POST OFFICE 655303 DALLAS, TEXAS 75265 SN5474, SN54LS74A, SN

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POST OFFICE 655303 DALLAS, TEXAS 75265 SN5474, SN54LS74A, SN

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SN5474, SN54LS74A, SN54S74 SN7474. SN74LS74A, SN74S74 DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET CLEAR
POST OFFICE 655303
DALLAS, TEXAS 75265
SN5474, SN54LS74A, SN54S74 SN7474. SN74LS74A, SN74S74 DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET CLEAR
POST OFFICE 655303
DALLAS, TEXAS 75265
SN5474, SN54LS74A, SN54S74 SN7474. SN74LS74A, SN74S74 DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET CLEAR
POST OFFICE 655303
DALLAS, TEXAS 75265
SN5474, SN54LS74A, SN54S74 SN7474. SN74LS74A, SN74S74 DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET CLEAR
POST OFFICE 655303
DALLAS, TEXAS 75265
SN5474, SN54LS74A, SN54S74 SN7474. SN74LS74A, SN74S74 DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET CLEAR
POST OFFICE 655303
DALLAS, TEXAS 75265
SN5474, SN54LS74A, SN54S74 SN7474. SN74LS74A, SN74S74 DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET CLEAR
POST OFFICE 655303
DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
30-May-2005
PACKAGING INFORMATION
Orderable Device JM38510/00205BCA JM38510/00205BDA JM38510/00205BDA JM38510/07101BCA JM38510/07101BCA JM38510/07101BDA JM38510/07101BDA JM38510/30102B2A JM38510/30102B2A JM38510/30102BCA JM38510/30102BCA JM38510/30102BDA JM38510/30102BDA JM38510/30102SCA JM38510/30102SCA JM38510/30102SDA JM38510/30102SDA SN5474J SN5474J SN54LS74AJ SN54LS74AJ SN54S74J SN54S74J SN7474DR SN7474DR SN7474N SN7474N SN7474N3 SN7474N3 SN74LS74AD SN74LS74AD SN74LS74ADBR SN74LS74ADBR SN74LS74ADBRE4 SN74LS74ADBRE4 SN74LS74ADE4 SN74LS74ADE4 Status OBSOLETE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE OBSOLETE OBSOLETE OBSOLETE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type CDIP CDIP CDIP LCCC LCCC CDIP CDIP CDIP CDIP CDIP CDIP CDIP CDIP CDIP CDIP SOIC SOIC PDIP PDIP PDIP PDIP SOIC SOIC SSOP SSOP SSOP SSOP SOIC SOIC Package Drawing Pins Package Plan 2000 2000 2000 2000 Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free Lead/Ball Finish Call Call Call Call Call Call Call Call Call Call Call Call Call Call Call Call Call Call Call Call Call Call Call Call Call Call Call Call Call NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU Peak Temp Call Call Call Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Call Call Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Call Call Call Call Call Call Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/
Addendum-Page
PACKAGE OPTION ADDENDUM
www.ti.com
30-May-2005
Orderable Device
Status
Package Type SOIC SOIC SOIC SOIC CDIP CDIP PDIP PDIP PDIP PDIP SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC PDIP PDIP PDIP PDIP
Package Drawing
Pins Package Plan (RoHS) 2000 2000 2000 2000 2500 2500 2500 2500 Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS)
Lead/Ball Finish
Peak Temp Level-1-235C-UNLIM
SN74LS74ADR SN74LS74ADR SN74LS74ADRE4 SN74LS74ADRE4 SN74LS74AJ SN74LS74AJ SN74LS74AN SN74LS74AN SN74LS74AN3 SN74LS74AN3 SN74LS74ANSR SN74LS74ANSR SN74LS74ANSRG4 SN74LS74ANSRG4 SN74S74D SN74S74D SN74S74DE4 SN74S74DE4 SN74S74DR SN74S74DR SN74S74DRE4 SN74S74DRE4 SN74S74N SN74S74N SN74S74N3 SN74S74N3 SN74S74NSR SN74S74NSR
ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE
