 0.071 0.024 0.035 0.006 0.012 0.039 -0.004 0.004 0.010 0.057 0.069 0.004 0.008 0.020
0.20 (0.008)
0.20 (0.008)
STYLE BASE EMITTER COLLECTOR
NSL12TT1
Thermal Clad trademark Bergquist Company.
Semiconductor trademarks Semiconductor Components Industries, (SCILLC). SCILLC reserves right make changes without further notice products herein. SCILLC makes warranty, representation guarantee regarding suitability products particular purpose, does SCILLC assume liability arising application product circuit, specifically disclaims liability, including without limitation special, consequential incidental damages. "Typical" parameters which provided SCILLC data sheets and/or specifications vary different applications actual performance vary over time. operating parameters, including "Typicals" must validated each customer application customer's technical experts. SCILLC does convey license under patent rights rights others. SCILLC products designed, intended, authorized components systems intended surgical implant into body, other applications intended support sustain life, other application which failure SCILLC product could create situation where personal injury death occur. Should Buyer purchase SCILLC products such unintended unauthorized application, Buyer shall indemnify hold SCILLC officers, employees, subsidiaries, affiliates, distributors harmless against claims, costs, damages, expenses, reasonable attorney fees arising directly indirectly, claim personal injury death associated with such unintended unauthorized use, even such claim alleges that SCILLC negligent regarding design manufacture part. SCILLC Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
Literature Fulfillment: Literature Distribution Center Semiconductor P.O. 5163, Denver, Colorado 80217 Phone: 303-675-2175 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com American Technical Support: 800-282-9855 Toll Free USA/Canada JAPAN: Semiconductor, Japan Customer Focus Center 4-32-1 Nishi-Gotanda, Shinagawa-ku, Tokyo, Japan 141-0031 Phone: 81-3-5740-2700 Email: r14525@onsemi.com Semiconductor Website: http://onsemi.com additional information, please contact your local Sales Representative.
NSL12TT1/D

MAXIMUM RATINGS 25°C) Rating Collector-Emitter Voltage Collector-

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