94-03-29 94-09-19 96-06-27 98-07-22 Frye Frye Frye Raymond Monnin
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REVISIONS DESCRIPTION packages vendor CAGE 60395 source supply. Increase data retention years, minimum. Redrawn with changes. Changes accordance with 5962-R139-94. Changes accordance with 5962-R278-94. Changes accordance with 5962-R163-96. Updated boilerplate. Added device types 16-18 packages drawing along with vendor CAGE 0EU86 supplier. Removed figures software data protect algorithms. Removed vendor 61395 supplier. Corrected dimensions packages "N". Added device packages updated boilerplate. DATE (YR-MO-DA) 93-06-29 APPROVED Frye
94-03-29 94-09-19 96-06-27 98-07-22
Frye Frye Frye Raymond Monnin
99-10-06
Raymond Monnin Raymond Monnin
ORIGINAL FIRST PAGE THIS DRAWING BEEN REPLACED. SHEET SHEET STATUS SHEETS
SHEET
PREPARED Kenneth Rice CHECKED Charles Reusing
PMIC
STANDARD MICROCIRCUIT DRAWING
THIS DRAWING AVAILABLE DEPARTMENTS AGENCIES DEPARTMENT DEFENSE AMSC
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216
APPROVED Charles Besore
MICROCIRCUIT, MEMORY, DIGITAL, CMOS 128K EEPROM, MONOLITHIC SILICON
SIZE
SHEET
DRAWING APPROVAL DATE 91-07-12 REVISION LEVEL
CAGE CODE 67268
5962-38267
DSCC FORM 2233 DISTRIBUTION STATEMENT Approved public release; distribution unlimited.
5962-E561-01
SCOPE Scope. This drawing documents product assurance class levels consisting high reliability (device classes space application (device class choice case outlines lead finishes available reflected Part Identifying Number (PIN). When available, choice Radiation Hardness Assurance (RHA) levels reflected PIN. PIN. shall shown following example: 5962 Federal stock class designator Drawing number 1.2.1 designator. Device classes marked devices meet MIL-PRF-38535 specified levels marked with appropriate designator. Device class marked devices meet MIL-PRF-38535, appendix specified levels marked with appropriate designator. dash indicates non-RHA device. 1.2.2 Device type(s). device type(s) shall identify circuit function follows: Software data protect designator (see 1.2.1) 38267 Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5)
Device type 01,16 03,17 05,18 07,19
Generic number
Circuit function 128K EEPROM 128K EEPROM 128K EEPROM 128K EEPROM 128K EEPROM 128K EEPROM 128K EEPROM 128K EEPROM 128K EEPROM 128K EEPROM 128K EEPROM 128K EEPROM 128K EEPROM 128K EEPROM 128K EEPROM
Access time
Write speed
Write mode Byte/Page Byte/Page Byte/Page Byte/Page Byte/Page Byte/Page Byte/Page Byte/Page Byte/Page Byte/Page Byte/Page Byte/Page Byte/Page Byte/Page Byte/Page
Endurance 10,000 cycle 10,000 cycle 10,000 cycle 10,000 cycle 10,000 cycle 10,000 cycle 10,000 cycle 10,000 cycle 10,000 cycle 10,000 cycle 10,000 cycle 10,000 cycle 10,000 cycle 10,000 cycle 10,000 cycle
1.2.3 Device class designator. device class designator shall single letter identifying product assurance level follows: Device class Device requirements documentation Vendor self-certification requirements MIL-STD-883 compliant, non-JAN class level microcircuits accordance with MIL-PRF-38535, appendix Certification qualification MIL-PRF-38535
Generic numbers listed Standard Microcircuit Drawing Source Approval Bulletin this document will also listed QML-38535 MIL-HDBK-103. SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
REVISION LEVEL
5962-38267
SHEET
1.2.4 Case outline(s). case outline(s) shall designated MIL-STD-1835 follows: Outline letter Descriptive designator GDIP1-T32 CDIP2-T32 CQCC1-N44 figure CQCC1-N32 figure figure figure figure figure 1(enhanced tolerant) figure 1(enhanced tolerant) Terminals Package style Dual in-line Square chip carrier Flat package Rectangular chip carrier Grid array Grid array Flat package Flat package Flat package Flat package
1.2.5 Lead finish. lead finish specified MIL-PRF-38535 device classes MIL-PRF-38535, appendix device class Absolute maximum ratings. Supply voltage range (VCC) Operating case temperature range Storage temperature range Lead temperature (soldering, seconds) Thermal resistance, junction-to-case (JC): Cases Cases Case Case Case Case Case Maximum power dissipation (PD) Junction temperature (TJ) Endurance Data retention Recommended operating conditions. Supply voltage range (VCC) Supply voltage (VSS) High level input voltage range (VIH) level input voltage range (VIL) Case operating temperature range (TC) Digital logic testing device classes Fault coverage measurement manufacturing logic tests (MIL-STD-883, test method 5012) percent minimum maximum -0.1 -55(C +125(C -0.5 +6.0 -55(C +125(C -65(C +150(C +300(C MIL-STD-1835 21(C/W 18(C/W 3(C/W 2(C/W 1.5(C/W 1.5(C/W watts +175(C 10,000 cycles/byte (minimum) years minimum
Stresses above absolute maximum rating cause permanent damage device. Extended operation maximum levels degrade performance affect reliability. voltages referenced (VSS ground), unless otherwise specified. Negative undershoots minimum -1.0 allowed with maximum pulse width. When thermal resistance this case specified MIL-STD-1835, that value shall supersede value indicated herein. Maximum junction temperature shall exceeded except allowable short duration burn-in screening conditions accordance with method 5004 MIL-STD-883. device types 16-19 only, shall min. max. SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
