Date: December 1998 Revision: 1.01 THIS SPECIFICATION [DOCUMENT]

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Date: December 1998 Revision: 1.01 THIS SPECIFICATION [DOCUMENT]

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Profile Duct System Ingredients Specification
Date: December 1998 Revision: 1.01
THIS SPECIFICATION [DOCUMENT] PROVIDED WITH WARRANTIES WHATSOEVER, INCLUDING WARRANTY MERCHANTABILITY, NONINFRINGEMENT, FITNESS PARTICULAR PURPOSE, WARRANTY OTHERWISE ARISING PROPOSAL, SPECIFICATION SAMPLE. Intel disclaims liability, including liability infringement proprietary rights, relating information this specification. license, express implied, estoppel otherwise, intellectual property rights granted herein. Copyright 1998 Intel Corporation. rights reserved. Intel Corporation, 5200 N.E. Elam Young Parkway, Hillsboro, 97124-6497
Profile Duct Ingredients Specification
Relevant Documents
Document Title Intel Document Qualification Testing Enabling Components Qualification Testing Profile Duct System Design Guidelines Profile Duct Motherboard Chassis Specification
Document Number 58178-01 693943
Scope
purpose Profile Duct Ingredient Specification provide necessary boundary conditions design Profile Duct system that complies with Profile Duct Motherboard Chassis Specification. Profile Duct must designed meet system integrators environmental requirements. design recommendations, consult Profile Duct System Design Guidelines.
Overview
Although processor dissipates maximum amount heat Core Logic components (processor, chipset, graphics, graphics controller, memory), these complimentary components performance related power dissipation increasing. Especially Front Side frequency rises. order meet these increased thermal demands, additional heat sinks increased velocities required cooling Core logic components. recommended low-cost solution micro-ATX system provide Profile Duct that impinges high velocity cool external directly Core Logic components.
Thermal Requirements
primary function Profile Duct cool Core Logic components while negatively impacting cooling remainder chassis. This accomplished impinging cool exterior high velocity directly Core Logic components. primary requirement Profile Duct that thermal requirements Core Logic components met. Duct must able provide minimum volumetric airflow, which will described following sections. Inlet Volume Airflow Profile Duct geometry inlet vent design must allow minimum volumetric airflow rate Cubic Feet Minute (CFM), using standard axial fans. airflow should measured inlet vent into chassis with power supply operating. minimize acoustic noise, volume airflow reduced lower ambient temperatures through speed control, more information Profile Duct System Design Guidelines.
Profile Duct Ingredients Specification
Inlet temperature: 35°C operating temperature should measured Profile Duct inlet vent into chassis. This temperature based Intel's external ambient temperature specification 35°C (max). higher ambient temperatures required, additional thermal design improvements needed meet system board component temperature specifications, such additional heat sinks. Position order properly cool core components, position limited zone shown Figure
Figure Position With Respect Micro-ATX Motherboard Datum's.
Profile Duct Ingredients Specification
Geometry Requirements
geometry requirements Profile Duct system must allow assembly system-level components including cables, drives, power supplies, other components. Duct must meet following geometry requirements: Volumetric Requirements volume Profile Duct system must exceed volumes found Profile Duct Motherboard Chassis Specification. Upgrade Requirements Profile Duct system must allow upgrade access processor core components.
Requirements
material duct used constructing Profile Duct must electrically nonconductive. additional design information, Profile Duct System Design Guidelines.
Regulatory Certification Requirements
plastic material must Recognized under Category Plastics (QMFZ2) with flammability rating 94V-1 94V-0. Each molded plastic part representing significant fuel fire must Recognized under Category Fabricated Parts (QMMY2). Documentation: Specifications Plastics used duct, Recognized under another Recognition program, must contain following wording: MUST MADE RECOGNIZED MATERIAL WITH FLAMMABILITY RATING 94V-1 BETTER. FABRICATOR MUST RECOGNIZED. ASSIGNED CODE DESIGNATION, FABRICATOR'S NAME, SPECIFICATION, DATE FABRICATION MUST PROVIDED WITH EACH SHIPMENT. Marking Recommendations: These must marked part (preferred), shipping container, accompanying documentation (invoice, certificate, etc) 11469 marking (i.e. >PC+ABS<) Resin material designation (i.e. C2800) Resin vendor (i.e. Fabricator's name assigned code designation Date code traceability
Profile Duct Ingredients Specification

Date: December 1998 Revision: 1.01 THIS SPECIFICATION [DOCUMENT]

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