PARALLEL EEPROM WITH SOFTWARE DATA PROTECTION FAST ACCESS TIME: 9
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M28C16
PARALLEL EEPROM WITH SOFTWARE DATA PROTECTION
FAST ACCESS TIME: 90ns SINGLE SUPPLY VOLTAGE POWER CONSUMPTION FAST WRITE CYCLE: Bytes Page Write Operation Byte Page Write Cycle: ENHANCED WRITE DETECTION: Data Polling Toggle PAGE LOAD TIMER STATUS HIGH RELIABILITY SINGLE POLYSILICON, CMOS TECHNOLOGY: Endurance >100,000 Erase/Write Cycles Data Retention Years JEDEC APPROVED BYTEWIDE SOFTWARE DATA PROTECTION DESCRIPTION M28C16 power Parallel EEPROM fabricatedwith SGS-THOMSON proprietary single polysilicon CMOS technology. device offers fast access time with power dissipation requires power supply. circuit been designed offer flexible microcontroller interface featuring both hardware software handshaking with Data Polling Toggle Bit. M28C16 supports byte page write operation. Software Data Protection (SDP) also possible using standard JEDEC algorithm.
PDIP24
PLCC32
SO24 (MS) mils
TSOP28 x13.4mm
Figure Logic Diagram
A0-A10
DQ0-DQ7
M28C16
Table Signal Names
Address Input Data Input Output Write Enable Chip Enable Output Enable Supply Voltage Ground
AI01518
June 1996
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M28C16
Figure Connections
Figure Connections
AI01485
AI01486C
M28C16
M28C16
Warning: Connected, Don't
Figure Connections
Figure TSOP Connections
M28C16
AI01519
M28C16
AI01175B
Warning: Connected.
DESCRIPTION Addresses (A0-A10). address inputs select 8-bit memory location during read write operation. Chip Enable (E). chip enable input must enable read/write operations. When Chip Enable high, power consumption reduced.
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Output Enable (G). Output Enable input controls data output buffers used initiate read operations. Data (DQ0 DQ7). Data written read from M28C16 through pins. Write Enable (W). Write Enable input controls writing data M28C16.
M28C16
Table Absolute Maximum Ratings
Symbol TSTG VESD Parameter Ambient Operating Temperature Storage Temperature Range Supply Voltage Input/Output Voltage Input Voltage Electrostatic Discharge Voltage (Human Body model)
Value +0.6 4000
Unit
Notes: Except rating "Operating Temperature Range", stresses above those listed Table "Absolute Maximum Ratings" cause permanent damage device. These stress ratings only operation device these other conditions above those indicated Operating sections this specification implied. Exposure Absolute Maximum Rating conditions extended periods affect device reliability. Refer also SGS-THOMSON SURE Program other relevant quality documents. 100pF through 1500; MIL-STD-883C, 3015.7
Table Operating Modes
Mode Standby Output Disable Write Disable Read Write
Hi-Z Hi-Z Hi-Z Data Data
Chip Erase
Note: VIL; VIH; VIH;
Hi-Z
OPERATION order prevent data corruption inadvertent write operations internal comparator inhibits Write operation below (see Table Access memory write mode allowed after power-up specified Table Read M28C16 accessed like static RAM. When with high, data addressed presented pins. pins high impedance when either high. Write Write operations initiated when both high.The M28C16 supports both controlled write cycles. Address latched falling edge which ever occurs last Data rising edge which ever occurs first. Once initiated write operation internally timed until completion.
Page Write Page write allows bytes consecutively latched into memory prior initiating programming cycle. bytes must located single page address, that A6-A10 must same bytes. page write initiated during byte write operation. Following first byte write instruction host send another address data with minimum data transfer rate 1/tWHWH (see Figure 13). transitionof detected within tWHWH, internal programming cycle will start. Chip Erase contents entire memory erased Chip Erase command setting Chip Enable Output Enable +7V. chip cleared when 10ms pulse applied Write Enable pin.
