BluetoothMulti Chip Module Pre-qualified Bluetooth Module Multi P

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BluetoothMulti Chip Module Pre-qualified Bluetooth Module Multi P

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BluetoothMulti Chip Module
Pre-qualified Bluetooth Module Multi Point Operation, slaves output power class ETSI approved Multiple interfaces different applications UART data (HCI interface) voice voice data (HCI interface) interface controlling external devices Internal crystal oscillator firmware over UART included
Description
module implementing Bluetooth functionality into various electronic devices. module consists three major parts; baseband controller, flash memory radio that operates globally available free band. Both data voice transmission supported module. Communication between module host controller carried using full-speed interface compliant with Specification UART/PCM interface. When using interface, module appears slave device therefore requires resources. 007, which compliant with Bluetooth version 1.1, Class Bluetooth Module dBm) typeapproved. module supports Bluetooth profiles.
Suggested Applications
Computers peripherals Handheld devices accessories Access points
Bluetooth trademarks owned Bluetooth SIG, Inc., U.S.A.
voltage regulato
UART
crystal radio
antenna interface
baseband
flash
Figure Block Diagram.
Baseband Radio
Figure Actual size Bluetooth Module also showing stack.
Absolute Maximum Ratings
Parameter Symbol Unit
Temperature Storage temperature Operating temperature Power Supply VCC_IO Digital Inputs Input voltage Input high voltage Antenna Port Input power In-band band -0.5 VCC_IO+0.3 VCC_IO -0.3 -0.8 +7.0 +3.6 TStg TAmb
Recommended Operating Conditions
Parameter Condition Symbol Unit
Temperature Ambient temperature, Test Power Supply Supply Voltage Ports Supply Voltage VCC_IO 3.175 TAmb
Electrical Characteristics
Unless otherwise noted, specification applies TAmb +75°C, VSWR 2:1. Specifications
Parameter Condition Symbol Unit
Digital Inputs Logical Input Logical Input Logical Input High Logical Input RESET# Input Digital Outputs Logical Output High Logical Output Average Current Consumption Shutdown state Idle state Connection Hold mode Park mode Sniff mode Page Scan Inquiry mode Beacon interval 1.28s Sniff interval 1.28s Mandatory page scan mode ICC_IO `ON' `VCC_IO' grounded After reset Master mode Slave mode IShw IIdle IHold IPark ISniff IPSM IISM 0.9xVCC_IO VCC_IO 0.1xVCC_IO High Except signal Except RESET# signal signal only signal only RESET# signal only VIH1 VIL1 VIH2 VIL2 VRESET 0.7xVCC_IO VCC_IO 0.3xVCC_IO
Parameter Condition Symbol Unit
Timing Performance System start-up time from power RESET# signal duration Sink current Firmware timer resolution Timing Information clock frequency sample rate sync. frequency clock high period clock period PCM_SYNC (setup) PCM_CLK (fall) PCM_SYNC pulse length PCM_X (setup) PCM_CLK (fall) PCM_X (hold) from PCM_CLK (fall) PCM_X valid from PCM_CLK (rise) Master mode Slave mode fPCM_CLK fPCM_CLK fPCM_SYNC tCCH tCCL tPSS tPSH tDSL tDSH tPDLP 1000 2000 2000 6.55
Specifications
Parameter Condition Symbol Unit
General Antenna load Transmitter Performance power Spurious emissions mode 12.75 5.15 12.75 30-1910 1910-2000 2000-2399 2484-3000 3000-12750
Receiver Performance (BER 0.1%) Sensitivity level input level Spurious Emissions mode Out-of-band blocking
PCM_CLK tPSS
PCM_SYNC
tPSH tDSL
tDSH
PCM_X
tPDLP
MSB-1
MSB-2
MSB-3
PCM_X
MSB-1
MSB-2
Figure timing.
