2.5V 5.5V Micropower CMOS Amps Power 25µA, Offset Voltage: 250µV,

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2.5V 5.5V Micropower CMOS Amps Power 25µA, Offset Voltage: 250µV,

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MCP606/607/608/609
2.5V 5.5V Micropower CMOS Amps
Power 25µA, Offset Voltage: 250µV, Rail-to-Rail Swing Output 80pA, Input Bias Current over Temperature Specifications rated 2.5V 5.5V Supplies Unity Gain Stable Chip Select Capability with MCP608 Industrial Temperature range supported Phase Reversal Available Single, Dual, Quad
DESCRIPTION
MCP606, MCP607, MCP608 MCP609 from Microchip Technology, Inc. unity gain stable, offset voltage operational amplifiers capable precision power single supply operation. Performance characteristics include ultra offset voltage (250µV, max), rail-to-rail output swing capability, input bias current (80pA@85C). These features make this family amplifiers well suited single supply precision, high impedance, battery powered applications. single MCP606 available standard 8-lead PDIP, SOIC, TSSOP packages. Another version single amp, MCP608 offered with Chip Select option standard 8-lead PDIP, SOIC, TSSOP packages. dual MCP607 offered standard 8-lead PDIP, SOIC, well TSSOP package. Finally, quad MCP609 offered 14-lead PDIP, SOIC TSSOP packages. devices fully specified from with power supplies from 2.5V 5.5V.
APPLICATIONS
Battery Power Instruments High Impedance Applications Photodiode Pre-amps probe Buffer Amplifier Infrared Detectors Precision Integrators Charge Amplifier Piezoelectric Transducers Strain Gauges Medical Instruments Test Equipment
PACKAGES
MCP606 PDIP, SOIC,TSSOP
MCP607 PDIP, SOIC,TSSOP
OUTA +INA
-INB +INB
AVAILABLE TOOLS
Spice Macromodels www.microchip.com) FilterLabSoftware www.microchip.com)
2000 Microchip Technology Inc.
MCP608 PDIP, SOIC,TSSOP
MCP609 PDIP, SOIC,TSSOP
OUTA -INA +INA +INB -INB OUT1
OUTD -IND +IND +INC -INC OUTC
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ELECTRICAL CHARACTERISTICS
Maximum Ratings*
operational listings this specification implied. Exposure maximum rating conditions extended periods affect device reliability.
.7.0V inputs outputs w.r.t. -0.3V +0.3V Difference Input voltage |VDD VSS| Output Short Circuit Current .continuous Current Input +/-2mA Current Output Supply Pins +/-30mA Storage temperature .-65°C +150°C Ambient temp. with power applied .-55°C +125°C Soldering temperature leads seconds) +300°C protection pins *Notice: Stresses above those listed under "Maximum Ratings" cause permanent damage device. This stress rating only functional operation device those other conditions above those indicated
FUNCTION TABLE
NAME +IN/+INA/+INB/+INC/+IND -IN/-INA/-INB/-INC/-IND FUNCTION Non-inverting Input Terminals Inverting Input Terminals Positive Power Supply Negative Power Supply Chip Select internal connection
OUT/OUTA/OUTB/OUTC/OUTD Output Terminals
CHARACTERISTICS
Unless otherwise specified, limits specified +2.5V +5.5V, GND, VDD/2, 100k VDD/2, VOUT VDD/2 PARAMETERS INPUT OFFSET Input Offset Voltage Drift with Temperature, Power Supply Rejection INPUT BIAS CURRENT IMPEDANCE Input Bias Current Over Temperature Input Offset Bias Current Common Mode Input Impedance Differential Input Impedance COMMON MODE Common-Mode Input Range Common-Mode Rejection Ratio OPEN LOOP GAIN Open Loop Gain GND, 50mV VOUT (VDD 50mV) GND, 100mV VOUT (VDD 100mV) VDD/2 VDD/2 VDD/2, 105dB VDD/2, 100dB VOUT 2.5V, CMRR VSS-0.3 VDD-1.1 CMRR 75dB -0.3 3.9V ZDIFF 1013||6 1013||6 ||pF ||pF -40°C to+85° dVOS/dT PSRR -250 ±1.8 +250 µV/°C -40°C to+85°C 2.5V 5.5V SYMBOL MIN. TYP. MAX. UNITS CONDITIONS