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M28C16
Figure Block Diagram
RESET
CONTROL LOGIC
DECODE
A6-A10 (Page Address)
ADDRESS LATCH
ARRAY
A0-A5
ADDRESS LATCH
DECODE
SENSE DATA LATCH
BUFFERS
PAGE LOAD TIMER STATUS TOGGLE DATA POLLING
AI01520
DQ0-DQ7
Microcontroller Control Interface M28C16 provides write operation status bits status that used minimize system write cycle. These signals available port bits memory during programming cycle only. Figure Status Assignment
PLTS Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z
produce complementary value previously latched bit. Once write cycle finished true logic value appears read cycle. Toggle (DQ6). M28C16 offers another determining when internal write cycle completed. During internal Erase/Write cycle, will toggle from (the first read value "0") subsequent attempts read memory. When internal cycle completed toggling will stop device will accessible Read Write operation. Page Load Timer Status (DQ5). Page Write mode data latched bytes input. Data output (DQ5) indicates status internal Page Load Timer. read asserting Output Enable (tPLTS). indicates timer running, High indicates time-out after which write cycle will start data input.
Data Polling Toggle PLTS Page Load Timer Status
Data Polling (DQ7). During internal write cycle, attempt read last byte written will
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M28C16
Figure Software Data Protection Enable Algorithm Memory Write
WRITE Address 555h Page Write Instruction (Note Page Write Instruction (Note
WRITE Address 555h
WRITE Address 2AAh
WRITE Address 2AAh
WRITE Address 555h
WRITE Address 555h WRITE enabled
Write Page bytes)
ENABLE ALGORITHM
WRITE MEMORY WHEN
AI01509B
Note: Address bits A10) differ during these specific Page Write operations.
Figure Software Data Protection Disable Algorithm
WRITE Address 555h
WRITE Address 2AAh
Page Write Instruction
WRITE Address 555h
WRITE Address 555h
WRITE Address 2AAh
WRITE Address 555h
Unprotected State
AI01510
Software Data Protection M28C16 offers software controlled write protection facility that allows user inhibit write modes device including Chip Erase instruction. This useful protecting memory from inadvertent write cycles that occur uncontrolled conditions. M28C16 shipped standard "unprotected" state meaning that memory contents changed required user. After Software Data Protection enable algorithm issued, device enters "Protect Mode" operation where further write commands have effect memory contents. device remains this mode until valid Software Data Protection (SDP) disable sequence received whereby device reverts "unprotected" state. Software Data Protection fully nonvolatile changed power on/off sequences. enable Software Data Protection (SDP) device requires user write (with Page Write) three specific data bytes three specific memory locations Figure Similarly disable Software Data Protection user write specific data bytes into different locations Figure (with Page Write). This complex series ensures that user will never enable disable Software Data Protection accidentally.
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M28C16
MEASUREMENT CONDITIONS
Input Rise Fall Times Input Pulse Voltages Input Output Timing Ref. Voltages 20ns 0.4V 2.4V 0.8V 2.0V
Figure Testing Equivalent Load Circuit
1.3V
1N914
Note that Output Hi-Z defined point where data longer driven.
3.3k
Figure Testing Input Output Waveforms
2.4V
DEVICE UNDER TEST 30pF
2.0V 0.8V
AI00826
0.4V
includes capacitance
AI01129
Table Capacitance
Symbol Parameter Input Capacitance Output Capacitance Test Condition VOUT Unit
Note: Sampled only, 100% tested.
Table Read Mode Characteristics 70°C 85°C; 4.5V 5.5V)
Symbol ICC1 ICC2
Parameter Input Leakage Current Output Leakage Current Supply Current (TTL inputs) Supply Current (CMOS inputs) Supply Current (Standby) Supply Current (Standby) CMOS Input Voltage Input High Voltage Output Voltage Output High Voltage
Test Condition VIL, VIL, -0.3V
Unit
-400
+0.5
Note: I/O's open circuit.