Description
Name Type Direction Description
PCM_IN PCM_OUT PCM_SYNC PCM_CLK DGND WAKE_UP DETACH I2C_CLK VCC_IO RESET# I2C_DATA
CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS Power CMOS CMOS CMOS CMOS Power CMOS Power Power Power Power CMOS Power Power Power CMOS
In/Out In/Out Input Input In/Out In/Out Power Output Output Output Input Input Output Power Power Power Power Input Power In/Out Power Power In/Out
data, note data, note Sets data sampling rate, note clock that sets data rate, note data UART Flow control signal, Request Send data from UART, note data data Signal ground Indicates that module wants attached USB. Active High. data from UART Flow control signal, Clear Send data from UART Indicates that host wants detach module. Active High. When tied VCC, module enabled. clock signal External supply rail Input Output ports connect Supply Voltage Signal ground Signal ground Active reset, note connect connect connect Signal Ground Antenna connection Signal Ground Test point, internal voltage regulator connect connect data signal
Notes pull-up resistors VCC_IO used module. signals direction programmable. RESET# signal must from open drain output.
Figure Pinout drawing.
Mechanical Specification
32.8
5.05 7.85
16.8
7.85
14.1 15.7 Detail
14.1
approx
Detail 0.54 Co-planarity
3.12 4.39 5.66 6.93 9.47
Figure Mechanical dimensions.
22.22 23.5 24.76
5.72 6.98
size: 0.889 Tolerance placement: 0.02
2.95 without solder balls
Functional Description
complete Bluetooth module that been specified designed according Bluetooth System v1.1. implementation based highperformance integrated radio transceiver (PBA 01/3), baseband controller, flash memory surrounding secondary components. five major operational blocks. Figure illustrates interaction various blocks. functionality each block follows: Radio functionality achieved using Bluetooth Radio, 01/3. baseband controller ARM7-Thumb based chip that controls operation radio transceiver interface methods; UART. Additionally, baseband controller Voice interface interface. Flash memory used together with baseband controller. Please, refer also Firmware section. power management block regulates filters supply voltage. internal clock frequency generated from crystal oscillator. Bluetooth Module stack Host Controller Interface (HCI) handles communication transport layer through UART interface with host. Baseband radio provides secure reliable radio link higher layers. following sections describe Bluetooth module stack more detail, also figure implemented accordance with complies with Specification Bluetooth System v1.1. Bluetooth Radio Interface Bluetooth module class device with maximum output power with power control needed. Nominal range module with typical antenna range dBm). compliant with ETSI regulations band. Baseband Bluetooth uses ad-hoc structure with maximum eight active units single piconet. default first unit setting connection master link. (See Application Note 1/1522-ROK Uen.) master transmits even timeslots slave transmits timeslots. full duplex transmission, Time-Division Duplex (TDD) scheme
I2C_DATA I2C_CLK DETACH WAKE_UP DPCM_IN PCM_OUT PCM_SYNC PCM_CLK
Baseband
VCC_IO
UART Voltage Regulation
ADDR DATA CTRL FLASH Memory
Baseband Radio
01/3
13MHz Crystal
RESET#
Figure Simplified Block Diagram.
Figure HW/FW parts included Ericsson Buetooth module.
