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6-20 Noise Amplifier Description Avago's AMMP-6220 high gain, low
Top Searches for this datasheetAMMP-6220 6-20 Noise Amplifier Description Avago's AMMP-6220 high gain, low-noise amplifier that operates from GHz. designed easy-to-use component surface mount application. broad unconditionally stable performance makes this ideal primary, sub-sequential driver noise gain stages. Intended applications include microwave radios, 802.16, automotive radar, VSAT, satellite receivers. Since part cover several bands, AMMP6220 reduce part inventory increase volume purchase options. integrated match, blocking, self-bias choke eliminate complex tuning assembly processes typically required hybrid (discrete-FET) amplifiers. package full compatible with backside grounding simplify assembly. Features surface mount package Broad Band performance 6-20 typical noise figure High typical gain input output match Single supply bias Applications Microwave radio systems Satellite VSAT, up/down link LMDS Pt-Pt Long Haul Broadband Wireless Access (including 802.16 802.20 WiMax) MMDS loops Commercial grade military Functional Diagram FUNCTION RFout RFin PACKAGE BASE Attention: Observe precautions handling electrostatic sensitive devices. Machine Model (Class Human Body Model (Class Refer Avago Application Note A004R: Electrostatic Discharge Damage Control. AMMP-6220 Absolute Maximum Ratings Symbol Tstg Tmax Parameters/Conditions Positive Drain Voltage Drain Current Input Power Operating Channel Temp. Storage Case Temp. Maximum Assembly Temp. max.) Units Min. Max. +150 +150 +300 Note: Operation excess these conditions result permanent damage this device. AMMP-6220 Specifications/Physical Properties Symbol Parameters Test Conditions Drain Supply Current (under power drive temperature) qch-b Thermal Resistance[2] (Backside temperature, 25°C) Units Min. Typ. Max. °C/W Notes: Ambient operational temperature 25°C unless otherwise noted. Channel-to-backside Thermal Resistance (Tchannel (Tc) 34°C) measured using infrared microscopy. Thermal Resistance backside temperature (Tb) 25°C calculated from measured data. AMMP-6220 Specifications 25°C, Id(Q) Symbol Gain P-1dB OIP3 RLin RLout Isol Parameters Test Conditions Small-signal Gain[5] Noise Figure into W[5] Output Power Gain Compression Third Order Intercept Point; MHz; Input Return Loss Output Return Loss Reverse Isolation Units Typical Sigma Notes: Small/Large -signal data measured fully de-embedded test fixture form 25°C. Pre-assembly into package performance verified 100% on-wafer AMMC-6220 published specifications. This final package part performance verified functional test correlated actual performance more frequencies. Specifications derived from measurements test environment. Aspects amplifier performance improved over more narrow bandwidth application additional conjugate, linearity, noise (Gopt) matching. AMMP-6220 Typical Performances 25°C, Zout unless otherwise stated) Note: These measurements test environment. Aspects amplifier performance improved over narrower bandwidth application additional conjugate, linearity noise (Gopt) matching. (dB) (dB) (dB) FREQUENCY (GHz) FREQUENCY (GHz) FREQUENCY (GHz) Figure Gain. Figure Isolation. Figure Input return loss. (dB) OP-1dB OIP3 (dBm) (dB) P-1dB OIP3 FREQUENCY (GHz) FREQUENCY (GHz) FREQUENCY (GHz) Figure Output return loss. Figure Noise figure. Figure Typical power, OP-1dB OIP3. (dB) +25°C -40°C +85°C +25°C -40°C +85°C (dB) +25°C -40°C +85°C (dB) FREQUENCY (GHz) FREQUENCY (GHz) FREQUENCY (GHz) Figure Gain over temperature. Figure Isolation over temperature. Figure Input return loss over temperature. AMMP-6220 Typical Performances 25°C, Zout unless otherwise stated) Note: These measurements test environment. Aspects amplifier performance improved over narrower bandwidth application additional conjugate, linearity noise (Gopt) matching. +25°C (dB) +25°C (mA) +25°C -40°C +85°C -40°C +85°C (dB) -40°C +85°C FREQUENCY (GHz) FREQUENCY (GHz) Figure Output return loss over temperature. Figure over temperature. Figure Bias current over temperature. (dB) (dB) (dB) FREQUENCY (GHz) FREQUENCY (GHz) FREQUENCY (GHz) Figure Gain over Vdd. Figure Isolation over Vdd. Figure Input over Vdd. (dB) OIP3 (dBm) (dB) FREQUENCY (GHz) FREQUENCY (GHz) FREQUENCY (GHz) Figure Output return loss over temperature. Figure Noise figure over Vdd. Figure OIP3 over Vdd. AMMP-6220 Typical Scattering Parameters[1] 25°C, Freq 10.0 10.5 11.0 11.5 12.0 12.5 13.0 13.5 14.0 14.5 15.0 15.5 16.0 16.5 17.0 17.5 18.0 18.5 19.0 19.5 20.0 20.5 21.0 21.5 22.0 22.5 23.0 23.5 24.0 24.5 25.0 0.845 0.888 0.955 0.585 0.825 0.851 0.724 0.832 0.585 0.370 0.252 0.187 0.160 0.150 0.150 0.149 0.149 0.155 0.165 0.191 0.218 0.242 0.268 0.287 0.299 0.305 0.297 0.294 0.289 0.283 0.274 0.267 0.241 0.217 0.203 0.205 0.225 0.268 0.326 0.398 0.471 0.534 0.554 0.581 0.618 0.675 0.737 0.036 0.292 2.027 3.420 2.051 6.764 9.563 13.836 15.077 15.218 15.198 14.717 14.575 14.429 14.408 14.455 14.462 14.624 14.926 15.226 15.497 15.483 15.450 15.143 14.518 13.724 13.168 12.858 12.536 11.970 11.796 11.331 11.208 10.720 10.474 10.158 9.847 9.413 8.500 8.140 7.703 7.055 6.535 5.881 4.894 4.288 3.822 0.001 0.003 0.005 0.001 0.001 0.003 0.005 0.006 0.003 0.002 0.001 0.002 0.002 0.003 0.004 0.004 0.005 0.006 0.007 0.006 0.008 0.008 0.008 0.010 0.009 0.010 0.009 0.009 0.008 0.009 0.011 0.012 0.012 0.012 0.012 0.011 0.012 0.011 0.011 0.010 0.010 0.009 0.007 0.005 0.004 0.003 0.003 INPUT REFERENCE PLANE S-PARAMETERS -1.46 -1.03 -0.40 -4.65 -1.67 -1.39 -2.80 -1.59 -4.66 -8.62 -11.96 -14.57 -15.90 -16.48 -16.49 -16.53 -16.56 -16.19 -15.63 -14.36 -13.22 -12.30 -11.45 -10.83 -10.47 -10.32 -10.53 -10.62 -10.79 -10.97 -11.25 -11.47 -12.36 -13.30 -13.86 -13.77 -12.94 -11.42 -9.73 -8.00 -6.54 -5.44 -5.12 -4.72 -4.17 -3.40 -2.65 Phase 65.6 -4.4 -83.9 -150.2 153.6 72.8 18.7 -65.0 -144.6 148.4 93.4 48.4 12.5 -21.7 -58.8 -100.8 -147.1 161.1 108.2 54.8 -50.7 -102.0 -154.6 153.2 101.7 52.2 -33.2 -67.4 -109.8 -152.2 168.0 132.5 99.5 67.3 32.0 -6.3 -49.1 -94.4 -140.6 173.4 128.5 86.1 44.3 -44.6 -28.9 -10.6 10.6 16.6 19.6 22.8 23.5 23.6 23.6 23.3 23.2 23.1 23.1 23.2 23.2 23.3 23.4 23.6 23.8 23.7 23.7 23.6 23.2 22.7 22.3 22.1 21.9 21.5 21.4 21.0 20.9 20.6 20.4 20.1 19.8 19.4 18.5 18.2 17.7 16.9 16.3 15.3 13.7 12.6 11.6 Phase -62.0 -147.1 96.8 -71.3 -104.2 -178.3 93.3 -72.4 -145.1 150.4 90.5 33.6 -20.9 -74.7 -126.9 -178.2 131.2 80.4 29.4 -20.8 -72.0 -122.8 -173.1 135.7 87.2 38.7 -8.5 -56.2 -102.6 -151.3 162.1 115.8 69.0 21.3 -25.9 -74.5 -121.1 -169.0 142.8 93.3 45.0 -3.1 -54.0 -102.8 -147.1 168.3 Phase 70.9 12.1 -72. 