Open Loop Gain
OUTPUT Level/High Level Output Voltage Swing Linear Region Maximum Output Voltage Swing VOL, VOL, VOUT VOUT Output Short Circuit Current POWER SUPPLY Supply Voltage Quiescent Current 18.7 0.015 0.045 0.050 0.100 0.020 0.060 0.050 0.100
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MCP606/607/608/609
CHARACTERISTICS
Unless otherwise specified, limits specified +2.5V +5.5V, GND, VDD/2, 100k VDD/2, VOUT VDD/2 PARAMETERS Gain Bandwidth Product Phase Margin Unity Crossing Slew Rate Input Voltage Noise Noise Density Input Current Noise Density SYMBOL GBWP MIN. TYP. 0.08 MAX. UNITS V/µs µVp-p nV/Hz fA/Hz CONDITIONS 0.1Hz 10Hz 1kHz 1kHz
degrees
SPECIFICATIONS MCP608 CHIP SELECT FEATURE
Unless otherwise specified, limits specified +2.5V +5.5V, GND, VDD/2, 100k, VOUT VDD/2 PARAMETERS SPECIFICATIONS Logic Threshold, Input Current, HIGH SPECIFICATIONS Logic Threshold, High Input Current, High Input High, Current Amplifier Output Leakage, High DYNAMIC SPECIFICATIONS Amplifier Output High Turn-on Time 0.2VDD, VOUT *VDD/2, +1V/V high 0.8VDD, VOUT *VDD/2, +1V/V ICSH 0.01 0.05 entire range 0.8VDD ICSL -0.1 0.01 entire range 0.2VDD SYMBOL MIN. TYP. MAX. UNITS CONDITIONS
tOFF High Amplifier Output High Hysteresis
TEMPERATURE SPECIFICATIONS
Unless otherwise specified, limits specified +2.5V +5.5V, PARAMETERS TEMPERATURE RANGES Specified Temperature Range Operating Temperature Range Storage Temperature Range THERMAL PACKAGE RESISTANCE Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC Thermal Resistance, 8L-TSSOP Thermal Resistance, 14L-PDIP Thermal Resistance, 14L-SOIC Thermal Resistance, 14L-TSSOP °C/W °C/W °C/W °C/W °C/W °C/W +150 SYMBOL MIN. TYP. MAX. UNITS CONDITIONS
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TYPICAL PERFORMANCE CURVES Note: Unless otherwise indicated, 25°C, VOUT VDD/2,
FIGURE 2-1:
Offset Voltage Number Occurrences with 5.5V
FIGURE 2-4:
Offset Voltage Drift Number Occurrences with 5.5V
FIGURE 2-2:
Offset Voltage Number Occurrences with 2.5V
FIGURE 2-5:
Offset Voltage Drift Number Occurrences with 2.5V
FIGURE 2-3:
Quiescent Current Power Supply Voltage Temperature
FIGURE 2-6:
Quiescent Current Temperature
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Note: Unless otherwise indicated, 25°C, VOUT VDD/2,
FIGURE 2-7:
Normalized Offset Voltage Temperature
FIGURE 2-10: Input Offset Voltage Common Mode Voltage
FIGURE 2-8:
Open Loop Gain, Phase Margin Frequency
FIGURE 2-11: Phase Margin, Gain Bandwidth Product Temperature
FIGURE 2-9:
Phase Margin, Gain Bandwidth, Load Resistance
FIGURE 2-12: Input Voltage Noise Density Frequency
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Note: Unless otherwise indicated, 25°C, VOUT VDD/2,
FIGURE 2-13: Input Bias Current, Input Offset Current Temperature
FIGURE 2-16: Input Bias Current, Input Offset Current Common mode Input Voltage
FIGURE 2-14: Open Loop Gain Output Load Resistance
FIGURE 2-17: Open Loop Gain Power Supply Voltage
FIGURE 2-15: Common-Mode Rejection Ratio, Power Supply Rejection Ratio Frequency
FIGURE 2-18: Common-Mode Rejection Ratio, Power Supply Rejection Ratio Temperature
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Note: Unless otherwise indicated, 25°C, VOUT VDD/2,
FIGURE 2-19: Level High Level Output Swing Load Resistance
FIGURE 2-22: Level High Level output Swing Temperature, RL=5k
FIGURE 2-20: Maximum Full Scale Output Voltage Swing Frequency