REVISION LEVEL
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SHEET
APPLICABLE DOCUMENTS Government specification, standards, handbooks. following specification, standards, handbooks form part this drawing extent specified herein. Unless otherwise specified, issues these documents those listed issue Department Defense Index Specifications Standards (DoDISS) supplement thereto, cited solicitation. SPECIFICATION DEPARTMENT DEFENSE MIL-PRF-38535 Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT DEFENSE MIL-STD-883 MIL-STD-1835 HANDBOOKS DEPARTMENT DEFENSE MIL-HDBK-103 MIL-HDBK-780 List Standard Microcircuit Drawings. Standard Microcircuit Drawings. Test Method Standard Microcircuits. Interface Standard Microcircuit Case Outlines.
(Unless otherwise indicated, copies specification, standards, handbooks available from Standardization Document Order Desk, Robbins Avenue, Building Philadelphia, 19111-5094). Non-Government publications. following documents form part this document extent specified herein. Unless otherwise specified, issues documents which adopted those listed issue DODISS cited solicitation. Unless otherwise specified, issues documents listed DODISS issues documents cited solicitation. AMERICAN SOCIETY TESTING MATERIALS (ASTM)
ASStandard F1192-88
Standard Guide Measurement Single Event Phenomena from Heavy Irradiation Semiconductor Devices.
(Applications copies ASpublications should addressed American Society Testing Materials, 1916 Race Street, Philadelphia, 19103). ELECTRONICS INDUSTRIES ASSOCIATION (EIA) JEDEC Standard EIA/JESD78 Latch-up Test. (Applications copies should addressed Electronics Industries Association, 2500 Wilson Boulevard, Arlington, 22201). (Non-Government standards other publications normally available from organizations that prepare distribute documents. These documents also available through libraries other informational services). Order precedence. event conflict between text this drawing references cited herein, text this drawing shall take precedence. Nothing this document, however, supersedes applicable laws regulations unless specific exemption been obtained.
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REQUIREMENTS Item requirements. individual item requirements device classes shall accordance with MIL-PRF-38535 specified herein modified device manufacturer's Quality Management (QM) plan. modification plan shall affect form, fit, function described herein. individual item requirements device class shall accordance with MIL-PRF-38535, appendix non-JAN class level devices specified herein. Design, construction, physical dimensions. design, construction, physical dimensions shall specified MIL-PRF-38535 herein device classes MIL-PRF-38535, appendix herein device class 3.2.1 Case outline(s). case outline(s) shall accordance with 1.2.4 herein figure 3.2.2 Terminal connections. terminal connections shall specified figure 3.2.3 Truth table. truth table shall specified figure
3.2.3.1 Unprogrammed devices. truth table unprogrammed devices contracts involving altered item drawing shall specified figure herein. When required, screening (see herein), quality conformance inspection groups (see herein), devices shall programmed manufacturer prior test checkerboard similar pattern minimum percent total number bits programmed). 3.2.3.2 Programmed devices. requirements supplying programmed devices part this document.
Electrical performance characteristics postirradiation parameter limits. Unless otherwise specified herein, electrical performance characteristics postirradiation parameter limits specified table shall apply over full case operating temperature range. Electrical test requirements. electrical test requirements shall subgroups specified table IIA. electrical tests each subgroup defined table Marking. part shall marked with listed herein. addition, manufacturer's also marked listed MIL-HDBK-103. packages where marking entire number feasible space limitations, manufacturer option marking "5962-" device. product using this option, designator shall still marked. Marking device classes shall accordance with MIL-PRF-38535. Marking device class shall accordance with MIL-PRF-38535, appendix 3.5.1 Certification/compliance mark. certification mark device classes shall "QML" required MIL-PRF-38535. compliance mark device class shall required MIL-PRF-38535, appendix
Certificate compliance. device classes certificate compliance shall required from QML-38535 listed manufacturer order supply requirements this drawing (see 6.6.1 herein). device class certificate compliance shall required from manufacturer order listed approved source supply MIL-HDBK-103 (see 6.6.2 herein). certificate compliance submitted DSCC-VA prior listing approved source supply this drawing shall affirm that manufacturer's product meets, device classes requirements MIL-PRF-38535 herein device class requirements MIL-PRF-38535, appendix herein.