136.7 143.5 -86.3 140.2 26.4 -66.8 -116.2 153.4 89.9 33.2 -16.5 -46.2 -85.8 -121.8 -155.9 159.4 130.7 88.0 49.2 14.5 -26.9 -66.8 -104.7 -146.3 174.6 138.1 116.4 77.9 38.0 -5.3 -40.0 -82.3 -118.5 -161.5 162.1 124.7 79.8 35.1 -41.2 -84.6 -136.3 -162.8 134.1 -4.8 -9.6 -8.8 -6.3 -6.1 -9.3 -10.8 -15.5 -16.9 -16.7 -17.5 -19.5 -22.7 -24.6 -23.7 -21.9 -21.0 -21.3 -22.6 -23.8 -23.4 -21.3 -19.7 -17.8 -16.0 -14.4 -13.5 -13.2 -13.6 -12.7 -12.1 -12.1 -13.1 -14.2 -15.4 -16.5 -16.8 -16.8 -16.5 -16.1 -16.5 -17.3 -21.9 -18.0 -11.5 -9.0 -7.7 0.570 0.330 0.361 0.483 0.491 0.342 0.286 0.166 0.141 0.146 0.132 0.106 0.073 0.059 0.065 0.080 0.089 0.086 0.074 0.064 0.067 0.086 0.102 0.127 0.157 0.189 0.211 0.218 0.208 0.231 0.247 0.246 0.220 0.194 0.170 0.148 0.144 0.143 0.148 0.156 0.149 0.136 0.080 0.126 0.265 0.355 0.409 Phase 85.5 38.7 18.1 -46.1 -118.9 174.4 125.8 79.4 64.2 31.4 -8.7 -51.8 -103.7 -172.2 119.7 70.3 31.0 -3.6 -29.9 -46.2 -59.0 -90.7 -130.4 179.7 128.3 79.9 34.8 -4.6 -38.0 -65.0 -101.8 -140.0 179.3 139.1 94.9 44.7 -5.1 -51.5 -92.9 -132.8 -167.4 159.4 138.2 178.1 141.6 100.9 61.8 Note: Data obtained from fixture measurements fully de-embedded package edge. OUTPUT REFERENCE PLANE S-PARAMETERS (VIEW FROM PACKAGE BOTTOM) Biasing Operation AMMC-6220 normally biased with single positive drain supply connected both through bypass capacitors shown Figure recommended supply voltage important have bypass capacitor, capacitor should placed close component possible. AMMC-6220 does require negative gate voltage bias three stages. ground wires needed because ground connections made with plated through-holes backside package. Refer Absolute Maximum Ratings table allowed thermal conditions. (TYP. RFin RFout PACKAGE BASE Figure Typical application. RFout RFin Figure Simplified MMIC schematic. Figure Demonstration board (available upon request). Outline Drawing AMMP XXXX YWWDNN FRONT VIEW Recommended Attachment AMMP Packaged Devices compatible with high volume surface mount assembly processes. material mounting pattern, defined data sheet, optimizes performance strongly recommended. electronic drawing land pattern available upon request from Avago Sales Application Engineering. Manual Assembly Follow precautions while handling packages. Handling should along edges with tweezers. Recommended attachment conductive solder paste. Please recommended solder reflow profile. Conductive epoxy recommended. Hand soldering recommended. Apply solder paste using stencil printer placement. volume solder paste will dependent component layout should controlled ensure consistent mechanical electrical performance. Follow solder paste vendor's recommendations when developing solder reflow profile. standard profile will have steady ramp from room temperature pre-heat temperature avoid damage thermal shock. Packages