FIGURE 2-23: Level High level Output Swing Temperature, RL=25k
FIGURE 2-21: Slew Rate Temperature
FIGURE 2-24: Output Short Circuit Current Temperature
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Note: Unless otherwise indicated, 25°C, VOUT VDD/2,
FIGURE 2-25: Large Signal Non-inverting Signal Pulse Response
FIGURE 2-28: Large Signal Inverting Signal Pulse Response
FIGURE 2-26: Small Signal Non-inverting Pulse Response
FIGURE 2-29: Small Signal Inverting Signal Pulse Response
FIGURE 2-27: Channel Channel Separation (MCP607 MCP609 only)
FIGURE 2-30: Chip Select Amplifier Output Response Time (MCP608 only)
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MCP606/607/608/609
Note: Unless otherwise indicated, 25°C, VOUT VDD/2,
FIGURE 2-31: hysteresis (MCP608 only)
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APPLICATIONS INFORMATION
MCP606/607/608/609 family operational amplifiers fabricated Microchip's state-of-the-art CMOS process. They unity gain stable suitable wide range general purpose applications. With this family operational amplifiers, power supply should by-passed with 0.1µF capacitor. Linear Region Maximum Output Voltage Swing MCP606/607/608/609 family specified within 50mV from positive negative rail with load 100mV from rails with load. overriding condition that defines linear region amplifier open loop gain that specified over that region. voltage output region between 50mV 50mV, open loop gain specified 105dB (min) with load. classical definition open loop gain amplifier log10 (VOUT VOS) where: open loop gain amplifier, VOUT equal (VDD 50mV) (VSS+ 50mV) 25k, change offset voltage with changing output voltage amplifier.
Rail-to-Rail Output Swing
There specifications that describe output swing capability MCP606/607/608/609 family operational amplifiers. first specification, Level High Level Output Voltage Swing, defines absolute maximum swing that achieved under specified loaded conditions. instance, Level Output Voltage Swing MCP606/607/ 608/609 family specified able swing least 15mV from negative rail with load VDD/ This output swing performance shown Figure 3-1, where output MCP606 configured gain +2V/V overdriven with 4kHz triangle wave. this figure, degradation output swing linearity clearly illustrated. This degradation occurs after point which open loop gain amplifier specified before amplifier reaches maximum minimum output swing.
Input Voltage Phase Reversal
Since MCP606/607/608/609 amplifier family designed with CMOS devices, does exhibit phase inversion when input pins exceed negative supply voltage. Figure shows input voltage exceeding both supplies with resulting phase inversion.
Input Voltage
Time (uS)
Output Voltage (0.1V/div)
FIGURE 3-1: Swing
Level High Level Output
second specification that describes output swing capability these amplifiers Linear Region Maximum Output Voltage Swing. This specification defines maximum output swing that achieved while amplifier still operating linear region.
FIGURE 3-2: MCP606/607/608/609 family amps have phase reversal issues. this graph, amplifier gain +2V/V.
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maximum operating common-mode voltage that applied inputs 0.3V 1.1V. contrast, absolute maximum input voltage 0.3V 0.3V. Voltages input that exceed this absolute maximum rating cause excessive current flow input pins. Current beyond ±2mA cause possible reliability problems. Applications that exceed this rating must externally limited with input resistor shown Figure 3-3.