Certificate conformance. certificate conformance required device classes MIL-PRF-38535 device class MIL-PRF-38535, appendix shall provided with each microcircuits delivered this drawing. Notification change device class device class notification DSCC-VA change product (see herein) involving devices acquired this drawing required change defined MIL-PRF-38535, appendix
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Verification review device class device class DSCC, DSCC's agent, acquiring activity retain option review manufacturer's facility applicable required documentation. Offshore documentation shall made available onshore option reviewer.
3.10 Microcircuit group assignment device class Device class devices covered this drawing shall microcircuit group number (see MIL-PRF-38535, appendix
3.11 Processing EEPROMs. testing requirements quality assurance provisions herein shall satisfied manufacturer prior delivery. 3.11.1 Conditions supplied devices. Devices will supplied unprogrammed clear state. provision will made supplying programmed devices. 3.11.2 Erasure EEPROMs. When specified, devices shall erased accordance with procedures characteristics specified 4.5.1. 3.11.3 Programming EEPROMs. When specified, devices shall programmed accordance with procedures characteristics specified 4.5.2. 3.11.4 Verification state EEPROMs. When specified, devices shall verified either written specified pattern cleared. minimum, verification shall consist performing read entire array verify that bits proper state. that does verify proper state shall constitute device failure device shall removed from sample. 3.11.5 Power supply sequence EEPROMs. order reduce probability inadvertant writes, following power supply sequences shall observed. device types 1-19, logic high state shall applied and/or same time before application VCC. device types 16-19, additional precaution available, logic state shall applied same time before application VCC. device types 1-19, logic high state shall applied and/or same time before removal VCC. device types 16-19, additional precaution available, logic state shall applied same time before removal VCC. 3.12 Endurance. reprogrammability test shall completed part vendor's reliability monitors. This reprogrammability test shall done initial characterization after design process changes which affect reprogrammability device. methods procedures vendor specific, shall guarantee number program/erase endurance cycles listed section herein over full military temperature range. vendor's procedure shall kept under document control shall made available upon request acquiring preparing activity, along with test data. 3.13 Data retention. data retention stress test shall completed part vendor's reliability monitors. This test shall done initial characterization after design process change which affect data retention. methods procedures vendor specific, shall guarantee number years listed section herein over full military temperature range. vendor's procedure shall kept under document control shall made available upon request acquiring preparing activity, along with test data.
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QUALITY ASSURANCE PROVISIONS Sampling inspection. device classes sampling inspection procedures shall accordance with MILPRF-38535 modified device manufacturer's Quality Management (QM) plan. modification plan shall affect form, fit, function described herein. device class sampling inspection procedures shall accordance with MIL-PRF-38535, appendix Screening. device classes screening shall accordance with MIL-PRF-38535, shall conducted devices prior qualification technology conformance inspection. device class screening shall accordance with method 5004 MIL-STD-883, shall conducted devices prior quality conformance inspection. 4.2.1 Additional criteria device class Delete sequence specified initial (preburn-in) electrical parameters through interim (postburn-in) electrical parameters method 5004 substitute lines through table herein. Prior burn-in, devices shall programmed (see 4.5.2 herein) with checkerboard pattern equivalent (manufacturers their option employ equivalent pattern provided topologically true alternating pattern). pattern shall read before after burn-in. Devices having bits proper state after burn-in shall constitute device failure shall included calculation shall removed from lot. test circuit shall maintained manufacturer under document revision level control shall made available preparing acquiring activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1015. Dynamic burn-in (method 1015 MIL-STD-883, test condition circuit, 4.2.1c herein).
Interim final electrical parameters shall specified table herein. After completion screening, device shall erased verified prior delivery.
4.2.2 Additional criteria device classes burn-in test duration, test condition test temperature, approved alternatives shall specified device manufacturer's plan accordance with MIL-PRF-38535. burn-in test circuit shall maintained under document revision level control device manufacturer's Technology Review Board (TRB) accordance with MIL-PRF-38535 shall made available acquiring preparing activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1015 MILSTD-883. Interim final electrical test parameters shall specified table herein. Additional screening device class beyond requirements device class shall specified appendix MIL-PRF-38535.
Qualification inspection device classes Qualification inspection device classes shall accordance with MIL-PRF-38535. Inspections performed shall those specified MIL-PRF-38535 herein groups inspections (see 4.4.1 through 4.4.4). Conformance inspection. Technology conformance inspection classes shall accordance with MIL-PRF38535 including groups inspections specified herein. Quality conformance inspection device class shall accordance with MIL-PRF-38535, appendix specified herein. Inspections performed device class shall those specified method 5005 MIL-STD-883 herein groups inspections (see 4.4.1 through 4.4.4).