have been qualified withstand peak temperature 260°C seconds. Verify that profile will expose device beyond these limits. SIDE VIEW MAX. 0.213 (5.4) 0.088 (2.25) SYMBOL MIN. 0.198 (5.03) 0.0685 (1.74) DIMENSIONS INCHES (MM) 0.114 (2.90) 0.011 (0.28) 0.018 (0.46) 0.014 (0.365) 0.126 (3.2) 0.059 (1.5) 0.016 (0.40) 0.100 (2.54) 0.029 (0.75) 0.016 (0.40) 0.012 (0.30) 0.028 (0.70) 0.100 (2.54) 0.93 (2.36) BACK VIEW DIMENSIONAL TOLERANCE BACK VIEW: 0.002" (0.05 NOTES: INDICATES DIMENSIONS INCHES (MILLIMETERS) GROUNDS MUST SOLDERED GROUND Figure Outline Drawing. Suggested Material Land Pattern 0.093 (2.36) 0.010 (0.25) 0.011 (0.28) 0.016(0.40) 0.0095 (0.24) 0.126 (3.20) 0.059 (1.50) 0.020 (0.50) 0.016 (0.40) 0.012 (0.30) GROUND VIAS SHOULD SOLDER FILLED 0.018 (0.46) 0.018 (0.46) INCHES (MILLIMETERS). MATERIAL ROGERS RO4350, 0.010-INCH THICK. 0.114 (2.90) 0.0095 (0.24) Figure Solder Reflow Profile most commonly used solder reflow method accomplished belt furnace using convection heat transfer. suggested reflow profile automated reflow processes shown Figure This profile designed ensure reliable finished joints. However, profile indicated Figure will vary among different solder pastes from different manufacturers shown here reference only. PEAK MELTING POINT 218°C RAMP PREHEAT RAMP TIME (SECONDS) REFLOW COOLING Figure Suggested lead-free reflow profile SnAgCu solder paste. TEMPERATURE (°C) Stencil Design Guidelines properly designed solder screen stencil required ensure optimum amount solder paste deposited onto pads. recommended stencil layout shown Figure stencil solder paste deposition opening approximately pad. Reducing stencil opening potentially generate more voids underneath. other hand, stencil openings larger than 100% will lead excessive solder paste smear bridging across pads. Considering fact that solder paste thickness will directly affect quality solder joint, good choice laser stencil composed 0.127 mils) thick stainless steel which capable producing required fine stencil outline. combined stencil layout shown Figure 0.70 0.60 1.60 0.95 0.36 1.80 0.9550 0.36 0.27 0.36 0.40 R0.14 Figure Stencil outline drawing (mm). 0.40 0.46 0.60 0.67 0.36 0.40 3.20 1.80 0.40 0.36 0.30 0.27 1.60 2.90 STENCIL OPENING Figure Combined stencil layouts (mm). AMMP-6220 Part Number Ordering Information Part Number AMMP-6220-BLK AMMP-6220-TR1 AMMP-6220-TR2 Devices Container Container Antistatic Reel Reel Device Orientation (Top View) AMMP XXXX AMMP XXXX AMMP XXXX Carrier Tape Pocket Dimensions 4.00 0.10 NOTE 2.00 0.05 1.55 0.05 0.50 TYP. 1.75 0.10 5.50 0.05 12.00 0.10 SECTION PITCH: WIDTH: 5.30 5.30 2.20 8.00 12.00 MIN. 5.20 NOM. 5.30 MAX. 5.40 5.20 5.30 5.40 2.10 2.20 2.30 8.00 0.10 1.50 (MIN.) 0.30 0.05 SECTION NOTES: MEASURED ABOVE BASE POCKET. PITCHES CUMULATIVE TOLERANCE DIMENSIONS MILLIMETERS (mm). product information complete list distributors, please website: www.avagotech.com Avago, Avago Technologies, logo trademarks Avago Technologies Limited United States other countries. Data subject change. Copyright 2006 Avago Technologies Limited. rights reserved. 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