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QUALITY RELIABLITY ENGINEERING PACKAGE CERTIFICATION
Results from stress tests included within this report. evaluations performed certification included following: Infant Mortality 6.5V/+125°C Pre-conditioning CSAM, Visual High Voltage Dynamic Life Test (HVELT) +125°C, 6.5V High Temperature Storage (Bake) +140°C Temperature Cycle (T/C after preconditioning L-2) +85°C Steam (autoclave) +121°C, atm, 100%RH Temperature Humidity Bias Test (85/85) after pre-conditioning Solder Joint Reliability 100°C (opens/shorts test)Bend/Push Test deflection (opens/shorts test) Twist Test deflection (opens/shorts test)
µBGA package chip-scale package (CSP), which utilizes polyimide tape with eutectic solder balls. µBGA package offers application smaller form factors with allowable existing infrastructure also have testability packaged thermosonic lead bond used interconnection between polyimide tape. protective silicone elastomer compound between polyimide tape absorbs stresses thermal coefficient expansion mismatch between package substrate. Quality/Reliability Verification
This report designed provide detailed description methods used verify that µBGA package meets exceeds Intel's package certification requirements. Each test described, results presented. reliability device generally defined probability that device will perform intended function under specified operating conditions throughout life. determine device's reliability, Intel subjects sample lots device variety stress tests. part numbers have Intel's production qualification quality reliability requirements.
eutectic solder ball 350um dia./250um height copper 18um with gold plating
above stress tests were conducted units that completed full manufacturing flow. cases, failure defined failure meet data sheet parameter. Stress test readouts electrical test endpoints done same equipment used electrical test commercial product manufacturing. Stresses with endpoints other than electrical test have explanations endpoints stress descriptions.
solder resist Polyimide encapsulation edge bumper elastomer
Figure 24.The G28F008S3 40-ball µBGA* Package meets Intel's Production Qualification Requirements.
Infant Mortality Summary
Infant mortality evaluation (IME) data used predict product early life failure rate. data also used determine required burn-in time. Burn-in used production needed ensure that early life failure rate goals met. units functionally exercised 6.5V elevated ambient temperature +125°C hours. During test memory sequentially addressed outputs exercised, monitored loaded. checkerboard data pattern used simulate random patterns expected during actual use. Then units used infant mortality evaluation subjected Intel specification testing. Table Infant Mortality Evaluation +125°C/6.5V
Totals Hours 0/125 0/126 0/125 0/376 Hours 0/125 0/126 0/125 0/376 Hours 0/125 0/126 0/125 0/376
High Voltage Dynamic Lifetest
This test used accelerate oxide breakdown failures. test set-up identical used Infant Mortality Evaluation. This data with voltage acceleration factor standard dynamic life test data used calculate failure rate. Table High Voltage Dynamic Lifetest +125°C/6.5V
Hours 0/125 Hours 0/125 1000 Hours 0/125
Failure Analysis Summary:
Qty. Board/socket-related failure (Invalid) unit damaged, seven units board/socket-related failures (Invalid) Description
High Temperature Storage (Bake)
+140°C bake, with applied voltage, performed determine effect high temperature storage without electrical bias. bake evaluation accelerates failure mechanisms such single charge loss, bond degradation, process wear-out mechanisms such ionic contamination. This stress also checks contact integrity. test conducted conformance with specification Mil-Std-883C method 1008.2. Table High Temperature Storage +140°C
Totals Hours 0/45 0/45 1/45 1/135 Hours 0/45 0/45 1/44 1/134 Hours 0/45 0/45 0/43 1/133 1000 Hours 0/45 0/45 0/43 1/133
Failure Analysis Summary:
Description Failure lifted lead from bond pad. (Valid1) Failure lifted lead from bond pad. (Valid1)
NOTE:
Early production problems resulted lead lifts. This mechanism been seen various stresses been verified fixed latest temperature cycle data. (See temperature cycle results.)
Package Pre-Conditioning 40-Ball µBGA* Package 28F008SC Pre-Conditioning Flow
Package pre-conditioning performed simulate shipping, storage, surface mount reflow conditions. Each unit exposed temperature humidity simulate storage (duration exposure dependent package type.) Finally, each unit through pass, +240°C reflow. After test been completed, each device electrically checked ensure that degradation functionality occurred. devices exposed this flow prior both temperature cycling temperature humidity testing.