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TABLE Electrical performance characteristics. Test |Symbol |IIH |IIL |IOZH |IOZL |VOH |VOL |VIH |VIL |ICC1 |ICC2 |ICC3 Conditions -55(C +125(C unless otherwise specified |VCC |VCC input |VIH |VCC |VIH |VCC |IOH -400 |VIH |IOL |VIH |VCC |VCC |VCC VIH, 1/tAVAV |VCC VIH, I/O's open, VIL, |VCC= -0.3 |Inputs VIH, I/O's open, VIL, Group |subgroups Device types 16-19 01-15 16-19 01-15 16-19 01-06, 08,13, 16,17 07,18, 09-12, 14,15 01-07 08-12 13-15, 16-19 Limits -100 -0.5 |VCC |VCC Unit
High level input current level input current
High impedance output leakage current
Output high voltage
Output voltage
Input high voltage
Input voltage high voltage high voltage Operating supply current
Standby supply current
Standby supply current CMOS
footnotes table.
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TABLE Electrical performance characteristics Continued. Test |Symbol |CIN |COUT |tAVAV |tAVQV |tELQV |tOLQV |tELQX |tEHQZ Conditions -55(C +125(C unless otherwise specified |VIN MHz, +25(C, 4.4.1c |VOUT +25(C, 4.4.1c 4.4.1d figures applicable. Group |subgroups 7,8A,8B Device types |01-02,16 |03-04,17 |05-06,18 07,08, 13,19 09,10, 11,12, |01-02,16 |03-04,17 |05-06,18 07,08, 13,19 09,10, 11,12, |01-02,16 |03-04,17 |05-06,18 07,08, 13,19 09,10, 11,12, 01-06 07-15 16-19 01-06 07-19 Limits Unit 10.0 12.0
Input capacitance
Output capacitance
Functional tests
Read cycle time
Address access time
access time
access time
output Chip disable output high footnotes table.
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
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TABLE Electrical performance characteristics Continued. Test |Symbol |tOLQX |tOHQZ |tAXQX |tWHWL1 |tEHEL1 |tAVWL |tAVEL |tWLAX |tELAX |tELWL |tWLEL |tWHEH |tEHWH |tOHWL |tOHEL |tWHOL |tEHOL |tWLWH |tELEH |tDVWH |tDVEH Conditions -55(C +125(C unless otherwise specified |See figures applicable. Group |subgroups Device types 01-06 07-19 01,03, 05,07, 09,11, 16-19 02,04 08,10, 12-15 16-19 01-08, 09-12, 14,15 01-15 16-19 01-15 16-19 01-15 16-19 16-19 01-08, 09-12, 14,15 Limits Unit
output Output disable output high Output hold from address change
Write cycle time
Address setup time
Address hold time
Write setup time
Write hold time
setup time
hold time
Write pulse width (page byte write) Data setup time
footnotes table.
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TABLE Electrical performance characteristics Continued. Test |Symbol |tWHDX |tEHDX |tWHWL2 |tWHEL |tEHEL |tELWL |tOVHWL |tWLWH2 |tWHEH |tWHOH |tOLEL |tDHWL |tWHDX Conditions -55(C +125(C unless otherwise specified |See figures applicable. |See figures applicable. Group |subgroups Device types 01-07 16-19 08-15 01-15 16-19 |01-02,16 |03-04,17 |05-06,18 |07,08, |13,19 |09,10, |11,12, 01-15 01-15 01-07 08-15 01-15 01-15 01-15 01-15 01-15 01-15 Limits Unit
Data hold time
Byte load cycle
Last byte loaded data polling
setup time (chip erase) setup time (chip erase) pulse width (chip erase) hold time (chip erase) hold time (chip erase) High voltage (chip erase) Clear recovery (chip erase) Data setup time (chip erase) Data hold time during chip erase cycle footnotes table.
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
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TABLE Electrical performance characteristics Continued. |Symbol |tDFR |tRR |tRP |tRES |tDB Conditions -55(C +125(C unless otherwise specified |See figures applicable. Group |subgroups Device types 16-19 16-19 16-19 16-19 16-19 Unit
Test
output float
output delay Reset protect time
Reset high time
Time device busy
Limits
Connect address inputs measure IOZL IOZH with output under test connected VOUT. Terminal conditions output leakage current test shall follows: device types 01-15 device types 16-19; IOZL: Select appropriate address acquire logic designated output. Apply Measure leakage current while applying specified voltage. IOZH: Select appropriate address acquire logic designated output. Apply Measure leakage current while applying specified voltage. functional test shall verify input output levels applicable patterns appropriate, input pins shall tested. Terminal conditions follows: Inputs: =2.0 device types 01-15 device types 16-19; Outputs: minimum maximum. functional tests shall performed with pins being tested open. Tested initially after design process changes which affect that parameter, therefore shall guaranteed limits specified table Tested application specified timing signals conditions. Equivalent test conditions: Output load, figure input rise fall times input pulse levels, timing measurement reference levels, inputs, device types 1-15 device types 16-19; outputs, device types 1-15 device types 16-19. Chip erase functions applicable device types 01-15 only. This parameter applicable internal timer controlled devices. functions applicable device types 16-19 only.