Table Power Timing 70°C 85°C; 4.5V 5.5V)
Symbol tPUR tPUW Parameter Time Delay Read Operation Time Delay Write Operation (once 4.5V) Write Inhibit Threshold Unit
Note: Sampled only, 100% tested.
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M28C16
Table Read Mode Characteristics 70°C 85°C; 4.5V 5.5V)
Symbol Parameter Test Condition tAVQV tELQV tGLQV tEHQZ tGHQZ
M28C16 -120 -150 Unit
tACC
Address Valid Output Valid Chip Enable Output Valid Output Enable Output Valid Chip Enable High Output Hi-Z Output Enable High Output Hi-Z Address Transition Output Transition
VIL, VIL,
tAXQX
Note: Output Hi-Z defined point which data longer driven.
Figure Read Mode Waveforms
A0-A10 tAVQV tGLQV tELQV DQ0-DQ7
VALID tAXQX
tEHQZ
tGHQZ DATA Hi-Z
AI01511B
Note: Write Enable High
7/18
M28C16
Table Write Mode Characteristics 70°C 85°C; 4.5V 5.5V)
Symbol tAVWL tAVEL tELWL tGHWL tGHEL tWLEL tWLAX tELAX tWLDV tELDV tELEH tWHEH tWHGL tEHGL tEHWH tWHDX tEHDX tWHWL tWLWH1 tWHWH tWHRH tDVWH tDVEH tCES tOES tOES tWES tCEH tOEH tOEH tWEH tWPH tBLC Parameter Address Valid Write Enable Address Valid Chip Enable Chip Enable Write Enable Output Enable High Write Enable Output Enable High Chip Enable Write Enable Chip Enable Write Enable Address Transition Chip Enable Address Transition Write Enable Input Valid Chip Enable Input Valid Chip Enable Chip Enable High Write Enable High Chip Enable High Write Enable High Output Enable Chip Enable High Output Enable Chip Enable High Write Enable High Write Enable High Input Transition Chip Enable High Input Transition Write Enable High Write Enable Write Enable Write Enable High Byte Load Repeat Cycle Time Write Cycle Time Data Valid before Write Enable High Data Valid before Chip Enable High VIL, 0.15 Test Condition VIL, Unit
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M28C16
Figure Write Mode Waveforms Write Enable Controlled
A0-A10 tAVWL tELWL tGHWL
VALID tWLAX
tWHEH
tWLWH1
tWHGL
tWLDV DQ0-DQ7 DATA tDVWH
tWHWL
tWHDX
AI01207
Figure Write Mode Waveforms Chip Enable Controlled
A0-A10 tAVEL tGHEL tWLEL
VALID tELAX
tELEH
tEHGL
tELDV DQ0-DQ7 DATA tDVEH tEHDX
tEHWH
AI01522
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M28C16
Figure Page Write Mode Waveforms Write Enable Controlled
A0-A10
Addr
Addr
Addr
Addr
tPLTS tWHWL tWLWH DQ0-DQ7 Byte Byte tWHWH Byte tWHWH Byte tWHRH
Byte
AI01523
Figure Software Protected Write Cycle Waveforms
tWLWH tAVEL A0-A5 tWHDX A6-A10 555h tDVWH DQ0-DQ7 Byte Byte Byte
AI01515
tWHWL
tWHWH
tWLAX Byte Address
2AAh
555h
Page Address
Note: through must specify same page address during each high transition after software code been entered. must high only when both low.