used. Packets sent over timeslots with nominal length packet extended maximum timeslots (DM5 packets) then sent using same channel entire packet. types connections provided, Asynchronous Connectionless Link (ACL) data Synchronous Connection Oriented Link (SCO) voice. Three kb/s voice channels supported simultaneously. Furthermore, there also packets used link control purposes. variety different packet types with error correction schemes data rates used over interface, table Also asymmetric communication available high-speed communication direction. Baseband provides link setup control routines layers above. Furthermore, Baseband also provides Bluetooth security like encryption, authentication management. Please refer Specification Bluetooth System v1.1 part in-depth information regarding Baseband. Firmware (FW) module includes firmware host controller interface, HCI, link manager, resides Flash available object code format. module supports Device Firmware Upgrade (DFU) over UART USB. Application Note, 3/1522-ROK Uen, describing flash procedure available. Link Manager (LM) Link Manager each Bluetooth module communicate with another Link Manager using Link Manager Protocol (LMP) which peer peer protocol, figure messages have highest priority used link-setup, security, control power saving modes. receiving Link Manager filters message does need acknowledge message transmitting reliable link provided Baseband radio. communication take place without actions taken host. Discovery features other Bluetooth enabled devices nearby found saved later host. Please refer Specification Bluetooth System v1.1 part in-depth information regarding LMP. Host Control Interface (HCI) provides uniform command Baseband Link Manager also status registers. accessed through UART USB. There three different types packets: command packets from host Bluetooth module HCI. event packets from Bluetooth module host. data packets going both ways. necessary make different commands events application. application aimed pre-specified profile, capabilities such profile necessary adjust Specification Bluetooth System v1.1 Profiles Application Note 5/1522-ROK Uen. With UART Transport Layer HCI, module will communicate with host through UART I/F. also available communicating voice. With Transport Layer HCI, module will communicate with host through USB. Detach Wake_up signals also available notebook implementations. Please refer Specification Bluetooth System v1.1 part in-depth information regarding different transport layers.
Type NULL POLL
User Payload (bytes)
Symmetric Max. rate
Asymmetric Max.rate
Link control packets
Type Aux1
Payload Header (bytes)
User Payload (bytes) 0-17 0-27 0-121 0-183 0-224 0-339 0-29
Symmetric Max. rate (kb/s) 108.8 172.8 258.1 390.4 286.7 433.9 185.6
Asymmetric rate (kb/s) Forward 108.8 172.8 387.2 585.6 477.8 723.2 185.6 Reverse 108.8 172.8 54.4 86.4 36.3 57.6 185.6
packets
Symmetric Max. rate (kb/s) 64.0 64.0 64.0 64.0+57.6
Type
Payload header (bytes)
User Payload (bytes) 10+(0-9)
packets
Physical layer
Table Link Control Packets Table, Packets Table, packets.
Figure Link manager.
Module Interfaces
UART Interface UART implemented module industry standard 16C450 supports following baud rates: 300, 600, 900, 1200, 1800, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400 460800 bits/s. table regarding data rates different packet types. byte FIFOs associated with UART. Four signals will provided UART interface. used data flow used flow control. Please refer Specification Bluetooth System v1.1 part regarding UART transport layers. Interface module full-speed class device Mbps) that full functionality slave compliant specification VCC_IO 3.11 Data transfer occurs bi-directional ports, Additionally, there side band signals notebook application. side band signals, Wake_up Detach, used control state from which notebook resumes. When host power down mode, Wake_up wakes host when Bluetooth system receives incoming connection. host indicates that Suspend mode using Detach signal. Application Note 2/1522ROK Uen. Voice Interface standard interface sample rate (PCM_SYNC). clock variable between MHz. data linear (13-16 bit), µ-Law bit) A-Law bit). either master slave providing receiving PCM_SYNC, figure Redirection PCM_OUT PCM_IN accomplished well. Over encoding programmable CVSD, A-Law µ-Law. Preferably robust CVSD encoding should used. Interface master available module. This used control external devices. control pins performed Ericsson specific commands available implementation. Application Note 4/1522-ROK Uen. Antenna should connected antenna interface, thereby supporting best signal strength performance, VSWR should higher than 2:1. Ericsson Microelectronics recommend application specific antennas.
PCM_CLK tPSS
PCM_SYNC
tPSH tDSL
tDSH
PCM_X
tPDLP
MSB-1
MSB-2
MSB-3
PCM_X
MSB-1
MSB-2
Figure timing.