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4.4.1 Group inspection. Tests shall specified table herein. Subgroups table method 5005 MIL-STD-883 shall omitted. Subgroup (CIN COUT measurements) shall measured only initial qualification after process design changes which affect input output capacitance. Capacitance shall measured between designated terminal frequency MHz. Sample size devices with failures input output terminals tested. device class subgroups tests shall sufficient verify truth table. device classes subgroups shall include verifying functionality device, these tests shall have been fault graded accordance with MIL-STD-883, test method 5012 (see herein). (latch-up) tests shall measured only initial qualification after design process changes which affect performance device. device class procedures circuits shall maintained under document revision level control manufacturer shall made available preparing activity acquiring activity upon request. device classes procedures circuits shall under control device manufacturer's accordance with MIL-PRF-38535 shall made available preparing activity acquiring activity upon request. Testing shall pins, five devices with zero failures. Latch-up test shall considered destructive. Information contained JEDEC Standard EIA/JESD78 used reference. devices selected testing shall programmed with checkerboard pattern equivalent. After completion testing, devices shall erased verified, (except devices submitted groups testing).
4.4.2 Group inspection. group inspection end-point electrical parameters shall specified table herein. 4.4.2.1 Additional criteria device class Steady-state life test conditions, method 1005 MIL-STD-883: device selected testing shall programmed with checkerboard pattern. After completion testing, devices shall erased verified (except devices submitted group testing). Test condition test circuit shall maintained manufacturer under document revision level control shall made available preparing acquiring activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1005. +125(C, minimum. Test duration: 1,000 hours, except specified method 1005 MIL-STD-883.
devices requiring end-point electrical testing shall programmed with checkerboard equivalent alternating pattern. After completion testing, devices shall cleared verified prior delivery.
4.4.2.2 Additional criteria device classes steady-state life test duration, test condition test temperature, approved alternatives shall specified device manufacturer's plan accordance with MIL-PRF-38535. test circuit shall maintained under document revision level control device manufacturer's TRB, accordance with MILPRF-38535, shall made available acquiring preparing activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1005 MIL-STD-883. 4.4.3 Group inspection. group inspection end-point electrical parameters shall specified table herein. devices selected testing shall programmed with checkerboard pattern. After completion testing, devices shall erased verified.
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
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Case
FIGURE Case outline.
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
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Case
FIGURE Case outline Continued.
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
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Case
FIGURE Case outline Continued.
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Case Variations (all dimensions shown inches) Symbol .090 .015 .015 .004 .004 .430 .330 .030 .050 .008 1.228 .015 .120 .020 .019 .007 .006 .830 .488 .498 Notes
.025 .270 .026 .005 .370 .045 .045
Inches .004 .005 .006 .007 .008 .015 .019
0.10 0.13 0.15 0.18 0.20 0.38 0.48
Inches .020 .025 .026 .030 .045 .050 .120
0.51 0.64 0.66 0.76 1.14 1.27 3.05
Inches .270 .350 .370 .472 .488 .498 1.228
6.86 8.89 9.40 11.99 12.40 12.65 31.19
NOTES: dimensions tolerances conform ANSI Y14.5M-1982. Index area: identification mark shall located adjacent within shaded area shown. Alternatively, (dim used shown. Dimension shall measured from point lead located opposite braze pad. This dimension includes thickness. Optional, note identification used instead this tab, minimum dimension does apply. indicates number leads. Uses metal lid. Includes braze fillet. Metric equivalents given general information only. FIGURE Case outline Continued.
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Case
indicator
FIGURE Case outline Continued.
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Case Variations Millimeters Symbol 2.46 2.29 .038 0.08 20.57 18.92 10.80 8.38 1.14 25.40 7.37 0.66 3.12 2.79 .048 0.18 21.08 19.18 11.30 9.04 1.40 27.94 7.87 0.94 .097 .090 .015 .003 .810 .745 .425 .330 .045 1.00 .290 .026 .123 .110 .019 .007 .830 .755 .445 .356 .055 1.10 .310 .037 Inches
NOTE:
Although dimensions inches, government preferred system measurement metric system. However, since this item originally designed using inch-pound units measurement, event conflict between two, inch-pound units shall take precedence. Metric equivalents general information only.
FIGURE Case outline Continued.
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Case
indicator
FIGURE Case outline Continued.
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Case Variations Millimeters Symbol 3.18 2.29 0.38 0.08 20.57 19.69 18.92 10.80 7.37 1.14 25.40 7.37 0.66 3.81 2.79 0.48 0.18 21.08 19.94 19.18 11.30 7.87 1.40 27.94 7.87 0.94 .125 .090 .015 .003 .810 .775 .745 .425 .290 .045 1.00 .290 .026 .150 .110 .019 .007 .830 .785 .755 .445 .310 .055 1.10 .310 .037 Inches
NOTE:
Although dimensions inches, government preferred system measurement metric system. However, since this item originally designed using inch-pound units measurement, event conflict between two, inch-pound units shall take precedence. Metric equivalents general information only.