Gain Bandwidth
Gain-Bandwidth (kHz) Phase Margin
RL=100K
Phase Margin(°) Load Capacitance(pF)
1000
FIGURE 3-4: Gain Bandwidth, Phase Margin Capacitive Load MCP60X RISO (Maximum expected voltage VDD) (VSS Minimum expected voltage)/ 2mA. FIGURE 3-3: inputs amplifier exceed Absolute Maximum Specifications, input resistor, should used limit current flow into that pin. FIGURE 3-5: Amplifier circuits that used when driving heavy capacitive loads. amplifier required drive larger capacitive loads, circuit shown Figure used. small series resistor (RISO) output amplifier improves phase margin when driving large capacitive loads. This resistor decouples capacitive load from amplifier introducing zero transfer function. This zero adjusts phase margin approximately: tan-1 GBWP RISO where: improvement phase margin, GBWP gain bandwidth product amplifier, RISO capacitive decoupling resistor, load capacitance MCP60X
VOUT
Capacitive Load Stability
Driving capacitive loads cause stability problems with many higher speed amplifiers. closed loop amplifier circuit, good rule thumb design phase margin that less than 45°. This conservative theoretical value, however, phase margin lower, layout parasitics degrade phase margin further causing truly unstable circuit. system phase shift will have overshoot step response approximately 25%. buffer configuration with capacitive load most difficult configuration amplifier maintain stability. Phase versus Capacitive Load MCP60X amplifier shown Figure 3-4. this figure, seen that amplifier phase margin above 40°, while driving capacitance loads 220pF.
2000 Microchip Technology Inc.
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Output Hi-Z 18.7µA (typ) Supply Current FIGURE 3-6: (typ) 18.7µA (typ) (typ) tOFF Hi-Z
Timing Diagram Function MCP608 Amplifier
Chip Select Option MCP608
MCP608 single amplifier with Chip Select option. When pulled high supply current drops (typ). this state, amplifier into high impedance state. pulling low, amplifier enabled. left floating, amplifier will operate properly. Figure shows output voltage supply current response pulse.
Layout Considerations
Guard Ring FIGURE 3-7: Example Guard Ring MCP606, A-amplifier MCP607 MCP608 Board Layout Circuit examples ring implementations shown Figure 3-8. Figure 3-8A, guard ring biased common-mode voltage amplifier. This type guard ring most effective applications where common-mode voltage input stage changes, such buffers, non-inverting gain amplifiers instrumentation amplifiers. strategy shown Figure 3-8D, biases common-mode voltage guard ring ground. This type guard ring typically used precision photo sensing circuits.
applications where input bias current critical, board surface leakage effects signal coupling from trace trace need taken into consideration. 3.5.1 SURFACE LEAKAGE
Surface leakage across board consequence differing voltages between traces combined with high humidity, dust contamination board. instance, typical resistance from board trace approximately 1012 under humidity conditions. adjacent trace biased input amplifier biased near zero volts, leakage current will appear amplifier's input node. This type leakage five times room temperature input bias current (1pA, typ) MCP606/607/608/609 family amplifiers. simplest technique that used reduce effects board leakage design ring around sensitive pins traces. example this type layout shown Figure 3-7.
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3.5.2 Figure 3-8A input pins MCP606/607/608/609 amplifiers have high impedance providing opportunity noise injection, layout issues considered. These high impedance input terminals sensitive injected currents. This occur trace from high impedance input next trace that fast changing voltages, such digital clock signal. When high impedance trace close proximity trace with these types voltage changes, charge capacitively coupled into high impedance trace.
Trace
SIGNAL COUPLING
MCP60X
Figure 3-8B
MCP60X
Figure 3-8C
(typ 0.003mm) thickness trace Cross-Section
length trace distance between traces
MCP60X
Voltage Reference (could ground)
FIGURE 3-9: Capacitors built with traces allowing coupling signals from trace another. shown Figure 3-9, value capacitance between traces primarily dependent distance between traces distance that traces parallel (L). From this model, amount current generated into high impedance trace equal where: equals current that appears high impedance trace,
Figure 3-8D
MCP60X
FIGURE 3-8: Examples design Board traces minimize leakage paths high impedance input pins MCP606/607/608/609 amplifiers.
equals value capacitance between traces, equals change voltage trace that switching, equals amount time that voltage change took from level next.