NIPDAU NIPDAU NIPDAU NIPDAU Call Call NIPDAU NIPDAU Call Call NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU Call Call NIPDAU NIPDAU
Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Call Call Level-NC-NC-NC Level-NC-NC-NC Call Call Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-NC-NC-NC Level-NC-NC-NC Call Call Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/
2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2500 2500 2500 2500 Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free
Addendum-Page
PACKAGE OPTION ADDENDUM
www.ti.com
30-May-2005
Orderable Device
Status
Package Type CDIP CDIP LCCC LCCC CDIP CDIP LCCC LCCC CDIP CDIP
Package Drawing
Pins Package Plan (RoHS) 2000 2000 Pb-Free (RoHS) Pb-Free (RoHS)
Lead/Ball Finish
Peak Temp Level-1-235C-UNLIM
SN74S74NSRE4 SN74S74NSRE4 SNJ5474J SNJ5474J SNJ5474W SNJ5474W SNJ54LS74AFK SNJ54LS74AFK SNJ54LS74AJ SNJ54LS74AJ SNJ54LS74AW SNJ54LS74AW SNJ54S74FK SNJ54S74FK SNJ54S74J SNJ54S74J SNJ54S74W SNJ54S74W
ACTIVE ACTIVE OBSOLETE OBSOLETE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
NIPDAU NIPDAU Call Call Call Call Call Call Call Call Call Call Call Call Call Call Call Call
Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Call Call Call Call Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC
marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device.
Plan planned eco-friendly classification: Pb-Free (RoHS) Green (RoHS Sb/Br) please check latest availability information additional product content details. TBD: Pb-Free/Green conversion plan been defined. Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Green (RoHS Sb/Br): defines "Green" mean Pb-Free (RoHS compatible), free Bromine (Br) Antimony (Sb) based flame retardants exceed 0.1% weight homogeneous material)
MSL, Peak Temp. Moisture Sensitivity Level rating according JEDEC industry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold Customer annual basis.
Addendum-Page
MECHANICAL DATA
MLCC006B OCTOBER 1996
(S-CQCC-N**)
TERMINAL SHOWN
LEADLESS CERAMIC CHIP CARRIER
TERMINALS
0.342 (8,69) 0.442 (11,23) 0.640 (16,26) 0.739 (18,78) 0.938 (23,83) 1.141 (28,99) 0.358 (9,09) 0.458 (11,63) 0.660 (16,76) 0.761 (19,32) 0.962 (24,43) 1.165 (29,59) 0.307 (7,80) 0.406 (10,31) 0.495 (12,58) 0.495 (12,58) 0.850 (21,6) 1.047 (26,6)
0.358 (9,09) 0.458 (11,63) 0.560 (14,22) 0.560 (14,22) 0.858 (21,8) 1.063 (27,0)
0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25)
0.020 (0,51) 0.010 (0,25)
0.055 (1,40) 0.045 (1,14)
0.045 (1,14) 0.035 (0,89)
0.028 (0,71) 0.022 (0,54) 0.050 (1,27)
0.045 (1,14) 0.035 (0,89)
4040140 10/96 NOTES: linear dimensions inches (millimeters). This drawing subject change without notice. This package hermetically sealed with metal lid. terminals gold plated. Falls within JEDEC MS-004
POST OFFICE 655303
DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E JANUARY 1995 REVISED DECEMBER 2001
(R-PDSO-G**)
PINS SHOWN 0,65 0,38 0,22 0,15
PLASTIC SMALL-OUTLINE
0,25 0,09 5,60 5,00 8,20 7,40
Gage Plane 0,25 0,95 0,55
Seating Plane 2,00 0,05 0,10
PINS
6,50
6,50
7,50
8,50
10,50
10,50
12,90
5,90
5,90
6,90
7,90
9,90
9,90
12,30 4040065 12/01
NOTES:
linear dimensions millimeters. This drawing subject change without notice. Body dimensions include mold flash protrusion exceed 0,15. Falls within JEDEC MO-150
POST OFFICE 655303
DALLAS, TEXAS 75265
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POST OFFICE 655303 DALLAS, TEXAS 75265 SN5474, SN54LS74A, SN

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