Date: December 1998 Revision: 1.01 THIS SPECIFICATION [DOCUMENT]

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Date: December 1998 Revision: 1.01 THIS SPECIFICATION [DOCUMENT]

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Profile Duct Motherboard Chassis Specification
Date: December 1998 Revision: 1.01
THIS SPECIFICATION [DOCUMENT] PROVIDED WITH WARRANTIES WHATSOEVER, INCLUDING WARRANTY MERCHANTABILITY, NONINFRINGEMENT, FITNESS PARTICULAR PURPOSE, WARRANTY OTHERWISE ARISING PROPOSAL, SPECIFICATION SAMPLE. Intel disclaims liability, including liability infringement proprietary rights, relating information this specification. license, express implied, estoppel otherwise, intellectual property rights granted herein. Copyright 1998 Intel Corporation. rights reserved. Intel Corporation, 5200 N.E. Elam Young Parkway, Hillsboro, 97124-6497
Profile Duct Motherboard Chassis Specification
Relevant Documents
Document Title Intel Document Qualification Testing Enabling Components Qualification Testing Profile Duct System Design Guidelines Profile Duct System Board Chassis Specification
Document Number 58178-01 693943
Scope
purpose Profile Duct System Board Chassis Specification provide necessary board chassis requirements implementing Profile Duct system. specification intended chassis, motherboard, system integrators order enable them develop cost cooling solution.
Overview
Although processor still highest thermal power outputs desktop system, chipset, memory, graphics components increasing power creating greater cooling demand. order meet increasing system thermal needs, current micro-ATX systems require either additional airflow heat sinks maintain necessary junction temperatures components. recommended cost solution micro-ATX systems provide Profile Duct that impinges high velocity cool external directly Core Logic Components (processor, chipset, graphics, graphics controller, memory).
Motherboard Requirements
This section provides necessary information designers layout place components motherboard that will utilize Profile Duct system. component location requirements provided Section component height requirements heat sink height requirements provided Section shown Figure Component Location Requirements 4.1.1 Graphics Location Profile Duct system requires component layout restrictions Accelerated Graphics Port (AGP) connector soldered down graphics chip. there connector, connector must located either Slot Slot micro-ATX specification. there soldered down graphics solution, graphics chip must located within boundary indicated Figure
Profile Duct Motherboard Chassis Specification
Figure Restricted Area Down Configuration.
Profile Duct Motherboard Chassis Specification
4.1.2 Memory Chipset Location Requirements memory chipset must located within areas through specified keep drawing shown Figure Component Height Restrictions component height restrictions motherboard required accommodate Profile Duct system. Processor Heat Sink Height Restrictions processor Profile Heat Sink attachment mechanisms must adhere keep-out requirements shown Figure additional information Profile Duct Design Guidelines.
Figure Profile Duct system keep-out zones motherboard.
Profile Duct Motherboard Chassis Specification
Chassis Requirements
chassis requirements Profile Duct system provide inlet venting area keep volume. keep volume defined Figure shows maximum volume assembled Profile Duct, including tolerances.
Figure Profile Duct System Area Keep-Out Volume
(Chassis keep-outs dimensioned from motherboard)
order balance airflow containment, size vent hole openings spacing between holes limited. metric gauging venting perforated metal percent open. This defined open area (the open area summation hole openings given area) divided total area (area holes plus solid metal between holes). This averaged value. Profile Duct able deliver full performance, vent area must minimum maximum open. containment prevent dust clogging vent, hole dimensions must range 0.12 inches 0.17 inches (3.0 mm).
Profile Duct Motherboard Chassis Specification
vent must placed within area shown Figure order allow mating Profile Duct vent area, there components features within keep-out area surrounding vent, shown shaded area Figure Since many chassis have varying motherboard back panel distances location vent, Profile Duct requires maximum minimum distance between datum inlet vent, shown Figure Profile Duct Design Guidelines more information recommendations.
Figure Inlet Venting Location Profile Duct System
(Crosshatched area shows keep zone Duct back panel)
Figure Vent Location Variation with Respect Datum Motherboard
Profile Duct Motherboard Chassis Specification

Date: December 1998 Revision: 1.01 THIS SPECIFICATION [DOCUMENT]

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