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3.6.1
Typical Applications
SIDE BATTERY CURRENT SENSING speed sensing. This done reverse biasing photodetector, which reduces parasitic capacitance diode. specifications that influence accuracy these circuits offset voltage, input bias current, high input impedance input common mode range below ground. input offset voltage input bias current provide environment where there minimal voltage placed across photodetector, consequently linearity photodetector compromised. Given that MCP606/607/608/ amplifiers specified ±250µV(max) offset voltage input bias currents pico ampere region they ideal these circuits. Additionally, these circuits will only work common-mode range amplifier includes zero, which case with MCP606/607/608/609 amplifiers.
MCP606/607/608/609 amplifiers used sense output current side battery using circuit Figure 3-10. this circuit, current from power supply (minus current required power MCP606) flows through resistor from rest circuit system. This current converted voltage through sense resistor gained resistors around amplifier. Since input bias current offset voltage MCP606 low, there very little error generated amplifier. Additionally, amplifier capable swinging below ground quiescent current very low. These four specifications make this amplifier appropriate this type circuit.
LOAD SENSE
MCP606
Light
VOUT
+2.5 5.5V
MCP606 load
VBIAS
MCP606
Light
VOUT
FIGURE 3-10: Side Battery Current Sensing 3.6.2 PREAMPLIFIER PHOTO DETECTION CIRCUIT VOUT *Bypass Capacitor,
amplifier from this family operational amplifiers used convert output current signal from sensor into voltage. sensor that fits this description photodetector shown Figure 3-11. This type circuit implemented with single resistor optional capacitor feedback loop amplifier. light impinges photo diode, charge generated, causing current flow reverse bias direction photodetector. circuits shown Figure 3-11. circuit designed provide precision sensing from photodetector. this circuit voltage across detector nearly zero equal offset voltage amplifier. With this configuration, current that appears across resistor, primarily result light excitation photodetector. photosensing circuit bottom Figure 3-11 designed higher
FIGURE 3-11: Pre-Amplifier Photo Detection Circuit
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3.6.3 OP-AMP INSTRUMENTATION AMPLIFIER
VREF
op-amp instrumentation amplifier shown Figure 3-12 serves function taking difference input voltages, level shifting then providing single output. This configuration best suited higher gains. (gain V/V) shown Figure 3-12. specifications that make MCP606/607/ 608/609 family appropriate this application circuit input bias current, offset voltage high common-mode rejection. reference voltage this circuit supplied first signal chain. Typically, this voltage half supply voltage single supply environment.
VREF
MCP607
VOUT
MCP607
MCP607
VOUT *Bypass Capacitor,
FIGURE 3-13: Three Op-Amp Instrumentation Amplifier
3.6.5 PRECISION GAIN WITH GOOD LOAD ISOLATION
MCP607
MCP607
VOUT
VOUT *Bypass Capacitor, 0.1µF
FIGURE 3-12: Op-Amp Instrumentation Amplifier
3.6.4 THREE OP-AMP INSTRUMENTATION AMPLIFIER
Figure 3-14, input offset voltage MCP606 used implement circuit with high gain. This precision measurement easily disrupted changing output current drive device that doing amplification work. Consequently precision amplifier configuration followed MCP601 amplifier which capable driving higher currents. Since amplifiers housed separate packages, there minimal change offset voltage MCP606 loading effects.
MCP606
classic, three instrumentation amplifier illustrated Figure 3-15. input operational amplifiers this circuit provide signal gain. output operational amplifier converts signal from inputs single ended output with difference amplifier. gain this circuit simply adjusted with resistor, reference voltage difference stage this instrumentation amplifier capable spanning wide range. Most typically this node referenced half supply voltage signal supply application.
VOUT
MCP601
Buffer Precision Amplifier *Bypass Capacitor,
FIGURE 3-14: Precision Gain with Good Load Isolation
2000 Microchip Technology Inc.
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MCP606/607/608/609
SPICE MACROMODEL
Spice macromodel MCP606, MCP607, MCP608 MCP609 simulates typical amplifier performance offset voltage, power supply rejection, input capacitance, common mode rejection ratio, open loop gain over frequency, phase margin with capacitive load, output swing, power supply current, power supply current change with supply voltage, input common mode range input voltage noise. characteristics MCP606, MCP607, MCP608, MCP609 amplifiers similar terms performance behavior. This single macromodel supports four devices with exception chip select function MCP608, which modeled. listing this macromodel shown next page. most recent revision model downloaded from Microchip's site www.microchip.com.
