Digital Products This document presents flows used manufacturing

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Digital Products This document presents flows used manufacturing

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Quality Flows
Digital Products
This document presents flows used manufacturing screening TEMIC Digital (Microcontrollers, Memories, ASICs ASSPs).
Process Control
shown following tables, each device constructed manufacturing processes which under surveillance TEMIC Quality organization. Control these processes maintained statistical techniques such capability studies SPC. Results computerized accordance with standards, internal specifications, procedures. Audits "self-audits" used extensively continuously improve quality implementing corresponding corrective actions. TEMIC prepares maintains suitable documentation covering phases conception manufacturing. customer verify that suitable documentation exists being applied. Information designated "Proprietary" will made available customer representative only with written permission TEMIC. Process control recognized vital part concept "built-in quality". addition formal inspections, TEMIC implements various monitoring systems such scanning electron microscope (SEM) glassivation layer integrity.
Wafer Fabrication: Quality Control Flow Chart
Process Step Typical Item
Incoming Inspection Silicon Wafers Resistivity, Bow, TTV, Flatness Oxygen Content, Thickness, Particles Defects Conformity
Frequency
Sampling
Monthly Monitoring Each Supplier
Wafers/Lot
Every Mask Reticule Weekly Monitoring Each Supplier Every
Incoming Inspection Masks Reticules
Dimensions Registration Thickness C(V)
Oxidation
Wafers/Run Parts/Wafer
Monitoring Every
Implant Diffusion
Therma-Wave Resistivity) Thickness
Wafers/Lot
Every
Wafers/Run Parts/Wafer
Thickness
Every
Wafers/Run
Parts Wafer Wafers/Run
Etching Si-Nitride Deposition
Critical Dimensions Thickness Delta C(V)
Every
Parts Wafer Wafers/Run Parts Wafer Wafers/Run
Every Every Every Every
Gate-Oxidation
Parts Wafer Wafers/Run Parts Wafer Wafers/Run
Thickness
Polysilicon Deposition Etching
Critical Dimensions Inspection
Parts Wafer
Monitoring
100%
MATRA Rev. Jan.
Quality Flows
Wafer Fabrication: Quality Control Flow Chart
Process Step Typical Item
Resistivity
Frequency
Sampling
Every Week Every Shift Every Every
Wafer
Reflectivity Thickness
Metal Deposition Etching
Wafer/Lot Parts/Wafer Wafers/Lot
Critical Dimensions Inspection Thickness Stress
Parts Wafers
Monitoring /100% Every Every
Glassivation Deposition Etching
Wafer/Run Parts/Wafer Wafer/Run
Inspection
Monitoring/100%
Test Site
Electrical Parameters Functional Test Visual Defects
Every Lot/visual inspenction lots Every
100% Wafers Site/Wafer 100% Wafers 100% Dice Wafers/Lot Wafers/Lot
Wafer-Sort
Visual Inspection Acceptance
Monitoring/100%
results/Gate lots
Note: representatives audit operations time.
Assembly: Quality Control Flow Chart
Various assembly process flows used MIL-STD-883 Class Compliant Hermetic Assembly MIL-STD-883 Class 9000 Space Hermetic Assembly TEMIC/MHS Military Hermetic Assembly Plastic
Assembly Prototype Hermetic Assembly Hermetic Assembly Note: representatives audit operations time.
MATRA Rev. Jan.
Quality Flows
Hermetic Assembly: Quality Control Flow Chart
Frequency Process Process Step
Incoming Inspection First Optical Optical Inspection Inspection Inspection 0.4% Visual Visual Die-Shear Die-Bonding Stud-Pull X-Ray Inspection 0.4% Visual Visual Wire-Bonding Bond-Pull Loop-Height Inspection 0.4% Third Optical Inspection 0.4% Prestab Bake Sealing Stabilization Bake Thermal Cycling Constant Acceleration Trimming/Forming Solder-Dip PIND Test Fine/Gross Leak Marking (back-side) Final Inspection Inspection 0.4% process only. Visual Visual Visual 100% Every Every Visual Visual Dimensional Visual Thickness 100% Every Lot* Visual Visual (die) Visual Visual only) Every Cond. 100% Cond. Every Cond. 100% Every Cond. 100% Cond.
