General Purpose Amplifier Transistor Surface Mount MAXIMUM RATING

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General Purpose Amplifier Transistor Surface Mount MAXIMUM RATING

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MSB709-RT1
General Purpose Amplifier Transistor Surface Mount
MAXIMUM RATINGS 25°C)
Rating Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Continuous Collector Current Peak Symbol V(BR)CBO V(BR)CEO V(BR)EBO IC(P) Value -7.0 -100 -200 Unit mAdc mAdc BASE EMITTER
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COLLECTOR
THERMAL CHARACTERISTICS
Characteristic Power Dissipation Junction Temperature Storage Temperature Symbol Tstg +150 Unit
ELECTRICAL CHARACTERISTICS 25°C)
Characteristic Collector-Emitter Breakdown Voltage -2.0 mAdc, Collector-Base Breakdown Voltage mAdc, Emitter-Base Breakdown Voltage mAdc, Collector-Base Cutoff Current (VCB Vdc, Collector-Emitter Cutoff Current (VCE Vdc, Current Gain (Note (VCE Vdc, -2.0 mAdc) Collector-Emitter Saturation Voltage -100 mAdc, mAdc) Symbol V(BR)CEO V(BR)CBO V(BR)EBO ICBO ICEO hFE1 VCE(sat) -7.0 -0.1 -100 -0.5 Unit
SC-59 SUFFIX CASE 318D
MARKING DIAGRAM
mAdc nAdc
Preferred devices recommended choices future best overall value.
Specific Device Code Date Code
Pulse Test: Pulse Width D.C.
Semiconductor Components Industries, LLC, 2002
May, 2002 Rev.
Publication Order Number: MSB709-RT1/D
MSB709-RT1 INFORMATION USING SC-59 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT SURFACE MOUNTED APPLICATIONS Surface mount board layout critical portion total design. footprint semiconductor packages must correct size insure proper solder connection
0.037 0.95
interface between board package. With correct geometry, packages will self align when subjected solder reflow process.
0.037 0.95
0.094 0.039 0.031 inches
SC-59 POWER DISSIPATION power dissipation SC-59 function size. This vary from minimum size soldering size given maximum power dissipation. Power dissipation surface mount device determined TJ(max), maximum rated junction temperature die, RqJA, thermal resistance from device junction ambient; operating temperature, Using values provided data sheet, calculated follows.
TJ(max) RqJA
equation ambient temperature 25°C, calculate power dissipation device which this case milliwatts.
150°C 25°C 370°C/W milliwatts
values equation found maximum ratings table data sheet. Substituting these values into
370°C/W assumes recommended footprint glass epoxy printed circuit board achieve power dissipation milliwatts. Another alternative would ceramic substrate aluminum core board such Thermal CladTM. Using board material such Thermal Clad, power dissipation doubled using same footprint.
SOLDERING PRECAUTIONS melting temperature solder higher than rated temperature device. When entire device heated high temperature, failure complete soldering within short time could result device failure. Therefore, following items should always observed order minimize thermal stress which devices subjected. Always preheat device. delta temperature between preheat soldering should 100°C less.* When preheating soldering, temperature leads case must exceed maximum temperature ratings shown data sheet. When using infrared heating with reflow soldering method, difference should maximum 10°C.
soldering temperature time should exceed
260°C more than seconds. When shifting from preheating soldering, maximum temperature gradient should less. After soldering been completed, device should allowed cool naturally least three minutes. Gradual cooling should used forced cooling will increase temperature gradient result latent failure mechanical stress. Mechanical stress shock should applied during cooling
Soldering device without preheating cause excessive thermal shock stress which result damage device.
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MSB709-RT1
SOLDER STENCIL GUIDELINES Prior placing surface mount components onto printed circuit board, solder paste must applied pads. solder stencil required screen optimum amount solder paste onto footprint. stencil made brass stainless steel with typical thickness 0.008 inches. stencil opening size surface mounted package should same size printed circuit board, i.e., registration.
TYPICAL SOLDER HEATING PROFILE given circuit board, there will group control settings that will give desired heat pattern. operator must temperatures several heating zones, figure belt speed. Taken together, these control settings make heating "profile" that particular circuit board. machines controlled computer, computer remembers these profiles from operating session next. Figure shows typical heating profile when soldering surface mount device printed circuit board. This profile will vary among soldering systems good starting point. Factors that affect profile include type soldering system use, density types components board, type solder used, type board substrate material being used. This profile shows temperature versus time. line graph shows actual temperature that might experienced surface test board near central solder joint. profiles based high density density board. Vitronics SMD310 convection/infrared reflow soldering system used generate this profile. type solder used 62/36/2 Lead Silver with melting point between 177-189°C. When this type furnace used solder reflow work, circuit boards solder joints tend heat first. components board then heated conduction. circuit board, because large surface area, absorbs thermal energy more efficiently, then distributes this energy components. Because this effect, main body component degrees cooler than adjacent solder joints.
STEP PREHEAT ZONE RAMP" 200°C
STEP STEP VENT HEATING SOAK" ZONES RAMP"
STEP STEP HEATING HEATING ZONES ZONES SPIKE" SOAK" 170°C 160°C
STEP STEP VENT COOLING 205° 219°C PEAK SOLDER JOINT
DESIRED CURVE HIGH MASS ASSEMBLIES 150°C
150°C
100°C 100°C
140°C
SOLDER LIQUID SECONDS (DEPENDING MASS ASSEMBLY)
50°C
DESIRED CURVE MASS ASSEMBLIES
TIME MINUTES TOTAL)
TMAX
Figure Typical Solder Heating Profile
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MSB709-RT1
PACKAGE DIMENSIONS
SC-59 CASE 318D-04 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER.
MILLIMETERS 2.70 3.10 1.30 1.70 1.00 1.30 0.35 0.50 1.70 2.10 0.013 0.100 0.09 0.18 0.20 0.60 1.25 1.65 2.50 3.00
INCHES 0.1063 0.1220 0.0512 0.0669 0.0394 0.0511 0.0138 0.0196 0.0670 0.0826 0.0005 0.0040 0.0034 0.0070 0.0079 0.0236 0.0493 0.0649 0.0985 0.1181
Thermal Clad trademark Bergquist Company
Semiconductor registered trademarks Semiconductor Components Industries, (SCILLC). SCILLC reserves right make changes without further notice products herein. SCILLC makes warranty, representation guarantee regarding suitability products particular purpose, does SCILLC assume liability arising application product circuit, specifically disclaims liability, including without limitation special, consequential incidental damages. "Typical" parameters which provided SCILLC data sheets and/or specifications vary different applications actual performance vary over time. operating parameters, including "Typicals" must validated each customer application customer's technical experts. SCILLC does convey license under patent rights rights others. SCILLC products designed, intended, authorized components systems intended surgical implant into body, other applications intended support sustain life, other application which failure SCILLC product could create situation where personal injury death occur. Should Buyer purchase SCILLC products such unintended unauthorized application, Buyer shall indemnify hold SCILLC officers, employees, subsidiaries, affiliates, distributors harmless against claims, costs, damages, expenses, reasonable attorney fees arising directly indirectly, claim personal injury death associated with such unintended unauthorized use, even such claim alleges that SCILLC negligent regarding design manufacture part. SCILLC Equal Opportunity/Affirmative Action Employer.
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MSB709-RT1/D

General Purpose Amplifier Transistor Surface Mount MAXIMUM RATING

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