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Software License Agreement
software supplied herewith Microchip Technology Incorporated (the "Company") PICmicro® Microcontroller intended supplied you, Company's customer, solely exclusively Microchip PICmicro Microcontroller products. software owned Company and/or supplier, protected under applicable copyright laws. rights reserved. violation foregoing restrictions subject user criminal sanctions under applicable laws, well civil liability breach terms conditions this license. THIS SOFTWARE PROVIDED CONDITION. WARRANTIES, WHETHER EXPRESS, IMPLIED STATUTORY, INCLUDING, LIMITED IMPLIED WARRANTIES MERCHANTABILITY FITNESS PARTICULAR PURPOSE APPLY THIS SOFTWARE. COMPANY SHALL NOT, CIRCUMSTANCES, LIABLE SPECIAL, INCIDENTAL CONSEQUENTIAL DAMAGES, REASON WHATSOEVER. .subckt mcp606 Output Negative supply Positive Supply Inverting input Non-inverting input Macromodel MCP606 (single), MCP607 (dual), MCP608 (single w/CS), MCP609 (quad) characteristics MCP606, MCP607, MCP608, MCP609 have same fundamental performance behavior. Consequently, this single macromodel supports four devices. However, chip select function MCP608 modeled. Revision History: 6-30-99 created This macromodel models typical amplifier offset voltage, power supply rejection, input capacitance, open loop gain over frequency, phase margin with 60pF load, output swing, power supply current, input voltage noise, slew rate. NOTICE: INFORMATION PROVIDED HEREIN BELIEVED RELIABLE, HOWEVER, MICROCHIP ASSUMES RESPONSIBILITY INACCURACIES OMISSIONS. MICROCHIP ASSUMES RESPONSIBILITY THIS INFORMATION, SUCH INFORMATION SHALL ENTIRELY USER'S RISK. INTELLECTURAL PROPERTY RIGHTS LICENSES TECNOLOGY DESCRIBED HEREIN IMPLIED GRANTED THIRD PARTY. MICROCHIP RESERVES RIGHT CHANGE THIS MODEL TIME WITHOUT NOTICE. *Input Stage, pole 300kHz Ptype Ptype CDIFF 3E-12 CCM1 6E-12 CCM2 6E-12 13.33e-6 1.839e3 1.839e3 125e-12 ICOMP -194.63e-6 *Input Stage Common-Mode Clampling VCMM 0.35 DCMP VCMP
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GCMP2 POLY(2) -0.5E-3 0.5E-3
*Input errors (vos, psr) poly(2) (67,4) -229.9e-6 23e-6
*Second VSOM VSOP DSOM DSOP *HCM
Stage, pole 0.183Hz 8.2144e9 110e-12 4.784 -3.98 VCMP
543.78e-6
POLY(11) VO10 VMID1 VSOP VSOM 200E-6 *mid-supply reference RMID1 VMID1 RMID2 ELEVEL *output RO10 VO10 input stage
61.62E3 61.62E3
0.03 10E-3 10E-3 10E-3
10E-3
voltage noise
10E3
.model Ptype PMOS W=105 .model (IS=1e-15 =50) .model (IS=1e-18 AF=0.6 KF=10e-17) .ENDS
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PACKAGING INFORMATION
Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW Example MCP606 XXXXXNNN 0025
8-Lead SOIC (208 mil) XXXXXXX XXXYYWW
Example MCP606 XXX0025
8-Lead TSSOP XXXX YYWW
Example XXXX 0025
Legend: XX.X Note:
Customer specific information* Year code (last digits calendar year) Week code (week January week `01') Alphanumeric traceability code
event full Microchip part number cannot marked line, will carried over next line thus limiting number available characters customer specific information.
Standard marking consists Microchip part number, year code, week code, facility code, mask rev#, assembly code. marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. devices, special marking adders included price.