Typical Item
Base/Frame/ Caps/BondingMaterials/Wires Visual Visual
Method
TEMIC/MHS Spec SCC9000 TEMIC/MHS Spec
1MIL-2010 TEMIC/MHS Spec
Every Material Every Lot/100% Wafers 100% Cond. Every Lot* Every Cond. Every Cond. 100% Cond. Monitoring 0.4%
MIL-2018 SCC21400
1MIL-2010 TEMIC/MHS Spec
Same Second Optical Every Cond. 100% Cond. Monitoring 100% 100%
MIL-2010 MIL-2019 MIL-2027 MIL-2012
1MIL-2010
TEMIC/MHS Spec
1MIL-2010/ TEMIC/MHS Spec
4#/40 Wires/Every 5#/Every Every Cond. 100% Cond. Monitoring Cond. Monitoring AQL= 0.4% Monitoring
MIL-2011 TEMIC/MHS Spec
1MIL-2010 TEMIC/MHS Spec 1MIL-2010 TEMIC/MHS Spec 1MIL-2010 TEMIC/MHS Spec
100% Every
TEMIC/MHS Spec MIL-1010 Cond. cycles MIL-2001 Cond. MIL-2009 SCC20500 MIL-2009 LTPD MIL-2020 MIL-1014 TEMIC/MHS Spec LTPD MIL-2009 20500 MIL-2009 20500
Every Every Every 100% Every Monitoring 100% Every 100% Every Every LTPD 0.4%
Monitoring
MATRA Rev. Jan.
Quality Flows
Plastic Assembly: Quality Control Flow Chart
Process Step
Incoming Inspection Optical Inspection Dicing Optical Inspection Bonding
Typical Item
Frame/Resin/Bonding-Materials/ Wires .Thickness, Particles Visual Water Kerf Width Visual Visual Visual Die-Shear Cure Temperature Visual Bond-Pull Ball-Shear Bond Crater Visual X-Ray Step Temperature Time Visual Cure-Temperature Permanency Composition Thickness Solderability Visual Visual Dimensional incl. Coplanarity Visual Coplanarity Open/Shorts
Frequency
Every Material
Sampling
Every Lot/Sampling
TEMIC/MHS Spec 0.65% Lower
TEMIC/MHS Spec 0.65% Lower
Every Lot/Sampling
Wire Bonding
Optical Inspection Molding Marking (top side) Optional
Every Lot/Sampling
TEMIC/MHS Spec 0.65% Lower
Solder Plating Marking (back-side) Trimming/Forming Final Inspection Electrical Test
Every Lot/Sampling Monitoring TEMIC/MHS Spec 0.1% TEMIC/MHS Spec
Note: representatives audit operations time.
MATRA Rev. Jan.
Form: Quality Control Flow Chart
Electrical Conformance Mechanical Conformance Acceptance Sample Assembly Optical Inspection Dicing Sorting Wafer Test Site
MATRA Rev. Jan.
Flow (compliant MIL-Std level
Acceptance Test
Acceptance Sample Assembly
Optical Inspection
Dicing (Die Form) (Sawn Wafer)
Probe
Wafer Test Site
Several screening levels defined leading guarantee performance products over whole temperature range from level 100% level. addition that, level assures keep under control early failure rate level with appropriate screening.
flows except
products available form (sawn unsawn) upon request. They screened either using TEMIC standards SPACE standards (DB, flows).
Process Step
Process Step
Acc. Specification
Bond Pull Shear
Visual
Visual
Static/Dynamic Functional Tests Visual
Control Flow Chart Electrical Characterization
Visual
Visual
level level level
Control Flow Chart Electrical Characterization
Typical Item
Typical Item
LTPD
Parts Wires Parts
Every Lot/Sampling
100% Dice
100% Wafers Wafers
100% Wafers/5
Optional
Optional
Every Lot/Sampling 0.4%
100% Wafers
100% dice probes screening
100% Wafers/5
Frequency
Frequency
Quality Flows
125, -55_C
MIL-2011 MIL-2019
Flow
MIL-2010 Cond. 0.4%
MIL-2010 Cond.
TEMIC/MHS Spec TEMIC/MHS Spec
TEMIC/MHS Spec
Flow
MIL-2010 Cond.
MIL-2010 Cond.