10/18
M28C16
Figure Data Polling Waveform Sequence
A0-A10
Address last byte Page Write instruction
LAST WRITE
INTERNAL WRITE SEQUENCE
READY
AI01516
Figure Toggle Waveform Sequence
A0-A10
LAST WRITE
TOGGLE INTERNAL WRITE SEQUENCE
READY
AI01517
Note: First Toggle forced
11/18
M28C16
Figure Chip Erase Wavforms
tWHEH
tGLWH tELWL tWLWH2 tWHRH
AI01484B
Table Chip Erase Characteristics 70°C 85°C; 4.5V 5.5V)
Symbol tELWL tWHEH tWLWH2 tGLWH tWHRH Parameter Chip Enable Write Enable Write Enable High Chip Enable High Write Enable Write Enable High Output Enable Write Enable High Write Enable High Write Enable Test Condition Unit
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M28C16
ORDERING INFORMATION SCHEME Example: M28C16
Speed -120 -150 90ns 120ns 150ns
Package PDIP24 PLCC32 SO24 300mils TSOP28 13.4mm
Temperature Range
Parts shipped with memory content "1's" (FFh). list available options (Speed, Package, Temperature Range, etc. refer current Memory Shortform catalogue. further information aspect this device, please contact SGS-THOMSON Sales Office nearest you.
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M28C16
PDIP24 Plastic DIP, mils width
Symb
PDIP
3.94 0.38 3.56 0.38 1.14 0.20 5.08 1.78 4.06 0.56 1.78 0.30 32.26 14.80 12.50 2.54 15.20 3.05 1.02 16.26 13.97 17.78 3.82 2.29 0.100
inches 0.155 0.015 0.140 0.015 0.045 0.008 0.200 0.070 0.160 0.021 0.070 0.012 1.270 0.583 0.492 0.598 0.120 0.040 0.640 0.550 0.700 0.150 0.090
PDIP
Drawing scale
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M28C16
PLCC32 lead Plastic Leaded Chip Carrier, rectangular
Symb
PLCC32
2.54 1.52 0.33 0.66 12.32 11.35 9.91 14.86 13.89 12.45 1.27 0.10 3.56 2.41 0.53 0.81 12.57 11.56 10.92 15.11 14.10 13.46 0.050
inches 0.100 0.060 0.013 0.026 0.485 0.447 0.390 0.585 0.547 0.490 0.004 0.140 0.095 0.021 0.032 0.495 0.455 0.430 0.595 0.555 0.530
D2/E2
PLCC
Drawing scale
15/18
M28C16
SO24 lead Plastic Small Outline, mils body width
Symb
2.46 0.13 2.29 0.35 0.23 15.20 7.42 1.27 10.16 0.61 0.10 2.64 0.29 2.39 0.48 0.32 15.60 7.59 10.41 1.02 0.050
inches 0.097 0.005 0.090 0.014 0.009 0.598 0.292 0.400 0.024 0.004 0.104 0.011 0.094 0.019 0.013 0.614 0.299 0.410 0.040
SO-b
Drawing scale
16/18
M28C16
TSOP28 lead Plastic Small Outline, 13.4mm
Symb
TSOP28
1.25 0.20 0.95 0.17 0.10 13.20 11.70 7.90 0.55 0.50 0.10 1.15 0.27 0.21 13.60 11.90 8.10 0.70 0.022
inches 0.049 0.008 0.037 0.007 0.004 0.520 0.461 0.311 0.020 0.004 0.045 0.011 0.008 0.535 0.469 0.319 0.028
TSOP-c
Drawing scale
17/18
M28C16
Information furnished believed accurate reliable. However, SGS-THOMSON Microelectronics assumes responsibility consequences such information infringement patents other rights third parties which result from use. license granted implication otherwise under patent patent rights SGS-THOMSON Microelectronics. Specifications mentioned this publication subject change without notice. This publication supersedes replaces information previously supplied. SGS-THOMSON Microelectronics products authorized critical components life support devices systems without express written approval SGS-THOMSON Microelectronics. 1996 SGS-THOMSON Microelectronics Rights Reserved
SGS-THOMSON Microelectronics GROUP COMPANIES Australia Brazil Canada China France Germany Hong Kong Italy Japan Korea Malaysia Malta Morocco Netherlands Singapore Spain Sweden Switzerland Taiwan Thailand United Kingdom U.S.A.
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