FIGURE Case outline Continued.
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
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Case
FIGURE Case outline Continued.
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
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Case Variations Millimeters Symbol 0.13 7.37 0.51 7.87 1.14 3.07 0.38 0.10 11.99 7.72 0.76 1.27 3.81 0.56 0.18 21.08 12.40 7.87 .121 .015 .004 .472 .304 .030 .050 .005 .355 .020 .375 .045 .150 .022 .009 .830 .488 .498 Inches
NOTE:
Although dimensions inches, government preferred system measurement metric system. However, since this item originally designed using inch-pound units measurement, event conflict between two, inch-pound units shall take precedence. Metric equivalents general information only. This package manufactured additonal tolerant capabilities, contact vendor specific information.
FIGURE Case outline Continued.
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Case
FIGURE Case outline Continued.
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Case Variations Millimeters Symbol 0.13 8.89 0.53 10.41 0.91 3.18 .038 0.08 10.26 5.94 0.76 1.27 3.81 0.56 0.23 21.08 10.57 11.18 .117 .015 .003 .404 .234 .030 .050 .005 .350 .021 .410 .036 .143 .022 .009 .830 .416 .440 Inches
NOTE:
Although dimensions inches, government preferred system measurement metric system. However, since this item originally designed using inch-pound units measurement, event conflict between two, inch-pound units shall take precedence. Metric equivalents general information only. This package manufactured additonal tolerant capabilities, contact vendor specific information.
FIGURE Case outline Continued.
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Device types Case outlines Terminal number connection I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7
Terminal symbol I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 -A14 I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7
N,6,7
RDY/B I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7
RDY/B I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7
FIGURE Terminal connections.
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
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Device types 01-15 Mode Read Write Standby Write inhibit Write inhibit Write inhibit Write inhibit Software chip clear Software write protect High voltage chip clear DOUT High DOUT High High DOUT High operation
High logic, state, logic, state. logic "don't care" state, High high impedance state. Chip clear voltage, DOUT Data out, Data
Device types 16-19 Mode Read Standby Write Deselect Write inhibit Write inhibit polling Program reset RDY/B High High High High -VOL High DOUT High High -DOUT (I/O7) High
High logic, state, logic, state. logic "don't care" state, High high impedance state. Data DOUT Data out, VCC-0.5 VCC+1.0
FIGURE Truth table.
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
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READ MODE WAVEFORM
NOTE: waveform applicable device types 16-19 only.
FIGURE Waveforms.
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CONTROLLED BYTE WRITE WAVEFORMS
NOTE: RDY/B waveforms applicable device types 16-19 only.
FIGURE Waveforms.
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CONTROLLED BYTE WRITE WAVEFORMS
NOTE: RDY/B waveforms applicable device types 16-19 only.
FIGURE Waveforms Continued.
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PAGE WRITE MODE CYCLE WAVEFORMS
NOTE: RDY/B waveforms applicable device types 16-19 only.
FIGURE Waveforms Continued.
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CHIP ERASE WAVEFORMS (device types 01-15 only)
FIGURE Waveforms continued.
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NOTES: will adjusted meet load conditions table this circuit equivalent circuit.
FIGURE Switching load circuit.
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
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TABLE IIA. Electrical test requirements. Line Test requirements Subgroups (per method 5005, table Device class Interim electrical parameters (see 4.2) Static burn-in method 1015 Same line Dynamic burn-in (method 1015) Same line Final electrical parameters Group test requirements Group end-point electrical parameters Group end-point electrical parameters Group end-point electrical parameters 1*,2,3,7*, 8A,8B,9,10,11 1*,2,3,7*, 8A,8B,9,10,11 Required Required required Subgroups (per MIL-PRF-38535, table III) Device class 1,7,9 2,8A,10 required Device class 1,7,9 1,2,8A,10 Required 1*,7*
Required 1*,7*
1*,2,3,7*, 8A,8B,9,10,11 1,2,3,4**,7, 8A,8B,9,10,11 1,2,3,7,8A,8B, 9,10,11 2,3,7, 8A,8B 1,7,9
1,2,3,4**,7,8A, 1,2,3,4**,7, 8B,9,10,11 8A,8B,9,10,11 2,3,7,8A,8B 1,2,3,7,8A,8B, 9,10, 2,3,7 8A,8B 1,7,9
2,3,7,8A,8B 1,7,9
Blank spaces indicate test applicable. subgroups combined when using high-speed testers. Subgroups functional tests shall verify truth table. Indicates applies subgroups 4.4.1c. Indicates delta limit (see table IIB) shall required where specified, delta values shall computed with reference previous interim electrical parameters (see line 4.4.1e. TABLE IIB. Delta limits +25(C. Test ICC3 standby IIH, IOHZ, IOLZ device types specified value table specified value table specified value table
above parameters shall recorded before after required burn-in life tests determine delta
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
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4.4.4 Group inspection. Group inspection required only parts intended marked radiation hardness assured (see herein). levels device classes shall specified MIL-PRF-38535. End-point electrical parameters shall specified table herein. device classes devices test vehicle shall subjected radiation hardness assured tests specified MIL-PRF-38535 level being tested. device class devices shall subjected radiation hardness assured tests specified MIL-PRF-38535, appendix level being tested. device classes must meet postirradiation end-point electrical parameter limits defined table +25(C ±5(C, after exposure, subgroups specified table herein. When specified purchase order contract, copy delta limits shall supplied.