Sampling
Sampling
Quality Flows
Flow (compliant MIL-Std class ESA/PSS01608)
Process Step Typical Item Frequency Sampling
Wafer Test Site Control Flow Chart Electrical Characterization 100% Wafers/5 100% Wafers Wafers 100% Dice Sorting Dicing Static/Dynamic Functional Tests Visual Visual Visual TEMIC/MHS Spec TEMIC/MHS Spec MIL-2010 Cond. MIL-2010 Cond. 0.4% Flow Optical Inspection Acceptance Sample Assembly Every Lot/Sampling Mechanical Conformance Electrical Conformance Bond Pull Shear Parts Wires Parts MIL-2011 MIL-2019 Acc. Specification Acc. level class
Product Flows
TEMIC offers broad range screening flows, such commercial, industrial, automotive, military space. Methods associated with each step covered TEMIC
procedures procedures defined standards (MIL-STD-883) depending flow. following tables describe these flows.
MATRA Rev. Jan.
Shipping Inspection Data Package Certification Compliance Customer Source Inspection Reliability Conformation Mechanical Conformation Electrical Conformation Global External Visual X-Ray Inspection Gross Fine Leaks Electrical Test Dynamic Burn-In Burn-In Test Serialization Marking Assembly Flow Wafer Inspection
MATRA Rev. Jan.
Process Steps
Microcontrollers Memories Memories ASICs
Flows Family
Electrical Gate
Electrical
Drift
Temperature
High Temperature
Room Temperature
Test Date Code
Deliveries
0.065%
Monitoring
Monitoring
Monitoring
Monitoring
CMx---
Commercial 70_C
_xxxxx
L4/L7
100%
100%
with Burn
Test Date Code
Deliveries
100% 24h/140_C Equivalent
0.065%
Monitoring
Monitoring
Monitoring
Monitoring
CMX---D
Qx----
L4/L7
100%
100%
Test Date Code
Deliveries
0.065%
Monitoring
Monitoring
Monitoring
Monitoring
Ix------
Industrial 85_C
IMx---
L4/L7
100%
100%
with Burn
Test Date Code
Deliveries
100% 24h/140_C Equivalent
0.065%
Monitoring
Monitoring
Monitoring
Monitoring
Lx------
IMx---D
L4/L7
100%
100%
Quality Flows
Test Date Code
Deliveries
0.065%
Automotive 125_C
Monitoring
Monitoring
Monitoring
Monitoring
Ax------
AMx---
L4/L7
100%
100%
with Burn
Test Date Code
Deliveries
100% 24h/140_C Equivalent
0.065%
Monitoring
Monitoring
Monitoring
Monitoring
AMx---D
L4/L7
100%
100%
Quality Flows
*Existing products "-MB" flow keep their current name. Product under reference drawing. **Product under detail spec. reference detail spec. Shipping Inspection Data Package Certification Compliance Customer Source Inspection Reliability Conformation Mechanical Conformation Electrical Conformation Global External Visual X-Ray Inspection Gross Fine Leaks Electrical Test Dynamic Burn-In Burn-In Test Serialization Marking Assembly Flow Wafer fab. flow
Process Steps
Microcontrollers Memories Memories ASICs
Flows Family
Military Space
Electrical Gate
Electrical
Drift
Temperature
High Temperature
Room Temperature
TEMIC/MHS Flow
Test Date Code
Deliveries
0.065%
Monitoring
Monitoring
Monitoring
Mx-----
MMx---
Standard
100%
100%
100%
Military 125_C
Room Temp.
Sealing Date Code
Mx-----/883*
MMx---/883*
Deliveries
Deliveries
Deliveries
100% 168h/125_C Equivalent
MIL-883 Compliant
Group
Standard
Group
Group
./883*
./883*
100%
100%
100%
100%
100%
Sealing Date Code
Global
SMx---SC**
Deliveries
Deliveries
Deliveries
Deliveries
Mx---SC**
100% 168h/125_C
9000 Level
HiRel
100%
100%
100%
100%
100%
100%
Space 125_C
Sealing Date Code
Global
100% Record
100% Record
100% Record
100% Record
SMx---SB**
Deliveries
Deliveries
Deliveries
Deliveries
Mx---SB**
100% 240h/125_C
9000 Level
HiRel
100%
100%
100%
MATRA Rev. Jan.
Class
Room Temp. Functionnal) Sealing Date Code 100% Record 100% Record 100% Record 100% Record Deliveries Deliveries Deliveries Deliveries 100% 240h/125_C Equivalent SMx---MS Specified Group Mx---MS Group HiRel 100% 100% 100% Group

Digital Products This document presents flows used manufacturing

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