PACKAGE THERMAL CHARACTERISTICS Qty-Type Terminals 14-Pin 16-Pin
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PACKAGE THERMAL CHARACTERISTICS
PACKAGE THERMAL CHARACTERISTICS
Qty-Type Terminals 14-Pin 16-Pin 18-Pin 20-Pin 22-Pin 28-Pin 40-Pin 8-Pin 14-Pin 16-Pin 22-Pin 24-Pin 28-J Lead 44-J Lead 28-J Lead 44-J Lead 20-J Lead 28-J Lead 44-J Lead 64-Lead 4-Lead 5-Lead 3-Gull Wing 8-Gull Wing 14-Gull Wing 16-Gull Wing 20-Gull Wing 24-Gull Wing 3-Lead (°C/W) (°C/W)
Allegro Package Code
Package Type (Common Package Designators) Plastic Dual In-Line (DlP PDlP)
Semi-Tab Plastic Dual In-Line (DIP PDIP)
Semi-Tab Plastic Leaded Chip Carrier (PLCC PQCC) Semi-Tab Plastic Leaded Chip Carrier (PLCC PQCC) Square Plastic Leaded Chip Carrier (PLCC PQCC)
Low-Profile Quad Flatpack (L-PQFP) Plastic Single In-Line (SIP PSIP) Plastic Single In-Line (SIP PSIP) Plastic Small-Outline Transistor SOT) Plastic Small-Outline (SO, SOIC, SOL)
Semi-Tab Plastic Small-Outline (SO, SOIC, SOL)
Plastic Long-Leaded Small-Outline Transistor SOT)
Mounted 2.5" 3.5" (63.5mm 89mm) multilayer board.
data given intended general reference only based certain simplifications such constant chip size standard bonding methods. Where differences exist, detail specification takes precedence.
PACKAGE THERMAL CHARACTERISTICS
Allegro Package Code
Package Type (Common Package Designators) Wide-Body Plastic Small-Outline (SO, SOIC, SOL)
Qty-Type Terminals 16-Gull Wing 18-Gull Wing 20-Gull Wing 28-Gull Wing 8-Pin 3-Lead 3-Lead 12-Lead 18-Lead 3-Lead 3-Lead 5-Lead
(°C/W)
(°C/W)
Mini Plastic Dual In-Line (DIP PDIP) Plastic Mini Single In-Line (SIP) Plastic Ultra-Mini Single In-Line (SIP) Power-Tab Plastic Single In-Line (SIP)
Plastic Transistor (TO-92/TO-226AA) Power-Tab Plastic Single In-Line (SIP)
data given intended general reference only based certain simplifications such constant chip size standard bonding methods. Where differences exist, detail specification takes precedence.
Allegro MicroSystems, Inc. reserves right make, from time time, such departures from detail specifications required permit improvements design products. Components made under military approvals will accordance with approval requirements. information included herein believed accurate reliable. However, Allegro MicroSystems, Inc. assumes responsibility use; infringements patents other rights third parties which result from use.
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