Methods inspection. Methods inspection shall specified appropriate figures tables follows. 4.5.1 Erasing procedures. erasing procedures shall specified device manufacturer shall available upon request. 4.5.2 Programming procedure. programming procedures shall specified device manufacturer shall made available upon request. 4.5.3 Software data protect procedures. software data protect procedures shall specified device manufacturer shall made available upon request. Delta measurements device classes Delta measurements, specified table IIA, shall made recorded before after required burn-in screens steady-state life tests determine delta compliance. electrical parameters measured, with associated delta limits listed table IIB. device manufacturer may, option, either perform delta measurements within hours after burn-in perform final electrical parameter tests, subgroups PACKAGING Packaging requirements. requirements packaging shall accordance with MIL-PRF-38535 device classes MIL-PRF-38535, appendix device class NOTES Intended use. Microcircuits conforming this drawing intended Government microcircuit applications (original equipment), design applications, logistics purposes. 6.1.1 Replaceability. Microcircuits covered this drawing will replace same generic device covered contractor-prepared specification drawing. 6.1.2 Substitutability. Device class devices will replace device class devices.
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
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Configuration control SMD's. proposed changes existing SMD's will coordinated with users record individual documents. This coordination will accomplished using Form 1692, Engineering Change Proposal. Record users. Military industrial users should inform Defense Supply Center Columbus when system application requires configuration control which SMD's applicable that system. DSCC will maintain record users this list will used coordination distribution changes drawings. Users drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544 Comments. Comments this drawing should directed DSCC-VA, Columbus, Ohio 43216-5000, telephone (614) 692-0547. Abbreviations, symbols, definitions. abbreviations, symbols, definitions used herein defined MIL-PRF38535, MIL-STD-1331, follows: CIN, COUT Input bidirectional output, terminal-to-GND capacitance. Ground zero voltage potential. Supply current. Input current low. Input current high. Case temperature. Ambient temperature. Positive supply voltage. Output enable Write enable voltage during chip erase. Latchup over-voltage.
6.5.1 Timing limits. table timing values shows either minimum maximum limit each parameter. Input requirements specified from external system point view. Thus, address setup time shown minimum since system must supply least that much time (even though most devices require it). other hand, responses from memory specified from device point view. Thus, access time shown maximum since device never provides data later than that time. 6.5.2 Timing parameter abbreviations. timing abbreviations lower case characters with upper case subscripts. initial character always followed four descriptors. These characters specify signal points arranged "from-to" sequence that define timing interval. descriptors each signal specify signal name signal transition. Thus format Signal name from which interval defined Transition direction first signal Signal name which interval defined Transition direction second signal Signal definitions: Address Data Data Write enable Chip enable Output enable
Transition definitions: Transition high Transition Transition valid Transition invalid don't care Transition (high impedance)
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
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6.5.3 Waveforms. Waveform symbol Input MUST VALID CHANGE FROM CHANGE FROM DON'T CARE CHANGE PERMITTED Output WILL VALID WILL CHANGE FROM WILL CHANGE FROM CHANGING STATE UNKNOWN HIGH IMPEDANCE
Sources supply.
6.6.1 Sources supply device classes Sources supply device classes listed QML-38535. vendors listed QML-38535 have submitted certificate compliance (see herein) DSCC-VA have agreed this drawing. 6.6.2 Approved sources supply device class Approved sources supply class listed MIL-HDBK-103. vendors listed MIL-HDBK-103 have agreed this drawing certificate compliance (see herein) been submitted accepted DSCC-VA.