Design Guidelines
Power-up Sequence There need power sequence VCC, VCC_IO tied together. power sequence, used, shall applied accordingly: Connection supply rails, then VCC; then signal should applied order initiate internal regulators; finally VCC_IO supply rail activated, figure table timing information. power-down sequence similar power-up procedure reverse format. Therefore, disconnection signals shall follows: VCC_IO, finally GND. RESET# assignment RESET# input generate reset signal module. During power-up reset signal automatically that power supply glitches avoided. Therefore reset should required after power-up. When implementing external RESET#, signal should from open drain output. Power There three inputs Voltage Management section (VCC, VCC_IO, ON). supply voltage that typically separate power supply rail (VCC_IO) provided ports, UART, USB. VCC_IO either connected dedicated supply rail, which same logical interface host. signal controlling internal regulators off. Antenna very important keep antenna output routing (VSWR 2:1) antenna order maintain radio performance listed this data sheet thereby ETSI approvals. routing underneath module, modules ground plane should considered. Shielding Requirements module shielding approved according standards ETSI. approval number visible outside when module utilized final product, exterior label must state that there transmitter module inside product. Ground Ground should distributed with very impedance ground plane. Connect pins ground plane.
Assembly Guidelines
Solder Paste module made surface mounting connection pads have been formed after printing eutectic Tin/Lead solder paste. assembly module, flux must applied target surface. This either done fluxing area (this only preferable fluxing part assembly process) just printing solder paste pads (flux included paste). preferred solder paste height 127µm mil). Soldering Profile
td_on td_off
tr_on td_VCC_IO_o VCC_IO
tf_on td_VCC_IO_o
must noted that module should allowed hanging upside down reflow operation. This means that module assembled side that soldered last. reflow process should regular surface mount soldering profile (full convection strongly preferred); ramp-up should higher than °C/s with peak temperature 210-225 during 10-20 seconds. sloping rate should higher than °C/s (see example reflow profile figure 11).
Temperature profile
Figure Power sequence.
Parameter
r_on f_on d_on d_off dvcc_io_on dvcc_io_off d_on d_off
Unit
Temperature (°C)
10-20s
rising 3°C/s
sloping 4°C/s
60-125
Time
Table Power parameters.
Figure Eutectic SnPb-solder profile.
Size recommended that pads should have diameter 0.7-0.9 surface finish pads should Nickel/Gold flat Tin/Lead surface (Organic Surface Protection). Placement placement machine should able recognize combinations (all ball recognition preferred) able pick component asymmetrically. module contains flat pick-area diameter minimum. centre gravity module situated `left' from centre module towards large Bluetooth radio. thus recommended change offset assembly unit such that nozzle picks module just `left' from gap. Experience shows that this will result proper assembly. weight module typically Storage Keep component pack when using reel. After removal from pack ensure that modules soldered onto within hours. Module marking Each module marked shield with following information:
Ericsson logotype Product with index Revision state Manufacturing unit code Production year week Serial number Bluetooth trademark product code manual approval marking
Reel marking reel, reel pack label with following information:
Ericsson product number with revision Customer product number with revision Quantity Reel-ID. (Batch Factory code Manufacturing date Country origin Ericsson logotype
above also printed BAR-code format Ordering Information Package Part 007/2 Packaging modules will delivered tape reel pack, protecting them from mechanical shock. tape width pitch diameter reel inches contains modules. Abbreviations
ASIC CMOS UART Application Specific Integrated Circuit Error Rate Complementary Metal Oxide Semiconductor Data Circuit terminating Equipment Host Controller Interface Industrial Scientific Medical Printed Circuit Board Pulse Code Modulation Receive Special Interest Group Screen Solder Print Transmit Universal Asynchronous Receiver Transmitter Universal Serial
Information given this data sheet believed accurate reliable. responsibility assumed consequences infringement patents other rights third parties which result from use. license granted implication otherwise under patent patent rights Ericsson Microelectronics. These products sold only according Ericsson Microelectronics' general conditions sale, unless otherwise confirmed writing. Specifications subject change without notice.
Ericsson Microelectronics
SE-164 Kista, Sweden local sales contacts, please refer website call: Fax:
Preliminary Data Sheet
EN/LZT Ericsson Microelectronics December 2001

BluetoothMulti Chip Module Pre-qualified Bluetooth Module Multi P

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