GaAs High Linearity Package Avago's AMMP-6232 easy-to-use broadba
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AMMP-6232
GaAs High Linearity Package
Avago's AMMP-6232 easy-to-use broadband, high package. wide band unconditionally stable optimal performance. Since this MMIC covers several purchase options MMIC fabricated using PHEMT technology. surface mount package eliminates
Features
SinglePowerSupplyPin UnconditionallyStable 50OhmInputandOutputMatch
Specifications (Vdd 4.0V, 138mA)
RFFrequencies:18-32GHz HighOutputIP3:29dBm HighSmall-SignalGain:23dB TypicalNoiseFigure:3dB
Connections (Top View)
100pF
Applications
Function RFout RFin
100pF
MicrowaveRadiosystems SatelliteVSAT,DBSUp/DownLink LMDS&Pt-PtmmWLongHaul BroadbandWirelessAccess (including802.16and802.20WiMax) WLLandMMDSloops Commercialgrademilitary
Note:
Topview Packagebase:GND
Attention: Observe precautions handling electrostatic sensitive devices.
Machine Model (Class Human Body Model (Class Refer Avago Application Note A004R: Electrostatic Discharge Damage Control
Absolute Maximum Ratings
Parameters Conditions Drain Ground Voltage Gate-Drain Voltage Drain Current Gate Bias Voltage Gate Bias Current Input Power channel temperature Storage temperature Maximum Assembly Temp Symbol Tstg Tmax Unit +0.8
Specifications/ Physical Properties
Parameter Test Condition Drain Supply Current (Vd=4.0 Drain Supply Voltage Gate Bias Current Gate Bias Voltage Thermal Resistance(3) Symbol Unit °C/W -0.95 -0.8
Channel-to-backside Thermal Resistance (Tchannel 34°C) measured using infrared microscopy. Thermal Resistance
AMMP-6232 Specifications
Parameters Test Conditions Small-Signal Gain[5] Noise Figure into 50W[5] Output Power Gain Compression Output Power Gain Compression Output Third Order Intercept Point Isolation Input Return Loss Output Return Loss Freq. (GHz) Symbol Gain P-dB Psat OIP3 RLin RLout Units Minimum Typical Maximum Sigma
AMMP-6232 Typical Performance [1],
(dB) Frequency (GHz)
NoiseFigure (dB) Frequency (GHz)
Figure Small-signal Gain
Figure Noise Figure
OP1dB (dBm) Frequency (GHz)
(dB) Frequency (GHz)
Figure Input Return Loss
Figure Output P-1dB
OIP3 (dBm)
(dB) Frequency (GHz)
Frequency (GHz)
Figure Output Return Loss
Figure Output
Note:
AMMP-6232 Typical Performance (cont.)
(dB)
(mA)
Frequency (GHz)
Figure Isolation
Figure Total Current
NoiseFigure (dB)
(dB) Frequency (GHz)
Frequency (GHz)
Figure Gain over
Figure Noise Figure over
(dB)
(dB)
Frequency (GHz)
Frequency (GHz)
Figure Input Return Loss Over
Figure Output Return Loss Over
AMMP-6232 Typical Performance (cont.)
OP1dB (dBm)
OIP3 (dBm)
Frequency (GHz)
Frequency (GHz)
Figure Output P-1dB over
(dB) Frequency (GHz)
-40C
Figure Output Over
NoiseFigure (dB)
-40C
Frequency (GHz)
Figure Gain over Temp
(dB)
Figure Noise Figure over Temp
(dB)
-40C
-40C
Frequency (GHz)
Frequency (GHz)
Figure Input Return Loss Over Temp
Figure Output Return Loss Over Temp
AMMP-6232 Application Usage
0.1uF
Biasing Operation
AMMP-6232 normally biased with positive drain supply connected negative gate approximately -0.95V corresponding drain current 138mA. important have 0.1uF bypass capacitors capacitor should placed close component possible. Aspects amplifier application additional conjugate, linearity, noise(Topt)matching. AMMP-6232 safely biased (while fixing gate bias) desired. performance output power transmitter driver applications andthermalconditions.
100pF
100pF
0.1uF
View Package base:
Figure Usage AMMP-6232
-0.95V
Figure Evaluation/Test Board (available qualified customer request)
Matching Network
Matching Network
Matching Network
Figure Simplified AMMP-6232 Schematic
Recommended Attachment Package
AMMP Packaged Devices compatible with high material mounting pattern, defined Engineering.
Manual Assembly
Apply solder paste using stencil printer placement. volume solder paste will controlled ensure consistent mechanical electricalperformance. Follow solder paste vendor's recommendations when developing solder reflow profile. standard profile will have steady ramp from room temperature pre-heat temp. avoid damage duetothermalshock. Packages have been qualified withstand peak temperature 260°C seconds. Verify that Figure stencil solder paste deposition opening approximately pad. Reducing stencil opening potentially generate more voids underneath. other hand, stencil openings solder paste thickness will directly affect quality most commonly used solder reflow method accomplished belt furnace using convection heat transfer. suggested reflow profile automated reflow processes shown Figure This profile profile indicated Figure will vary among different hereforreferenceonly.
Ground vias should solder filled
NOTES: AllgroundsmustbesolderedtoPCBRF
Figure Land Pattern Stencil Layouts
Temp (°C) Ramp1 Preheat Ramp2 Reflow Cooling Seconds
Peak=250±5°C Meltingpoint=218°C
Figure Suggested Lead-Free Reflow Profile SnAgCu Solder Paste
Package, Tape Reel, Ordering Information AMMP-6232 Part Number Ordering Information
Part Number AMMP-6232-BLKG AMMP-6232-TRG AMMP-6232-TR2G Devices Container Container Antistatic Reel Reel
.011
View
Side View
Carrier Tape Pocket Dimensions
Back View
product information complete list distributors, please site:
www.avagotech.com
Avago, Avago Technologies, logo trademarks Avago Technologies, Limited United States other countries. Data subject change. Copyright 2006 Avago Technologies Limited. rights reserved. AV0-0442EN November 2006
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