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Package Marking Information (Continued) 14-Lead PDIP (300 mil) XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN Example MCP606 XXXXXXXXXXXXXX 0025NNN
14-Lead SOIC (208 mil) XXXXXXXXXX YYWWNNN
Example MCP606 0025NNN
14-Lead TSSOP XXXXXX YYWW
Example XXXXXX YYWW
Legend: XX.X Note:
Customer specific information* Year code (last digits calendar year) Week code (week January week `01') Alphanumeric traceability code
event full Microchip part number cannot marked line, will carried over next line thus limiting number available characters customer specific information.
Standard marking consists Microchip part number, year code, week code, facility code, mask rev#, assembly code. marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. devices, special marking adders included price.
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2000 Microchip Technology Inc.
MCP606/607/608/609
8-Lead Plastic Dual In-line (PDIP)
Number Pins Pitch Seating Plane Molded Package Thickness Base Seating Plane Shoulder Shoulder Width Molded Package Width Overall Length Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Spacing Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
INCHES* .100 .155 .130 .313 .250 .373 .130 .012 .058 .018 .370
.140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310
.170 .145 .325 .260 .385 .135 .015 .070 .022 .430
MILLIMETERS 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40
4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-001 Drawing C04-018
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8-Lead Plastic Small Outline (SN) Narrow, (SOIC)
Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
.053 .052 .004 .228 .146 .189 .010 .019 .008 .013
INCHES* .050 .061 .056 .007 .237 .154 .193 .015 .025 .009 .017
.069 .061 .010 .244 .157 .197 .020 .030 .010 .020
MILLIMETERS 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0.20 0.23 0.33 0.42
1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 0.25 0.51
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-012 Drawing C04-057
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8-Lead Plastic Thin Shrink Small Outline (ST) (TSSOP)
Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
INCHES .026
.033 .002 .246 .169 .114 .020 .004 .007
.035 .004 .251 .173 .118 .024 .006 .010
.043 .037 .006 .256 .177 .122 .028 .008 .012
MILLIMETERS* 0.65 1.10 0.85 0.90 0.95 0.05 0.10 0.15 6.25 6.38 6.50 4.30 4.40 4.50 2.90 3.00 3.10 0.50 0.60 0.70 0.09 0.15 0.20 0.19 0.25 0.30
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .005" (0.127mm) side. JEDEC Equivalent: MO-153 Drawing C04-086
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14-Lead Plastic Dual In-line (PDIP)
Number Pins Pitch Seating Plane .140 .170 Molded Package Thickness .115 .145 Base Seating Plane .015 Shoulder Shoulder Width .300 .313 .325 Molded Package Width .240 .250 .260 Overall Length .740 .750 .760 Seating Plane .125 .130 .135 Lead Thickness .008 .012 .015 Upper Lead Width .045 .058 .070 Lower Lead Width .014 .018 .022 Overall Spacing .310 .370 .430 Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-001 Drawing C04-005
Units Dimension Limits
INCHES* .100 .155 .130
MILLIMETERS 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 18.80 19.05 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40
4.32 3.68 8.26 6.60 19.30 3.43 0.38 1.78 0.56 10.92
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2000 Microchip Technology Inc.
MCP606/607/608/609
14-Lead Plastic Small Outline (SL) Narrow, (SOIC)
Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
.053 .052 .004 .228 .150 .337 .010 .016 .008 .014
INCHES* .050 .061 .056 .007 .236 .154 .342 .015 .033 .009 .017
.069 .061 .010 .244 .157 .347 .020 .050 .010 .020
MILLIMETERS 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 5.99 3.81 3.90 8.56 8.69 0.25 0.38 0.41 0.84 0.20 0.23 0.36 0.42
1.75 1.55 0.25 6.20 3.99 8.81 0.51 1.27 0.25 0.51
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-012 Drawing C04-065
2000 Microchip Technology Inc.
DS11177B-page
MCP606/607/608/609
14-Lead Plastic Thin Shrink Small Outline (ST) (TSSOP)
Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
INCHES .026 .035 .004 .251 .173 .197 .024 .006 .010
.033 .002 .246 .169 .193 .020 .004 .007
.043 .037 .006 .256 .177 .201 .028 .008 .012
MILLIMETERS* 0.65 1.10 0.85 0.90 0.95 0.05 0.10 0.15 6.25 6.38 6.50 4.30 4.40 4.50 4.90 5.00 5.10 0.50 0.60 0.70 0.09 0.15 0.20 0.19 0.25 0.30
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .005" (0.127mm) side. JEDEC Equivalent: MO-153 Drawing C04-087
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2000 Microchip Technology Inc.