24-Hour Bake +125°C
Cycles -55°C +125°C
Level 85/60 Temperature/Humidity Soak Hours
Cycles +240°C Peak
Electrical Test
Figure Package Pre-Conditioning Flow
Moisture Sensitivity Level (Package Pre-Conditioning)
addition electrical testing, sample parts tested before after preconditioning using visual acoustic microscopy determine package cracking voiding occurred during test. Product meets level criteria, product allowed "out bag" year prior when typical production environment. Table Moisture Sensitivity Level Testing Level
Totals Intial CSAM 0/20 0/20 0/20 0/60 Intial Visual 0/20 0/20 0/20 0/60 Final CSAM 0/20 0/20 0/20 0/60 Final Visual 0/20 0/20 0/20 0/60
Temperature Cycle
Temperature cycling performed evaluate mechanical integrity device when exposed temperature extremes. Mechanical failure mechanisms such package cracking, cracking, thin film cracking, bond wire opens attach problems accelerated this stress. Temperature cycling also checks changes electrical characteristics mechanical displacement rupture conductors insulating materials. Other effects include delamination finishes degradation package hermeticity. this stress, devices alternately exposed -40°C +85°C. units must transferred between temperatures within minute must reach specified temperature within fifteen minutes. units must that temperature minimum minutes. Heating cooling done convection. Table Temperature Cycle -40°C +85°C Pre-Conditioned
40-Ball µBGA package Totals Cycles 0/25 1/85(a) 0/85 0/85 0/80 0/78 0/80 1/518 Cycles 0/25 0/84 0/85 0/85 0/80 0/77(b) 0/80 0/516 Cycles -0/84 0/85 0/85 0/80 0/77 0/80 0/491
Table Temperature Cycle -40°C +85°C Pre-Conditioning)
40-Ball µBGA* Package Totals Cycles 0/50 0/75 0/20 0/20 0/20 0/185 Cycles 0/50 0/75 0/20 0/20 0/20 0/185 Cycles 0/50 0/75 0/20 0/20 0/20 0/185 1.5K Cycles 0/50 -0/50
Failure Analysis Summary:
Description Failure lifted lead from bond pad. (Valid1) Damaged unit removed from sample (Invalid)
NOTE:
Early production problems resulted lead lifts. Lots have seen corrective action. failures have been seen.
Steam (Autoclave)
steam stress accelerates moisture penetration through packaging material surface die. objective test accelerate problems found very moist environments. Failure mechanisms typically seen from this stress include corrosion, passivation defects, leakage contamination. test chamber maintained temperature +121°C absolute pressure atmospheres. Table Steam
40-Ball µBGA* Package Totals Hours 0/30 0/30 0/84 0/85 0/85 0/314 Hours 0/30 0/30 0/83 0/85 0/85 0/313 Hours 0/30 0/30 0/83 0/85 1/85 1/313 Hours 0/30 0/30 0/83 0/85 0/84 0/312
Failure Analysis Summary
Description Unit removed from sample because failed product speed test. Problem fixed current stepping. (Invalid) Unit removed from sample because package damaged handling test. (Invalid) Failure lifted lead from bond pad. (Valid1)
NOTE:
Early production problems resulted lead lifts. This mechanism been seen various stresses been verified fixed latest temperature cycle data. (See temperature cycle results.)
7.10
Temperature Humidity Bias Test (85/85)
This high-temperature/high-humidity stress used evaluate reliability non-hermetic devices humid environments. units biased with maximum voltage within operating range applied alternate pins while maintaining minimum overall power dissipation, +85°C ambient with relative humidity. contamination present, combine with moisture form electrolyte. Typical failure mechanisms from this stress include electrolytic corrosion metal contamination induced threshold shifts moisture. Table Temperature Humidity Bias (85/85)
40-Ball µBGA* Package Totals Hours 0/70 0/67 0/70 0/64 0/271 1000 Hours process process process process
7.11
Solder Joint Reliability
Solder joint reliability testing performed soldering µBGA package components 64-mil thick FR-4 boards thermal cycling units. units used G28F008 daisy chain configured die, failure criteria resistive (500) open leads determined continuous monitoring.
Table Solder Joint Reliability
40-Ball µBGA* Package Criteria -40°C +85°C (opens/shorts) +100°C (opens/shorts) Cycles 0/1240 joints Cycles 0/1240 joints Cycles 0/1232 joints 0/1238 joints 1000 Cycles 0/1232 joints 0/1238 joints
Failure Analysis Summary:
Description Eight joints removed from sample because surface mount processing error (Invalid) joints removed from sample because surface mount processing error (Invalid)
7.12
Package Assembly Data
following data from in-process monitors during assembly process. Data from lots used qualification testing. Table Package Dimensions
Test Item Total Height Stand Package Body Thickness Ball Diameter Package Body Length Package Body Width Ball Pitch Coplanarity Corner Ball (S1) Corner Ball (S2) Criteria max. 0.988 min. 0.888 min. 0.18 0.075 0.35 0.025 7.43 0.05 5.69 0.05 0.75 0.05 1.090 0.075 1.345 0.075 Sample Size Average Measurement 0.922 0.220 0.697 0.349 7.416 5.666 0.747 41.08 1.074 1.326 Standard Deviation 0.020 0.011 0.007 0.012 0.016 0.010 0.009 0.014 0.020
Ball Corner
Bottom View Bump Side
Table Process Monitor
Process Lead Bond Attach Ball Attach Marking Test Item Initial Bond Pull Inspection Ball Shear Permanency Criteria min. 7.0g Bubble min. 200g defects Reject/ Accept 0/2280 0/240 0/250 0/10 Average Measurement 14.16 Pass 366.14 Pass Standard Deviation 1.24 51.15
7.13
Bend/Push Test Data
This test designed evaluate solder joint reliability µBGA unit after mounted board subjected bending stresses. board pushed down times opposite sides close proximity unit. board turned-over stress repeated times again. This considered cycle. unit electrically tested opens after each cycle. test continued total 25,000 cycles. Table Bend/Push Test
Deflection (Open/Shorts Test) Cycles Cycles Cycles Cycles
7.14
Twist Test
purpose this test determine package integrity after repeated bends. unit mounted coupon that 1.5"and mils thick. Each group boards twisted 100,000 times either then electrically tested opens. Table Twist Test
100,000 Twists Degrees Degrees

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