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
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STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN DATE: FINAL PRELIMINARY Approved sources supply 5962-38267 listed below immediate acquisition only shall added MIL-HDBK-103 QML-38535 during next revision. MIL-BUL-103 QML-38535 will revised include addition deletion sources. vendors listed below have agreed this drawing certificate compliance been submitted accepted DSCC-VA. This bulletin superseded next dated revision MIL-BUL-103 QML-38535. Standard microcircuit drawing 5962-3826701MXA 5962-3826701MYA 5962-3826701MZA 5962-3826701MZC 5962-3826701MTA 5962-3826701MUA 5962-3826701MWC 5962-3826702MXA 5962-3826702MYA 5962-3826702MZA 5962-3826702MWA 5962-3826703MXA 5962-3826703MYA 5962-3826703MZA 5962-3826703MZC 5962-3826703MTA 5962-3826703MUA 5962-3826703MWC 5962-3826704MXA 5962-3826704MYA Vendor CAGE number 1FN41 1FN41 1FN41 1FN41 1FN41 1FN41 1FN41 1FN41 1FN41 1FN41 Vendor similar AT28C010-25BM/883 X28C010DMB-25 CM28C010-250 AT28C010-25LM/883 LM28C010-250 AT28C010-25FM/883 X28C010FMB-25 FM28C010-250 AT28C010-25UM/883 AT28C010-25EM/883 X28C010KMB-25 TM28C010-250 CM28C010H-250 LM28C010H-250 FM28C010H-250 TM28C010H-250 AT28C010-20BM/883 X28C010DMB-20 CM28C010-200 AT28C010-20LM/883 LM28C010-200 AT28C010-20FM/883 X28C010FMB-20 FM28C010-200 AT28C010-20UM/883 AT28C010-20EM/883 X28C010KMB-20 TM28C010-200 CM28C010H-200 LM28C010H-200
footnotes list.
STANDARDIZED MILITARY DRAWING SOURCE APPROVAL BULLETIN Continued. Standard microcircuit drawing 5962-3826704MZA 5962-3826704MWA 5962-3826705MXA 5962-3826705MYA 5962-3826705MZA 5962-3826705MZC 5962-3826705MTA 5962-3826705MUA 5962-3826705MWC 5962-3826706MXA 5962-3826706MYA 5962-3826706MZA 5962-3826706MWA 5962-3826707MXA 5962-3826707MYA 5962-3826707MTA 5962-3826707MUA 5962-3826707MZA 5962-3826707MZC 5962-3826707MWC Vendor CAGE number 1FN41 60395 1FN41 1FN41 1FN41 1FN41 1FN41 60395 1FN41 1FN41 1FN41 1FN41 Vendor similar FM28C010H-200 TM28C010H-200 AT28C010-15BM/883 X28C010DMB-15 CM28C010-150 AT28C010-15LM/883 LM28C010-150 AT28C010-15FM/883 X28C010FMB-15 FM28C010-150 AT28C010-15UM/883 AT28C010-15EM/883 X28C010KMB-15 TM28C010-150 CM28C010H-150 LM28C010H-150 FM28C010H-150 TM28C010H-150 AT28C010-12BM/883 X28C010DMB-12 CM28C010-120 AT28C010-12LM/883 LM28C010-120 AT28C010-15UM/883 AT28C010-15EM/883 AT28C010-12FM/883 X28C010FMB-12 FM28C010-120 X28C010KMB-12 TM28C010-120
footnotes list.
STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN Continued. Standard microcircuit drawing 5962-3826716QUA 5962-3826716QMA 5962-3826716QMC 5962-3826716QNA 5962-3826716Q6C 5962-3826716Q7C 5962-3826717QUA 5962-3826717QMA 5962-3826717QMC 5962-3826717QNA 5962-3826717Q6C 5962-3826717Q7C 5962-3826718QUA 5962-3826718QMA 5962-3826718QMC 5962-3826718QNA 5962-3826718Q6C 5962-3826718Q7C 5962-3826719QMC 5962-3826719Q6C 5962-3826719Q7C Vendor CAGE number 0EU86 0EU86 68911 0EU86 68911 68911 0EU86 0EU86 68911 0EU86 68911 68911 0EU86 0EU86 68911 0EU86 68911 68911 68911 68911 68911 Vendor similar AS58C1001ECA-25/883C AS58C1001F-25/883C 28C010TFB-25 AS58C1001SF-25/883C 28C010TRPFB-25 28C011TRPFB-25 AS58C1001ECA-20/883C AS58C1001F-20/883C 28C010TFB-20 AS58C1001SF-20/883C 28C010TRPFB-20 28C011TRPFB-20 AS58C1001ECA-15/883C AS58C1001F-15/883C 28C010TFB-15 AS58C1001SF-15/883C 28C010TRPFB-15 28C011TRPFB-15 28C010TFB-12 28C010TRPFB-12 28C011TRPFB-12
lead finish shown each representing hermetic package most readily available from manufacturer listed that part. desired lead finish listed, contact Vendor determine availability. Caution. this number item acquisition. Items acquired this number satisfy performance requirements this drawing. available from approved source. Vendor CAGE number 1FN41 Vendor name address Atmel Corporation 2125 O'Nel Drive Jose, 95131 Xicor, Incorporated Buckeye Court Milpitas, 95035 Austin Semiconductor 8701 Cross Park Drive Austin, 78754-4566 Maxwell Technologies 9244 Balboa Avenue Diego, 92123
60395
0EU86
68911
information contained herein disseminated convenience only Government assumes liability whatsoever inaccuracies this information bulletin.
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