MCP606/607/608/609
ON-LINE SUPPORT
Microchip provides on-line support Microchip World Wide (WWW) site. site used Microchip means make files information easily available customers. view site, user must have access Internet browser, such Netscape Microsoft Explorer. Files also available download from site.
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Systems Information Upgrade Line provides system users listing latest versions Microchip's development systems software products. Plus, this line provides information customers receive currently available upgrade kits.The Line Numbers are: 1-800-755-2345 U.S. most Canada, 1-480-786-7302 rest world.
991103
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2000 Microchip Technology Inc.
DS11177B-page
MCP606/607/608/609
READER RESPONSE
intention provide with best documentation possible ensure successful your Microchip product. wish provide your comments organization, clarity, subject matter, ways which documentation better serve you, please your comments Technical Publications Manager (480) 786-7578. Please list following information, this outline provide with your comments about this Data Sheet. Technical Publications Manager Reader Response Total Pages Sent
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DS11177B-page
2000 Microchip Technology Inc.
MCP606/607/608/609
NOTES:
2000 Microchip Technology Inc.
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NOTES:
DS11177B-page
2000 Microchip Technology Inc.
MCP606/607/608/609
MCP606/607/608/609 PRODUCT IDENTIFICATION SYSTEM
order obtain information, e.g., pricing delivery, refer factory listed sales office. Part Number
Plastic (300 Body), 8-lead 14-lead Plastic SOIC (150 Body), 8-lead Plastic SOIC (150 Body), 14-lead Plastic TSSOP, 8-lead 14-lead
Package:
Temperature Range:
-40°C +85°C
Device:
MCP606 MCP606T MCP607 MCP607T MCP608 MCP608T
Single Operational Amplifier Single Operational Amplifier (Tape Reel-SOIC/TSSOP) Dual Operational Amplifier Dual Operational Amplifier (Tape Reel-SOIC/TSSOP) Single Operational Amplifier w/CS Function Single Operational Amplifier w/CS Function (Tape Reel-SOIC/TSSOP) MCP609 Quad Operational Amplifier MCP609T Quad Operational Amplifier (Tape Reel-SOIC/TSSOP)
Sales Support
Data Sheets Products supported preliminary Data Sheet have errata sheet describing minor operational differences recommended workarounds. determine errata sheet exists particular device, please contact following: Your local Microchip sales office Microchip Corporate Literature Center U.S. FAX: (480) 786-7277 Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision silicon Data Sheet (include Literature using. Customer Notification System Register site (www.microchip.com/cn) receive most current information products.
2000 Microchip Technology Inc.
DS11177B-page
WORLDWIDE SALES SERVICE
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AMERICAS (continued)
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ASIA/PACIFIC (continued)
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05/16/00
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Microchip received QS-9000 quality system certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona July 1999. Company's quality system processes procedures QS-9000 compliant PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs microperipheral products. addition, Microchip's quality system design manufacture development systems 9001 certified.
rights reserved. 2000 Microchip Technology Incorporated. Printed USA. 7/00
Printed recycled paper.
Information contained this publication regarding device applications like intended through suggestion only superseded updates. your responsibility ensure that your application meets with your specifications. representation warranty given liability assumed Microchip Technology Incorporated with respect accuracy such information, infringement patents other intellectual property rights arising from such otherwise. Microchip's products critical components life support systems authorized except with express written approval Microchip. licenses conveyed, implicitly otherwise, except maybe explicitly expressed herein, under intellectual property rights. Microchip logo name registered trademarks Microchip Technology Inc. U.S.A. other countries. rights reserved. other trademarks mentioned herein property their respective companies.
DS11177B-page
2000 Microchip Technology Inc.

2.5V 5.5V Micropower CMOS Amps Power 25µA, Offset Voltage: 250µV,

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